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45 条记录 (耗时 0.035 秒)

    Enhanced subscriber line interface circuit
    1.
    发明授权
    Enhanced subscriber line interface circuit 失效
    增强的用户线接口电路

    公开(公告)号：US5323460A

    公开(公告)日：1994-06-21

    申请号：US817709

    申请日：1992-01-07

    申请人： Michael Warner ,  Lalit O. Patel ,  Absar Naseer

    发明人： Michael Warner ,  Lalit O. Patel ,  Absar Naseer

    IPC分类号： H04M3/00 ,  H04M3/18 ,  H04M19/00

    CPC分类号： H04M3/18 ,  H04M19/005 ,  H04M3/005

    摘要： An enhanced subscriber line interface circuit for a digital switching system which includes a line configuration and protection circuit connection tot he subscriber line and to a thick-film hybrid module. The thick-film hybrid module comprises a high voltage interface circuit and a PCM conversion circuit. The high voltage interface circuit provides power to the subscriber line, converts received analog voice signals transmitted from the subscriber instrument into differential voltage voice signals and detects the subscriber lines status. The PCM conversion circuit is connected to the high voltage interface circuit and is disposed to convert received differential voice signals into PCM digital signals. A line control interface circuit receives control signals from a peripheral processor of the digital switching system, controls the operation of the circuits of the thick-film hybrid module, and receives subscriber line information from the high voltage interface circuit which it passes on to the peripheral processor. A time slot assignment circuit connected to the peripheral processor is arranged to develop and transmit to the PCM conversion circuit time slot assignment information and to connect the PCM digital signals from the enhanced subscriber line interface circuit to the digital switching system.

    摘要翻译： 一种用于数字交换系统的增强型用户线接口电路，其包括用户线路的线路配置和保护电路连接以及厚膜混合模块。 厚膜混合模块包括高压接口电路和PCM转换电路。 高压接口电路为用户线路提供电力，将从用户仪器发送的接收的模拟语音信号转换为差分电压语音信号，并检测用户线状态。 PCM转换电路连接到高压接口电路，并将其接收的差分语音信号转换为PCM数字信号。 线路控制接口电路接收来自数字交换系统的外围处理器的控制信号，控制厚膜混合模块的电路的操作，并从高压接口电路接收用户线路信息，该高电压接口电路传递给外围设备 处理器。 连接到外围处理器的时隙分配电路被布置成开发并发送到PCM转换电路时隙分配信息，并将来自增强用户线接口电路的PCM数字信号连接到数字交换系统。

    Hybrid balance and combination codec filter circuit
    2.
    发明授权
    Hybrid balance and combination codec filter circuit 失效
    混合平衡和组合编解码滤波电路

    公开(公告)号：US5253291A

    公开(公告)日：1993-10-12

    申请号：US599533

    申请日：1990-10-18

    申请人： Absar Naseer ,  Michael Warner ,  Lalit O. Patel

    发明人： Absar Naseer ,  Michael Warner ,  Lalit O. Patel

    IPC分类号： H04B1/58 ,  H04M3/00 ,  H04B3/20

    CPC分类号： H04B1/586 ,  H04M3/005

    摘要： A hybrid balance and combination codec filter circuit used in a subscriber line interface circuit over which a connection is established between a digital switching network and a subscriber instrument. The hybrid balance and combination codec filter circuit in combination includes a transmit section that converts differential voltage audio signals representing voice transmissions transmitted from the subscriber instrument into Pulse Code Modulated (PCM) encoded digital data, for transmission to the digital switching network. A receive section converts PCM encoded digital data representing voice signals switched through the digital switching network into differential voltage audio signals for transmission to the subscriber instrument. An included hybrid balance and echo cancellation section connected between the transmit section and the receive section reshapes the audio band signals output by the receive section. The reshaped audio band signals are applied to the transmit section, where they cancel any reflected audio band signals not completely transferred to the terminating impedance. Finally, an impedance section provides an audio band feedback signal between the transmit section and the receive section for synthesizing a source impedance that is matched to the impedance of the tip and ring leads of the subscriber loop.

    摘要翻译： 用于用户线接口电路的混合平衡和组合编解码滤波器电路，在数字交换网络和订户仪器之间建立连接。 混合平衡和组合编解码滤波器电路组合包括发送部分，其将表示从用户工具发送的语音传输的差分电压音频信号转换为脉冲编码调制（PCM）编码数字数据，以传输到数字交换网络。 接收部分将表示通过数字交换网络切换的语音信号的PCM编码的数字数据转换成差分电压音频信号，以传输到订户仪器。 连接在发送部分和接收部分之间的包括的混合平衡和回波消除部分重新形成由接收部分输出的音频信号。 重新形成的音频信号被施加到发射部分，在那里它们取消未完全传送到终端阻抗的反射音频信号。 最后，阻抗部分在发射部分和接收部分之间提供音频带反馈信号，用于合成与用户环路的尖端和环形引线的阻抗匹配的源阻抗。

    Enhanced high voltage line interface circuit
    3.
    发明授权
    Enhanced high voltage line interface circuit 失效
    增强型高压线路接口电路

    公开(公告)号：US5175764A

    公开(公告)日：1992-12-29

    申请号：US599537

    申请日：1990-10-18

    申请人： Lalit O. Patel ,  Michael Warner ,  Absar Naseer

    发明人： Lalit O. Patel ,  Michael Warner ,  Absar Naseer

    IPC分类号： H04M19/00 ,  H04Q11/04

    CPC分类号： H04M19/005 ,  H04Q11/04

    摘要： An enhanced high voltage line interface circuit for a digital switching system over which a connection is established between a digital switching system and a subscriber instrument via a subscriber loop. The high voltage line interface circuit includes in combination circuits that provide power to the subscriber loop and convert received analog voice signals transmitted from the subscriber instrument into differential voltage voice signals for subsequent conversion to digital data for use by the digital switching system. Additionally, differential voltage voice signals from the digital switching system are converted to analog voice signals for transmission along the subscriber loop to the subscriber instrument. The high voltage line interface circuit further includes circuits that detect and monitor the subscriber loop status and develop digital logic output signals that are used to report the status of the loop to a digital switching system controller.

    摘要翻译： 一种用于数字交换系统的增强型高压线路接口电路，通过该数字交换系统，经由用户环路在数字交换系统和订户工具之间建立连接。 高压线路接口电路包括向用户环路提供电力并将从用户仪器发送的接收的模拟语音信号转换为差分电压语音信号的组合电路，用于后续转换为数字数据供数字交换系统使用。 此外，来自数字交换系统的差分电压语音信号被转换为模拟语音信号，以沿着用户环路向用户仪器传输。 高电压线路接口电路还包括检测和监视用户环路状态并且开发数字逻辑输出信号的电路，所述数字逻辑输出信号用于将环路的状态报告给数字交换系统控制器。

    Method and System to Manage Caregiver Costs in a Health Care Facility
    4.
    发明申请
    Method and System to Manage Caregiver Costs in a Health Care Facility 审中-公开
    管理保健设施护理人员成本的方法和系统

    公开(公告)号：US20090319292A1

    公开(公告)日：2009-12-24

    申请号：US12143294

    申请日：2008-06-20

    申请人： Michael Warner ,  Kraig McKinley

    发明人： Michael Warner ,  Kraig McKinley

    IPC分类号： G06Q50/00 ,  G06Q10/00

    CPC分类号： G06F19/328 ,  G06Q50/22

    摘要： A method to manage caregiver costs in a health care facility may include allowing selection of a patient or group of patients for analyzing care costs and allowing selection of a set of parameters related to services provided to the patient or group of patients by the health care facility. The method may also include collecting patient data associated with the selected patient or group of patients based on the set of parameters. The method may additionally include determining at least one of patient acuity, location within the health care facility and caregiver attributes for the selected patient or group of patients based on the patient data and determining care costs based on at least one of the patient acuity, location, and caregiver attributes for the patient or group of patients. The method may further include presenting a care costs report to a user to manage costs within the health care facility.

    摘要翻译： 在保健设施中管理护理者成本的方法可以包括允许选择患者或患者组以分析护理成本并且允许选择与医疗保健设施提供给患者或患者组的服务有关的一组参数 。 该方法还可以包括基于该组参数收集与所选择的患者或患者组相关联的患者数据。 该方法可以另外包括基于患者数据确定患者敏锐度，医疗保健设施内的位置和所选择的患者或患者组的护理者属性中的至少一个，并且基于患者的敏锐度，位置 ，以及患者或患者组的护理者属性。 该方法还可以包括向用户呈现护理成本报告以管理医疗保健设施内的成本。

    Methods of making microelectronic packages
    10.
    发明授权
    Methods of making microelectronic packages 有权
    制造微电子封装的方法

    公开(公告)号：US06959489B2

    公开(公告)日：2005-11-01

    申请号：US09956448

    申请日：2001-09-19

    申请人： Masud Beroz ,  Michael Warner

    发明人： Masud Beroz ,  Michael Warner

    IPC分类号： H05K13/04 ,  H05K3/34

    CPC分类号： H05K13/046 ,  H01L2224/16225 ,  H01L2924/00014 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2224/0401

    摘要： A method of making a microelectronic package includes providing a substrate having a plurality of conductive leads at a first surface of the substrate. The conductive leads may have first ends permanently attached to the substrate and second ends remote from the terminal ends, the second ends being movable relative to the first ends of the leads. One or more microelectronic elements having contact bearing surfaces and back surfaces remote therefrom may be juxtaposed with the substrate and the contacts connected with the first ends of the leads. A substantially rigid plate may be attached to the back surfaces of the microelectronic elements. The substantially rigid plate may be moved to a precise height above the substrate to vertically extend the leads. While the plate is maintained at the precise height above the substrate, a spacer material is dispensed between the plate and the substrate. The spacer material is then at least partially cured for holding the plate at the precise height above the substrate.

    摘要翻译： 制造微电子封装的方法包括在衬底的第一表面处提供具有多个导电引线的衬底。 导电引线可以具有永久地附着到基板的第一端和远离端子的第二端，第二端可相对于引线的第一端移动。 具有接触轴承表面和远离其的后表面的一个或多个微电子元件可以与衬底并置，并且与引线的第一端连接。 基本上刚性的板可附接到微电子元件的背面。 基本上刚性的板可以移动到衬底上方的精确高度以垂直地延伸引线。 当板保持在衬底上方的精确高度时，间隔材料被分配在板和衬底之间。 然后将间隔物材料至少部分地固化以将板保持在衬底上方的精确高度。