公开(公告)号：US5861661A

公开(公告)日：1999-01-19

申请号：US974454

申请日：1997-11-20

Applicant: Pao-Yun Tang ,  Shyh-Ming Chang ,  Yu-Chi Lee ,  Su-Yu Fang

Inventor： Pao-Yun Tang ,  Shyh-Ming Chang ,  Yu-Chi Lee ,  Su-Yu Fang

IPC: C09J9/02 ,  H01L21/60 ,  H01L21/68 ,  H01L23/495

CPC classification number: H01L21/568 ,  C09J9/02 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14

Abstract: This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention also uses integrated circuit elements having composite bumps as input/output pads. The composite bumps comprise a polymer body covered by a conductive metal coating. The invention provides a low cost method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed. The lower temperature and pressure improve the dimensional stability of the elements of the bonded structure and the automatic encapsulation provides improved reliability.

Abstract translation: 本发明提供一种接合结构和形成用于将引线阵列接合到集成电路元件的导电接合焊盘的接合结构的方法。 本发明使用具有带自动键合的各向异性导电膜来形成结合结构。 本发明还使用具有复合凸块的集成电路元件作为输入/输出焊盘。 复合凸块包括被导电金属涂层覆盖的聚合物体。 本发明提供了一种低成本的带式自动接合方法，其在接合过程中使用较低的温度和压力，并且提供了在接合完成之后自动封装的接合。 较低的温度和压力提高了粘结结构元件的尺寸稳定性，自动封装提高了可靠性。

公开(公告)号：US5431328A

公开(公告)日：1995-07-11

申请号：US239380

申请日：1994-05-06

Applicant: Shyh-Ming Chang ,  Chih-Chiang Chu ,  Yu-Chi Lee

Inventor： Shyh-Ming Chang ,  Chih-Chiang Chu ,  Yu-Chi Lee

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/34

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H05K3/3436 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/0212 ,  H05K3/3431 ,  Y02P70/613

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus, a conductive barrier metal coating covering the polymer body and a soldering metal coating covering the conductive barrier metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little stress tending to break the solder joint after the bonded structure is formed. The bond is formed using a soldering process so that the soldering metal forms a conductive adhesive between the composite bumps and either the substrate input/output pads or the integrated circuit element input/output pads.

Abstract translation: 一种结合结构，其包括使用由低杨氏模量的单一聚合物主体组成的复合凸块的集成电路元件和基板之间的物理和电连接，覆盖聚合物主体的导电阻挡金属涂层和覆盖导电阻挡金属的焊接金属涂层 涂层。 当形成接合结构时，复合凸块变形，并且聚合物主体的低杨氏模量允许具有非常低的结合力的非常可靠的结合结构。 由于低的杨氏模量，在结合结构形成之后，很少有应力打破焊点。 使用焊接工艺形成接合，使得焊接金属在复合凸块与衬底输入/输出焊盘或集成电路元件输入/输出焊盘之间形成导电粘合剂。

公开(公告)号：US08211788B2

公开(公告)日：2012-07-03

申请号：US12486771

申请日：2009-06-18

Applicant: Shyh-Ming Chang ,  Sheng-Shu Yang

Inventor： Shyh-Ming Chang ,  Sheng-Shu Yang

IPC: H01L21/44

CPC classification number: H01L21/563 ,  H01L23/295 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/136 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29287 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of fabricating a bonding structure having compliant bumps includes first providing a first substrate and a second substrate. The first substrate includes first bonding pads. The second substrate is disposed on one side of the first substrate and includes second bonding pads and compliant bumps disposed thereon. The second bonding pads are opposite to the first bonding pads. Next, a non-conductive adhesive layer and ball-shaped spacers are formed between the first and the second substrates. Finally, the first substrate, the non-conductive adhesive layer, and the second substrate are compressed, such that the compliant bumps on the second bonding pads of the second substrate pass through the non-conductive adhesive layer and are electrically connected to the first bonding pads of the first substrate, respectively. The ball-shaped spacers are distributed in the non-conductive adhesive layer sandwiched between the first and the second substrates for maintaining the gap therebetween.

Abstract translation: 制造具有柔顺凸块的接合结构的方法包括首先提供第一基板和第二基板。 第一衬底包括第一接合焊盘。 第二基板设置在第一基板的一侧，并且包括设置在其上的第二接合焊盘和顺应凸块。 第二接合焊盘与第一接合焊盘相对。 接下来，在第一和第二基板之间形成非导电粘合剂层和球形间隔物。 最后，第一基板，非导电粘合剂层和第二基板被压缩，使得第二基板的第二接合焊盘上的顺从凸块穿过非导电粘合剂层，并且电连接到第一接合 第一基板的焊盘。 球形间隔件分布在夹在第一和第二基板之间的非导电粘合剂层中，以保持它们之间的间隙。

公开(公告)号：US07732928B2

公开(公告)日：2010-06-08

申请号：US11516944

申请日：2006-09-06

Applicant: Shyh-Ming Chang ,  Ji-Cheng Lin ,  Shou-Lung Chen

Inventor： Shyh-Ming Chang ,  Ji-Cheng Lin ,  Shou-Lung Chen

IPC: H01L23/02 ,  H01L27/115

CPC classification number: H01L23/5389 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311

Abstract: A structure for protecting electronic package contacts is provided. The structure includes at least an electronic contact mounted on a chip, a dielectric layer, a conductor trace line and a protective layer. The protective layer is used to prevent stresses from being gathered within electronic contacts on the chip through surroundingly covering the conductor trace line.

Abstract translation: 提供了一种用于保护电子封装触点的结构。 该结构至少包括安装在芯片，电介质层，导体迹线和保护层上的电子触点。 保护层用于通过周围覆盖导体迹线来防止应力集中在芯片上的电子触点内。

公开(公告)号：US20090149015A1

公开(公告)日：2009-06-11

申请号：US12368983

申请日：2009-02-10

Applicant: Shyh-Ming Chang

Inventor： Shyh-Ming Chang

IPC: H01L21/768

CPC classification number: H05K3/4007 ,  H01L22/32 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/0361 ,  H01L2224/0391 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/056 ,  H01L2224/11515 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13552 ,  H01L2224/13553 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/2919 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09909 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.

Abstract translation: 接触结构的制造方法包括首先提供其上已经形成有接触垫的基板。 之后，在接触垫上形成聚合物凸块。 接着，在聚合物凸块上形成导电层。 导电层覆盖聚合物凸块并延伸到聚合物凸块的外部。 延伸到聚合物凸块外部的导电层的部分用作测试垫。

公开(公告)号：US20080284011A1

公开(公告)日：2008-11-20

申请号：US11834696

申请日：2007-08-07

Applicant: Shyh-Ming Chang ,  Ngai Tsang ,  Kuo-Shu Kao

Inventor： Shyh-Ming Chang ,  Ngai Tsang ,  Kuo-Shu Kao

IPC: H01L23/48

CPC classification number: H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2201/09909 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A bump structure including at least one contact pad, at least one first polymer bump, at least one second polymer bump, and a conductive layer is provided. The contact pad is disposed on a substrate, and the first polymer bump is also disposed on the substrate. The second polymer bump is disposed on the substrate and is connected to the first polymer bump. The conductive layer covers the first polymer bump and electrically connects the contact pad.

Abstract translation: 提供包括至少一个接触垫，至少一个第一聚合物凸块，至少一个第二聚合物凸块和导电层的凸块结构。 接触垫设置在基板上，并且第一聚合物凸块也设置在基板上。 第二聚合物凸块设置在基板上并连接到第一聚合物凸块。 导电层覆盖第一聚合物凸块并且电连接接触垫。

公开(公告)号：US20080237850A1

公开(公告)日：2008-10-02

申请号：US11868948

申请日：2007-10-08

Applicant: Shyh-Ming Chang

Inventor： Shyh-Ming Chang

IPC: H01L23/48 ,  H01L21/00

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A compliant bump structure includes a substrate, at least a first polymer bump, at least a second polymer bump and at least a conductive layer. The substrate has at least a pad on a surface thereof. The first polymer bump is disposed on the pad. The second polymer bump is disposed on the surface of the substrate outside the pad. The conductive layer is disposed on the first and second polymer bumps.

Abstract translation: 柔性突起结构包括基底，至少第一聚合物凸块，至少第二聚合物凸块和至少导电层。 衬底在其表面上至少具有焊盘。 第一聚合物凸块设置在垫上。 第二聚合物凸块设置在衬垫外表面上。 导电层设置在第一和第二聚合物凸块上。

公开(公告)号：US20080197352A1

公开(公告)日：2008-08-21

申请号：US11758013

申请日：2007-06-05

Applicant: Ming-Yao Chen ,  Sheng-Shu Yang ,  Shyh-Ming Chang ,  Ngai Tsang

Inventor： Ming-Yao Chen ,  Sheng-Shu Yang ,  Shyh-Ming Chang ,  Ngai Tsang

IPC: H01L23/58

CPC classification number: H01L23/49816 ,  H01L22/12 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/10135 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.

Abstract translation: 提供了包括至少一个第一电极，至少一个第一凸块，至少一个第二凸块的衬底上的凸块结构。 第一电极设置在基板上。 第一凸块设置在第一电极上。 第二凸块设置在基板上。 第二凸块的高度大于第一凸块的高度。 本发明的弹性凸块可用于测量接合工艺质量。

公开(公告)号：US07378746B2

公开(公告)日：2008-05-27

申请号：US11308180

申请日：2006-03-10

Applicant: Ji-Cheng Lin ,  Yao-Sheng Lin ,  Shyh-Ming Chang ,  Su-Tsai Lu ,  Hsien-Chie Cheng ,  Tai-Hong Chen

Inventor： Ji-Cheng Lin ,  Yao-Sheng Lin ,  Shyh-Ming Chang ,  Su-Tsai Lu ,  Hsien-Chie Cheng ,  Tai-Hong Chen

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/10 ,  H01L23/49811 ,  H01L24/13 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A composite bump suitable for disposing on a substrate pad is provided. The composite bump includes a compliant body and an outer conductive layer. The coefficient of thermal expansion (CTE) of the compliant body is between 5 ppm/° C. and 200 ppm/° C. The outer conductive layer covers the compliant body and is electrically connected to the pad. The compliant body can provide a stress buffering effect for a bonding operation. Furthermore, by setting of the CTE of the compliant body within a preferable range, damages caused by thermal stress are reduced while the bonding effect is enhanced.

Abstract translation: 提供了适合于设置在基板焊盘上的复合凸块。 复合凸块包括柔性本体和外导电层。 柔性体的热膨胀系数（CTE）在5ppm /℃和200ppm /℃之间。外部导电层覆盖柔性体并与衬垫电连接。 柔性体可以为粘接操作提供应力缓冲效果。 此外，通过将柔性体的CTE设定在优选范围内，由于热应力引起的损伤降低，同时结合效果增强。

公开(公告)号：US20080023832A1

公开(公告)日：2008-01-31

申请号：US11762729

申请日：2007-06-13

Applicant: Shyh-Ming Chang

Inventor： Shyh-Ming Chang

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H05K3/4007 ,  H01L22/32 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/0361 ,  H01L2224/0391 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/056 ,  H01L2224/11515 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13552 ,  H01L2224/13553 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/2919 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09909 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A contact structure including a contact pad, a polymer bump and a conductive layer is provided in the present invention. The contact pad is disposed on a substrate. The polymer bump is disposed on the contact pad. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad. The invention further discloses a manufacturing method of a contact structure. First, a substrate is provided having a contact pad already formed thereon. Then, a polymer bump is formed on the contact pad and a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.

Abstract translation: 在本发明中提供了包括接触垫，聚合物凸块和导电层的接触结构。 接触垫设置在基板上。 聚合物凸块设置在接触垫上。 导电层覆盖聚合物凸块并延伸到聚合物凸块的外部。 延伸到聚合物凸块外部的导电层的部分用作测试垫。 本发明还公开了一种接触结构的制造方法。 首先，提供具有已在其上形成的接触垫的基板。 然后，在接触焊盘上形成聚合物凸块，并且在聚合物凸块上形成导电层。 导电层覆盖聚合物凸块并延伸到聚合物凸块的外部。 延伸到聚合物凸块外部的导电层的部分用作测试垫。