公开(公告)号：US10833394B2

公开(公告)日：2020-11-10

申请号：US16535022

申请日：2019-08-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Jung Tsai ,  Mao-Hua Yeh ,  Chih-Hsien Chiu ,  Ying-Chou Tsai ,  Chun-Chi Ke

IPC: H01L23/00 ,  H01Q1/22 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01L23/538 ,  H01L21/77

Abstract: An electronic package and a method for fabricating the same are provided. An antenna frame, a first electronic component, and a second electronic component electrically connected to the antenna frame are disposed on a lower side of a carrying structure. An antenna structure is disposed on an upper side of the carrying structure and is electrically connected to the first electronic component. Therefore, two different types of antennas are integrated into an identical electronic package. Such the electronic package bonded to a circuit can transmit signals with two different wavelengths, even if the electronic package does not have any area increased.

公开(公告)号：US20200251395A1

公开(公告)日：2020-08-06

申请号：US16460766

申请日：2019-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Chiang He ,  Yu-Wei Yeh ,  Chia-Yang Chen ,  Chih-Yi Liao ,  Chih-Hsien Chiu ,  Chang-Chao Su

IPC: H01L23/31 ,  H01L23/498

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulating layer encapsulates the electronic component and the conductive elements. The encapsulating layer is formed with recessed portions corresponding in position to the conductive elements. A gap is formed between the conductive elements and the recessed portions.

公开(公告)号：US20200161756A1

公开(公告)日：2020-05-21

申请号：US16750459

申请日：2020-01-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01Q1/52 ,  H01Q1/48 ,  H01Q1/22 ,  H01L23/66 ,  H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01Q1/24 ,  H01Q9/42

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US10573623B2

公开(公告)日：2020-02-25

申请号：US15352822

申请日：2016-11-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu

IPC: H01L25/065 ,  H01L25/16 ,  H01L25/10 ,  H01L25/03 ,  H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic package structure is provided, which includes: a first carrier having an opening; at least a first electronic component and a plurality of conductive elements disposed on the first carrier; a second carrier bonded to the conductive elements; at least a second electronic component disposed on the second carrier and received in the opening of the first carrier; and an encapsulant formed on the first carrier and the second carrier and encapsulating the first electronic component, the second electronic component and the conductive elements. By receiving the second electronic component in the opening of the first carrier, the present disclosure reduces the height of the electronic package structure. The present disclosure further provides a method for fabricating the electronic package structure.

公开(公告)号：US20190214352A1

公开(公告)日：2019-07-11

申请号：US16028798

申请日：2018-07-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ming-Fan Tsai ,  Chih-Hsien Chiu ,  Tsung-Hsien Tsai ,  Chao-Ya Yang ,  Chia-Yang Chen

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L23/04 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52

Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.

公开(公告)号：US10062582B2

公开(公告)日：2018-08-28

申请号：US14817624

申请日：2015-08-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tsung-Hsien Tsai ,  Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Chien-Cheng Lin

IPC: H01L21/60 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L21/4853 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/19 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.

公开(公告)号：US09999132B2

公开(公告)日：2018-06-12

申请号：US15163045

申请日：2016-05-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H05K1/18 ,  G06K19/077 ,  H01L25/00 ,  H05K1/16 ,  H05K3/00 ,  H05K3/10 ,  H05K3/20 ,  H05K3/46

CPC classification number: H05K1/185 ,  G06K19/07777 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/1815 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/207 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09118 ,  H05K2201/10098 ,  H05K2203/1327 ,  H01L2924/00014

Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.

公开(公告)号：US20170201023A1

公开(公告)日：2017-07-13

申请号：US15083421

申请日：2016-03-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H01Q9/04 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/24 ,  H01Q1/48

CPC classification number: H01L23/49838 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01Q1/243 ,  H01Q9/065 ,  H01Q19/104 ,  H01Q23/00

Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.

公开(公告)号：US20170103953A1

公开(公告)日：2017-04-13

申请号：US15298480

申请日：2016-10-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L23/552 ,  H01L21/48 ,  H01L25/065 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

公开(公告)号：US20160027740A1

公开(公告)日：2016-01-28

申请号：US14463999

申请日：2014-08-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Cho-Hsin Chang ,  Chia-Yang Chen ,  Chao-Ya Yang

IPC: H01L23/552 ,  H01L21/78 ,  H01L21/50 ,  H01L23/28

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

Abstract translation: 封装结构包括载体，布置在载体上的电子部件，形成在载体上用于封装电子部件的密封剂，形成在密封剂上的第一屏蔽层和形成在第一屏蔽层上的第二屏蔽层。 第一和第二屏蔽层由不同的材料制成。 通过形成在封装层上的多个屏蔽层，电子部件被保护免受电磁干扰。 本发明还提供一种制造封装结构的方法。