公开(公告)号：US08513761B2

公开(公告)日：2013-08-20

申请号：US12697964

申请日：2010-02-01

申请人： François Roy ,  Pierrick Descure

发明人： François Roy ,  Pierrick Descure

IPC分类号： H01L31/102

CPC分类号： H01L27/1463 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14679 ,  H01L27/14689 ,  H01L31/112

摘要： A backside illumination semiconductor image sensor, wherein each photodetection cell includes a semiconductor body of a first conductivity type of a first doping level delimited by an insulation wall, electron-hole pairs being capable in said body after a backside illumination; on the front surface side of said body, a ring-shaped well of the second conductivity type, this well delimiting a substantially central region having its upper portion of the first conductivity type of a second doping level greater than the first doping level; and means for controlling the transfer of charge carriers from said body to said upper portion.

摘要翻译： 一种背面照明半导体图像传感器，其中每个光电检测单元包括由绝缘壁限定的第一掺杂级别的第一导电类型的半导体本体，在背面照明之后能够在所述主体中的电子 - 空穴对; 在所述主体的前表面侧上具有第二导电类型的环状阱，该阱限定基本上中心的区域，其具有大于第一掺杂水平的第一导电类型的第二掺杂水平的上部; 以及用于控制电荷载体从所述本体转移到所述上部的装置。

公开(公告)号：US08477680B2

公开(公告)日：2013-07-02

申请号：US13108623

申请日：2011-05-16

申请人： Jacques Meyer

发明人： Jacques Meyer

IPC分类号： H04B7/185 ,  H04B7/204

CPC分类号： H04B7/18526

摘要： Processing method for modulated data transmitted in the form of multiplexed frames (Frame 1, . . . Frame 10) containing symbols that have a symbol frequency. The method comprises a frame selection processing operation performed at least partly at a working frequency below the symbol frequency, and a demodulation processing operation comprising at least a part performed at the working frequency on the selected frames.

摘要翻译： 以包含具有符号频率的符号的多路复用帧（帧1，...，帧10）的形式发送的调制数据的处理方法。 该方法包括至少部分地在符号频率以下的工作频率下执行的帧选择处理操作，以及包括在所选择的帧上以工作频率执行的至少一部分的解调处理操作。

公开(公告)号：US08458427B2

公开(公告)日：2013-06-04

申请号：US13022099

申请日：2011-02-07

申请人： Giuseppe Guarnaccia ,  Raffaele Guarrasi ,  Radhia Kacem

发明人： Giuseppe Guarnaccia ,  Raffaele Guarrasi ,  Radhia Kacem

IPC分类号： G06F12/00

CPC分类号： G06F13/4059 ,  Y02D10/14 ,  Y02D10/151

摘要： A synchronization system includes a memory and a control circuit. The control circuit includes a write interface for writing data in said memory with a first clock signal, wherein the write interface is configured for operating with a write pointer in response to a write command, a read interface for reading data from said memory with a second clock signal, wherein the read interface is configured for operating with a read pointer in response to a read command, a synchronization circuit for synchronizing said write pointer and said read pointer with a synchronization latency, and an elaboration circuit for elaborating data in memory with an elaboration latency, wherein the elaboration latency is smaller than the synchronization latency.

摘要翻译： 同步系统包括存储器和控制电路。 所述控制电路包括用于以第一时钟信号在所述存储器中写入数据的写入接口，其中所述写入接口被配置为响应写入命令与写入指针一起操作;读取接口，用于以第二时钟信号从所述存储器读取数据 时钟信号，其中所述读取接口被配置为响应于读取命令而与读取指针一起操作，用于使所述写入指针和所述读取指针与同步等待时间同步的同步电路，以及用于在存储器中用 精细延迟，其中精细延迟小于同步等待时间。

公开(公告)号：US20120266452A1

公开(公告)日：2012-10-25

申请号：US13541468

申请日：2012-07-03

申请人： Olivier Le Neel ,  Pascale Dumont-Girard ,  Chengyu Niu ,  Fuchao Wang ,  Michel Arnoux

发明人： Olivier Le Neel ,  Pascale Dumont-Girard ,  Chengyu Niu ,  Fuchao Wang ,  Michel Arnoux

IPC分类号： H01C17/02

CPC分类号： H01C17/265 ,  H01L23/345 ,  H01L23/5228 ,  H01L27/016 ,  H01L27/0688 ,  H01L28/20 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49087 ,  H01L2924/00

摘要： A trimmable resistor for use in an integrated circuit is trimmed using a heater. The heater is selectively coupled to a voltage source. The application of voltage to the heater causes the heater temperature to increase and produce heat. The heat permeates through a thermal separator to the trimmable resistor. The resistance of the trimmable resistor is permanently increased or decreased when the temperature of the resistor is increased to a value within a particular range of temperatures.

摘要翻译： 用于集成电路的微调电阻器使用加热器进行修整。 加热器选择性地耦合到电压源。 对加热器施加电压导致加热器温度升高并产生热量。 热量通过热分离器渗透到可调节电阻器。 当电阻器的温度增加到特定温度范围内的值时，可调整电阻器的电阻永久地增加或减小。

公开(公告)号：US08232113B2

公开(公告)日：2012-07-31

申请号：US12990684

申请日：2009-05-20

申请人： Romain Coffy

发明人： Romain Coffy

IPC分类号： G01R31/26

CPC分类号： G01R31/2884 ,  G01R1/0408 ,  G01R31/2822 ,  H01L22/32 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L2224/03 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/11 ,  H01L2924/00

摘要： A method for manufacturing and for testing an integrated circuit, including the steps of forming, on the upper portion of the integrated circuit, a passivation layer including openings at the level of metal tracks of the last interconnect stack of the integrated circuit; forming, in the openings, first pads connected to second pads formed on the passivation layer by conductive track sections, the first pads being intended for the connection of the integrated circuit; testing the integrated circuit by bringing test tips in contact with the second pads; and eliminating at least a portion of at least one of the conductive track sections.

摘要翻译： 一种用于制造和测试集成电路的方法，包括以下步骤：在所述集成电路的上部形成钝化层，所述钝化层包括在所述集成电路的最后互连叠层的金属轨道的水平面处的开口; 在开口中形成通过导电轨道部分连接到形成在钝化层上的第二焊盘的第一焊盘，第一焊盘用于连接集成电路; 通过将测试头与第二个焊盘接触来测试集成电路; 以及消除所述导电轨道部分中的至少一个的至少一部分。

公开(公告)号：US08222841B2

公开(公告)日：2012-07-17

申请号：US12254641

申请日：2008-10-20

申请人： Tarek Lule

发明人： Tarek Lule

IPC分类号： H02P1/00

CPC分类号： H02K41/0356 ,  H02P25/034

摘要： A method of controlling a moving part of a voice coil motor to move from an first position to a second position, wherein the position of the moving part is controlled by the level of an electrical signal applied to a coil of the voice coil motor, a first level of the electrical signal corresponding to the first position, and a second level of the electrical signal corresponding to the second position, the method including: at a first time, changing the electrical signal from the first level to an intermediate level, the intermediate level being chosen such that a peak overshoot of the moving part corresponds to the second position; and at a second time calculated to correspond to a delay of half an oscillation period of the moving part after the first time, changing the electrical signal to the second level.

摘要翻译： 一种控制音圈电机的移动部分从第一位置移动到第二位置的方法，其中，移动部件的位置由施加到音圈电机的线圈的电信号的电平来控制， 对应于第一位置的电信号的第一电平和对应于第二位置的电信号的第二电平，该方法包括：在第一时间将电信号从第一电平改变到中间电平，中间 水平被选择为使得移动部件的峰值过冲对应于第二位置; 并且在第二时间被计算为对应于在第一次之后的移动部件的半个振荡周期的延迟，将电信号改变为第二电平。

公开(公告)号：US08148258B2

公开(公告)日：2012-04-03

申请号：US12673975

申请日：2008-06-27

申请人： Romain Coffy ,  Jacky Seiller ,  Gil Provent

发明人： Romain Coffy ,  Jacky Seiller ,  Gil Provent

IPC分类号： H01L21/44

CPC分类号： H05K3/3473 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/12036 ,  H05K2203/043 ,  H05K2203/0574 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A method for fabricating electrical bonding pads on the electrical contact areas of a wafer includes producing first blocks made of a solder material, producing second blocks made of a solder material on these first blocks, and passing the blocks through an oven so as to shape the blocks into approximately domed electrical bonding pads.

摘要翻译： 用于在晶片的电接触区域上制造电接合焊盘的方法包括制造由焊料材料制成的第一块，在这些第一块上产生由焊料材料制成的第二块，并使块通过炉， 嵌入大致圆顶的电焊盘。

公开(公告)号：US20120025348A1

公开(公告)日：2012-02-02

申请号：US13179640

申请日：2011-07-11

申请人： Laurent Marechal ,  Yvon Imbs ,  Romain Coffy

发明人： Laurent Marechal ,  Yvon Imbs ,  Romain Coffy

IPC分类号： H01L23/28 ,  H01L29/92 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/5383 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/18 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19105 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10674 ,  H05K2203/1469 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor device includes a wafer having a frontside and a backside. The wafer is formed from at least one integrated circuit chip having an electrical connection frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. A passive component including at least one conductive plate and a dielectric plate is positioned adjacent the integrated circuit chip. An encapsulation block embeds the integrated circuit chip and the passive component, the block having a frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. An electrical connection is made between the electrical connection frontside and the passive component. That electrical connection includes connection lines placed on the wafer frontside and wafer backside. The electrical connection further includes at least one via passing through the encapsulation block.

摘要翻译： 半导体器件包括具有前侧和后侧的晶片。 晶片由至少一个集成电路芯片形成，该集成电路芯片具有与晶片前侧共面的电连接，以及与晶片背面共面的背面。 包括至少一个导电板和电介质板的无源部件位于集成电路芯片附近。 封装块嵌入集成电路芯片和无源部件，该块具有与晶片前侧共面的前侧和与晶片背面共面的背面。 在电连接前端和被动部件之间进行电连接。 该电连接包括放置在晶片正面和晶片背面上的连接线。 电连接还包括至少一个通过封装块的通孔。

公开(公告)号：US20110248397A1

公开(公告)日：2011-10-13

申请号：US13130169

申请日：2009-11-10

申请人： Romain Coffy ,  Remi Brechignac ,  Carlo Cognetti De Martiis

发明人： Romain Coffy ,  Remi Brechignac ,  Carlo Cognetti De Martiis

IPC分类号： H01L25/065 ,  H01L21/98 ,  H01L23/538

CPC分类号： H01L25/50 ,  H01L21/565 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2224/0401

摘要： A semiconductor device includes at least one first component (5) (for example, a first integrated circuit), having a front face provided with electrical connection pads. The first component is embedded in a support layer (2) is a position such that the front face of the first component is not covered and lies parallel to a first face of the support layer. An intermediate layer (8) is formed on the front face of the first component and on the first face of the support layer. An electrical connection network (9) within the intermediate layer selectively connects to the electrical connection pads of the first component. The device further includes at least one second component (11) (for example, a second integrate circuit, having one face placed above the intermediate layer and provided with electrical connection pads selectively connected to the electrical connection network. Electrical connection vias (17) pass through the support layer and selectively connect the electrical connection network to an external electrical connection formed on a second face of the support layer.

摘要翻译： 半导体器件包括至少一个第一部件（5）（例如，第一集成电路），其具有设置有电连接焊盘的正面。 第一部件嵌入在支撑层（2）中，是使得第一部件的前表面不被覆盖并平行于支撑层的第一面的位置。 在第一部件的正面和支撑层的第一面上形成中间层（8）。 中间层内的电连接网络（9）选择性地连接到第一部件的电连接焊盘。 该装置还包括至少一个第二部件（11）（例如，第二集成电路，其中一个面放置在中间层的上方，并且具有选择性地连接到电连接网络的电连接焊盘）。电连接通孔（17）通过 通过支撑层并且将电连接网络选择性地连接到形成在支撑层的第二面上的外部电连接。

公开(公告)号：US20110134612A1

公开(公告)日：2011-06-09

申请号：US12957761

申请日：2010-12-01

申请人： Julien Vittu

发明人： Julien Vittu

IPC分类号： H05K7/02 ,  H05K13/00

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T29/49002 ,  H01L2224/82 ,  H01L2924/00

摘要： An electronic component package including an electronic component having a circuit surface, a block of resin partially surrounding the electronic component, and a multi-layer interconnection in contact with said circuit surface, wherein the multi-layer interconnection is connected to bond-pads having a pitch lower than 50 μm, and the block of resin is made of injection-molding resin.

摘要翻译： 一种电子部件封装，包括具有电路表面的电子部件，部分地围绕电子部件的树脂块以及与所述电路表面接触的多层互连，其中所述多层互连连接到具有 节距低于50μm，树脂块由注塑树脂制成。