公开(公告)号：US08960526B2

公开(公告)日：2015-02-24

申请号：US10586598

申请日：2005-01-27

申请人： Tadashi Maeda ,  Tadahiko Sakai

发明人： Tadashi Maeda ,  Tadahiko Sakai

IPC分类号： B23K1/20 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  H01L21/683 ,  H01L23/00 ,  H05K3/34

CPC分类号： B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/36 ,  B23K35/3613 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/3489 ,  H05K2201/0215 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00

摘要： There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation.Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1% and 9% by volume based on a volume of the flux.

摘要翻译： 提供焊接助焊剂和焊接工艺，其形成更好的焊接连接，而不会发生不良连接和绝缘劣化。 当将第一电极焊接到第二电极时，放置在形成在第一电极上的焊料部分和第二电极之间的这种焊剂包含：溶解在溶剂中的由树脂成分制成的液体基材，活性成分 除去氧化膜和由熔点高于形成焊料部分的焊料材料的金属制成的金属粉末，并且焊剂含有金属粉末的量在1％至9％的范围内， 基于磁通量的体积。

公开(公告)号：US20150035137A1

公开(公告)日：2015-02-05

申请号：US14378226

申请日：2013-02-14

申请人： MTSUBISHI MATERIALS CORPORATION

发明人： Shuji Nishimoto ,  Kimihito Nishikawa ,  Yoshiyuki Nagatomo

IPC分类号： H01L23/00 ,  B23K1/19 ,  B23K1/20 ,  H01L23/367

CPC分类号： H01L24/33 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0272 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3602 ,  B23K35/3607 ,  H01L23/367 ,  H01L23/3735 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/03505 ,  H01L2224/04026 ,  H01L2224/27505 ,  H01L2224/29005 ,  H01L2224/29083 ,  H01L2224/29111 ,  H01L2224/29239 ,  H01L2224/29286 ,  H01L2224/29299 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83539 ,  H01L2224/83686 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/05432 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/207 ,  H01L2924/05341 ,  H01L2924/05442 ,  H01L2924/053 ,  H01L2924/206

摘要： There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing the same, as well as a solder base layer forming paste which is disposed and fired on a metal member to thereby react with an oxide film generated on the surface of the metal member and form the solder base layer on the metal member, capable of suppressing the occurrence of waviness and wrinkles on the surface of the metal member even at the time of loading the power cycle and heat cycle and improving the joint reliability with a joint member.

摘要翻译： 提供了焊接结构，使用接合结构的功率模块，具有散热器的功率模块基板及其制造方法，以及焊接基底层形成用糊料，其设置在金属部件上 从而与在金属构件的表面上产生的氧化膜反应并在金属构件上形成焊料基底层，即使在加载电力时也能够抑制金属构件的表面上的波纹和褶皱的发生 循环和热循环，并通过联合成员提高联合可靠性。

公开(公告)号：US08858700B2

公开(公告)日：2014-10-14

申请号：US13381731

申请日：2009-10-23

申请人： Keiichi Endoh ,  Aiko Nagahara ,  Yutaka Hisaeda ,  Toshihiko Ueyama

发明人： Keiichi Endoh ,  Aiko Nagahara ,  Yutaka Hisaeda ,  Toshihiko Ueyama

IPC分类号： B29C65/02 ,  B32B37/06 ,  C08K3/08 ,  C08K5/09 ,  B23K35/22 ,  B23K35/365 ,  B23K35/02 ,  B22F1/00 ,  B82Y30/00 ,  B23K35/40 ,  H01L23/00 ,  B23K35/30

CPC分类号： B23K35/3006 ,  B22F1/0018 ,  B22F1/0062 ,  B22F2999/00 ,  B23K35/0244 ,  B23K35/22 ,  B23K35/365 ,  B23K35/40 ,  B82Y30/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/203 ,  Y10T428/2991 ,  B22F2301/255 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/0002

摘要： In a bonding material using nanoparticles and a bonding method, use in combination with microparticles is proposed. However, there is the problem in which it is not easy to uniformly mix the nanoparticles and the microparticles. The present invention uses a bonding material including metal nanoparticles having an average particle diameter of 100 nm or less and a surface coated with an organic substance having 6 to 8 carbon atoms, and a polar solvent in an amount of 5 to 20% by mass with respect to a powder of the metal nanoparticles, and objects to be bonded with the bonding material interposed therebetween are fired at 200 to 350° C. under pressure. Thus, the metal nanoparticles are melted and returned to a bulk material, and therefore a bonding layer of the bulk material can be formed at a low temperature equal to or lower than a melting point.

摘要翻译： 在使用纳米粒子的接合材料和接合方法中，提出与微粒组合使用。 然而，存在不容易均匀地混合纳米颗粒和微粒的问题。 本发明使用包含平均粒径为100nm以下的金属纳米粒子和碳原子数为6〜8的有机物的表面的极性溶剂和5〜20质量％的极性溶剂的接合材料， 相对于金属纳米粒子的粉末，与其间的接合材料接合的物体在压力下在200〜350℃下烧成。 因此，金属纳米粒子被熔化并返回到本体材料中，因此可以在等于或低于熔点的低温下形成本体材料的粘结层。

公开(公告)号：US20140212233A1

公开(公告)日：2014-07-31

申请号：US14342271

申请日：2012-09-03

申请人： Kwon Hee Park ,  Dae Yeop Lee

发明人： Kwon Hee Park ,  Dae Yeop Lee

IPC分类号： B23B27/14 ,  B23K31/02

CPC分类号： B23B27/148 ,  B23B27/141 ,  B23B2226/18 ,  B23B2226/72 ,  B23B2228/61 ,  B23B2240/08 ,  B23K31/02 ,  B23K35/0222 ,  B23K35/3006 ,  B23K35/325 ,  C04B35/117 ,  C04B35/119 ,  C04B35/443 ,  C04B35/62655 ,  C04B35/645 ,  C04B35/803 ,  C04B37/006 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/3826 ,  C04B2235/5276 ,  C04B2235/528 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/32 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/38 ,  C04B2237/401 ,  C04B2237/76 ,  C22C5/06 ,  C22C5/08 ,  C22C9/00 ,  C22C9/06 ,  C22C14/00 ,  C22C16/00 ,  C22C19/03 ,  C22C30/02 ,  Y10T407/26

摘要： A cutting insert has only cutting edge portion thereof made of SiC whisker reinforced ceramics brazed to the shank with active solder. This provides improved cutting performance by increased toughness and high strength of the SiC whisker reinforced ceramics without limitation in shape while reducing manufacturing costs. The cutting insert includes a cutting edge portion made of SiC whisker reinforced ceramics, and a shank to which the cutting edge portion is mounted. The cutting edge portion is brazed to the shank using an active solder, and the whiskers are disorderedly arranged and agglomerated in the cutting edge portion.

摘要翻译： 切削刀片仅具有由活性焊料钎焊到柄上的SiC晶须增强陶瓷制成的切削刃部分。 通过提高SiC晶须增强陶瓷的韧性和高强度，同时降低制造成本，在形状上没有限制，提供了改进的切割性能。 切削刀片包括由SiC晶须增强陶瓷制成的切削刃部分和安装切削刃部分的柄。 切削刃部分使用活性焊料钎焊到柄上，并且晶须在切削刃部分中无序地排列和凝聚。

公开(公告)号：US20140063762A1

公开(公告)日：2014-03-06

申请号：US14015119

申请日：2013-08-30

申请人： Heraeus Materials Technology GmbH & Co. KG

发明人： Jae-Sung RYU ,  Eun-Kyun CHUNG ,  Yong-Deok TARK

IPC分类号： B23K35/02 ,  H05K7/02

CPC分类号： B23K35/0227 ,  B23K35/3006 ,  B23K2101/36 ,  B23K2101/40 ,  B23K2101/42 ,  C22C5/06 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/12041 ,  H05K7/02 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01045 ,  H01L2924/01044 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/013 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2924/01004 ,  H01L2924/01005

摘要： A bonding wire according to the invention contains a core having a surface, in which the core contains silver as a main component and at least one element selected from gold, palladium, platinum, rhodium, ruthenium, nickel, copper, and iridium. The wire exhibits at least one of the following properties: I. an average size of crystal grains of the core is between 0.8 μm and 3 μm, II. the amount of crystal grains having an orientation in the direction in a wire cross section is in a range of 10-20%, III. the amount of crystal grains having an orientation in the direction in a wire cross section is in a range of 5-15%, and IV. the total amount of crystal grains having orientations in the and directions in a wire cross section is in a range of 15-40%.

摘要翻译： 根据本发明的接合线包含具有表面的芯，其中芯包含银作为主要成分和至少一种选自金，钯，铂，铑，钌，镍，铜和铱的元素。 线材具有以下特性中的至少一个：I.芯的晶粒的平均尺寸为0.8μm和3μm，II。 线截面中<001>方向取向的晶粒的量在10〜20％的范围内，III。 线截面中<111>方向取向的晶粒的量在5〜15％的范围内，以及IV。 在线截面中沿<001>和<111>方向取向的晶粒的总量在15-40％的范围内。

公开(公告)号：US20140063757A1

公开(公告)日：2014-03-06

申请号：US13871149

申请日：2013-04-26

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Kazutaka TAKAGI

IPC分类号： H05K1/02 ,  B23K1/00

CPC分类号： H05K1/0271 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/0244 ,  B23K35/3006 ,  B23K35/3013 ,  H01L23/10 ,  H01L23/142 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10T403/479 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to an embodiment, a joint structure of package members housing or holding an electronic component includes a first member, a second member joined to the first member, and a joint portion provided between the first member and the second member. The joint portion contains a metal element with a melting point of 400° C. or more and the metal element of 98 percent by weight or more.

摘要翻译： 根据一个实施例，壳体或保持电子部件的封装构件的接合结构包括第一构件，连接到第一构件的第二构件和设置在第一构件和第二构件之间的接合部。 接头部分含有熔点为400℃以上的金属元素，98重量％以上的金属元素。

公开(公告)号：US20140018482A1

公开(公告)日：2014-01-16

申请号：US14029019

申请日：2013-09-17

申请人： JAY ROBERT DORFMAN

发明人： JAY ROBERT DORFMAN

IPC分类号： H01B1/22 ,  H01B13/30

CPC分类号： H01B1/22 ,  B22F1/0059 ,  B22F7/08 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  H01B13/30 ,  H01L21/4867 ,  H01L31/022425 ,  H01L51/0022 ,  H01L2924/0002 ,  H05K1/095 ,  H05K2201/0305 ,  Y02E10/50

摘要： This invention provides a polymer thick film conductor composition comprising (a) a solder alloy powder selected from the group consisting of (i) a tin, silver, and copper alloy powder, (ii) a fin and bismuth alloy powder, and (iii) mixtures thereof, (b) a metal selected from the group consisting of silver, copper, gold, aluminum and mixtures thereof, and (c) an organic medium comprising a thermoplastic resin dissolved in an organic solvent, wherein the solder alloy powder and the metal are dispersed in the organic medium.

摘要翻译： 本发明提供一种聚合物厚膜导体组合物，其包含（a）选自（i）锡，银和铜合金粉末的焊料合金粉末，（ii）翅片和铋合金粉末，以及（iii） 其混合物，（b）选自银，铜，金，铝及其混合物的金属，和（c）包含溶解在有机溶剂中的热塑性树脂的有机介质，其中焊料合金粉末和金属 分散在有机介质中。

公开(公告)号：US08568826B2

公开(公告)日：2013-10-29

申请号：US13278349

申请日：2011-10-21

申请人： Junyoung Park ,  Jason Robert Parolini ,  Ibrahim Ucok ,  Brian Lee Tollison ,  Stephen Walcott ,  Jon Conrad Schaeffer

发明人： Junyoung Park ,  Jason Robert Parolini ,  Ibrahim Ucok ,  Brian Lee Tollison ,  Stephen Walcott ,  Jon Conrad Schaeffer

IPC分类号： B05D1/12

CPC分类号： B05D1/12 ,  B23K1/0018 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/0261 ,  B23K35/3006 ,  B23K35/3605 ,  B23K35/3606 ,  B23K35/362 ,  B23K2101/001 ,  B23P6/007 ,  C22C1/0466 ,  F01D5/005 ,  F01D9/044 ,  F05D2230/90 ,  F05D2300/20 ,  Y10T428/25

摘要： A method for brazing a component in a power generation system, the brazed power generation system component, and braze are provided to improve repairing power generation systems. The method includes providing the component having a feature in a surface of the component and coating a particulate material with a filler material to obtain a coated particulate material. The method includes preparing the feature to obtain a treatment area and filling the treatment area in the surface of the component with the coated particulate material. The method includes heating the treatment area and surrounding component to a brazing temperature and applying oxidation protection to the treatment area. After the brazing temperature is obtained, the method includes brazing the treatment area and the screen and cooling the component to obtain a brazed joint.

摘要翻译： 提供了用于钎焊发电系统中的部件，钎焊发电系统部件和钎焊的方法，以改进修理发电系统。 该方法包括提供在部件的表面中具有特征的部件并且用填充材料涂覆颗粒材料以获得涂覆的颗粒材料。 该方法包括制备该特征以获得处理区域并用涂覆的颗粒材料填充组件表面中的处理区域。 该方法包括将处理区域和周围部件加热至钎焊温度，并对处理区域进行氧化保护。 在获得钎焊温度之后，该方法包括对处理区域和筛网进行钎焊并冷却部件以获得钎焊接头。

公开(公告)号：US20130260285A1

公开(公告)日：2013-10-03

申请号：US13991504

申请日：2011-12-01

申请人： Yuichiro Yamauchi ,  Shinji Saito

发明人： Yuichiro Yamauchi ,  Shinji Saito

IPC分类号： B23K35/30 ,  H01M8/02

CPC分类号： B23K35/3006 ,  B23K35/00 ,  B23K35/28 ,  B23K35/30 ,  B23K2101/36 ,  B23K2103/04 ,  B23K2103/05 ,  B23K2103/16 ,  B23K2103/18 ,  B23K2103/26 ,  B23K2103/52 ,  C04B37/026 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/368 ,  C04B2237/406 ,  C22C5/06 ,  C22C30/00 ,  H01M8/0202 ,  H01M8/0215 ,  H01M8/0228 ,  H01M8/0271 ,  H01M8/0297 ,  H01M2008/1293

摘要： A brazing alloy for bonding in air contains Ag, B, and Si, as essential components, in which the total of constituent elements except for Ag is set to more than 50% by volume and not more than 90% by volume, Si content in the constituent elements except for Ag is set to more than 22% by volume, and B content in the constituent elements except for Ag is set to more than 14% by volume. In a bonded layer of a bonded specimen of the present invention, after holding at high temperature, no void as observed in a bonded specimen after holding at high temperature of a Comparative Sample is observed, the brazing alloy is sufficiently melted, and superior gas sealing characteristics are maintained even after holding at high temperature for a long time.

摘要翻译： 用于在空气中粘合的钎焊合金含有Ag，B和Si作为必要成分，其中Ag除外的组成元素的总量设定为大于50体积％且不大于90体积％，Si含量 除了Ag以外的构成元素被设定为大于22体积％，除Ag以外的构成元素的B含量设定为大于14体积％。 在本发明的接合试样的接合层中，在高温保持后，观察到在比较样品的高温下保持后的接合试样中没有观察到的空隙，钎焊合金充分熔融，气密性优异 即使在长时间保持高温后也保持特性。

公开(公告)号：US20130248586A1

公开(公告)日：2013-09-26

申请号：US13836654

申请日：2013-03-15

申请人： Joseph W. Harris

发明人： Joseph W. Harris

IPC分类号： B23K35/30

CPC分类号： B23K35/302 ,  B23K1/00 ,  B23K1/203 ,  B23K1/206 ,  B23K3/043 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/3006 ,  B23K35/3013 ,  B23K2103/04 ,  B23K2103/05 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C30/02

摘要： A brazing alloy is provided in the form of a wire, rod or preform, and is made of, in weight percent: 3-7.5% P, 0.1-1.9% Zn, 0-74.7% Ag, 0-80% Au, 0-10% Sn, 0-5% Ni, 0-3% each of Si, Mn, Li, and Ge, and the balance copper in an amount of at least 21.7%. In additional embodiments, Zn may be present in an amount of 0.6-1.9%. A method of torch brazing is also provided. The method includes forming the alloy into a wire or rod, placing the tip of the wire or rod in contact with a surface of a joint, heating the joint surface using a torch flame, and contacting the tip of the wire or rod to the heated joint surface to melt and flow the alloy onto the joint surface and into the joint under capillary action.

摘要翻译： 钎焊合金以线材，棒材或预型体的形式提供，重量百分比为：3-7.5％P，0.1-1.9％Zn，0-74.7％Ag，0-80％Au，0 -10％Sn，0-5％Ni，0-3％Si，Mn，Li和Ge，余量铜的含量为21.7％以上。 在另外的实施方案中，Zn可以以0.6-1.9％的量存在。 还提供了一种焊炬钎焊的方法。 该方法包括将合金形成线或棒，将线或杆的尖端与接头的表面接触，使用割炬火焰加热接头表面，并将线或棒的尖端接触到加热的 接头表面在毛细管作用下熔化并将合金流入接头表面并进入接头。