公开(公告)号：US07790270B2

公开(公告)日：2010-09-07

申请号：US11898971

申请日：2007-09-18

申请人： Yoshihiro Tomita ,  Masanori Minamio ,  Toshiyuki Fukuda

发明人： Yoshihiro Tomita ,  Masanori Minamio ,  Toshiyuki Fukuda

IPC分类号： B32B3/00

CPC分类号： H05K3/3452 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0133 ,  H01L2924/15173 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/285 ,  H05K2201/068 ,  H05K2203/1572 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides a wiring board which may be warped only by a reduced amount when the wiring board is thin and has wiring patterns of different shapes on the opposite surfaces thereof and which enables a thin, small, and reliable semiconductor device to be implemented. The wiring board includes a planar resin base material 12, a first resin film 26 provided on the first surface of the resin base material 12 and shaped to expose the element connection terminals 14, and a second resin film 28 provided on the second surface of the resin base material and shaped to expose the external connection terminals 16, wherein the first resin film 26 and the second resin film 28 are different in at least one of a glass transition point, cure shrinkage, and a thermal expansion coefficient.

摘要翻译： 本发明提供了一种布线基板，其在布线板薄且仅在其相对表面上具有不同形状的布线图案时可能仅通过减少的量翘曲，并且能够实现薄而小的可靠的半导体器件。 布线板包括平面树脂基材12，设置在树脂基材12的第一表面上并成形为暴露元件连接端子14的第一树脂膜26和设置在第二表面上的第二树脂膜28 树脂基材，成形为露出外部连接端子16，其中第一树脂膜26和第二树脂膜28在玻璃化转变点，固化收缩率和热膨胀系数中的至少一个方面不同。

公开(公告)号：US20100001174A1

公开(公告)日：2010-01-07

申请号：US12525499

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzuo Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzuo Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： H01J3/14 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L27/14683 ,  G11B7/1275 ,  G11B7/13 ,  H01L23/055 ,  H01L23/10 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2224/85 ,  H01L2924/00

摘要： In a semiconductor device, a semiconductor element is mounted on a substantially rectangular package. First ribs are respectively provided on a pair of opposite external edges of a mounting surface and project upward from the pair of opposite external edges. External edges of a lid are placed on the upper surfaces of the first ribs, and fixed thereto with an adhesive. Dams are provided on external edges of the first rib upper surfaces. The adhesive is continuously present from side surfaces of the lid to the dams.

摘要翻译： 在半导体器件中，半导体元件安装在大致矩形的封装上。 第一肋分别设置在安装表面的一对相对的外边缘上并从该对相对的外边缘向上突出。 盖的外边缘放置在第一肋的上表面上，并用粘合剂固定在其上。 大坝设置在第一肋上表面的外边缘上。 粘合剂从盖的侧表面连续存在于坝。

公开(公告)号：US07547955B2

公开(公告)日：2009-06-16

申请号：US11700124

申请日：2007-01-31

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Toshiyuki Fukuda

IPC分类号： H01L27/15

CPC分类号： H01L27/14618 ,  H01L24/73 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality of micro lenses; a semiconductor package the semiconductor package in which a cavity for mounting the semiconductor imaging element is formed, the semiconductor package including a plurality of internal connection terminals formed inside the periphery of the cavity for being connected with a plurality of electrode terminals of the semiconductor imaging element and a plurality of external connection terminals connected with the internal connection terminals; a fixing member for fixing the semiconductor imaging element to the cavity; and an optical member fixed to the semiconductor package by a sealing member so as to cover the semiconductor imaging element arranged in the cavity. Wherein, a face obtained by connecting vertexes of the micro lenses is formed into a continuous concave curve.

摘要翻译： 一种半导体成像装置，包括：具有成像区域，外围电路区域和电极区域的半导体摄像元件，所述摄像区域包括多个微透镜; 半导体封装，其中形成有用于安装半导体成像元件的空腔的半导体封装，所述半导体封装包括形成在所述腔的周围的多个内部连接端子，用于与所述半导体成像元件的多个电极端子连接 以及与所述内部连接端子连接的多个外部连接端子; 用于将所述半导体成像元件固定到所述空腔的固定构件; 以及光学构件，其通过密封构件固定到所述半导体封装，以覆盖布置在所述空腔中的所述半导体成像元件。 其中，将通过连接微透镜的顶点获得的面形成为连续凹曲线。

公开(公告)号：US07495319B2

公开(公告)日：2009-02-24

申请号：US11071343

申请日：2005-03-03

申请人： Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Kenichi Itou

发明人： Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Kenichi Itou

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L21/566 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/645 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/16257 ,  H01L2224/16258 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81385 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01037 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19104 ,  Y10T156/10 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/48145 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/01033

摘要： There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin. A plurality of terminals 8 for electrical connection are provided in a grid pattern in a region inside the first external terminal portions and exposed on a lower surface of the encapsulating resin. A plurality of semiconductor elements or coils and resistors can be incorporated, and further semiconductor devices can be stacked.

摘要翻译： 设置有引线框架，该引线框架包括设置在平面上的多个第一外部端子部分5，由各个第一外部端子部分的后表面形成的内部引线部分6，其布置成围绕内部引线部分内的区域; 由位于相应的内部引线部分外部的凸起部分的最上表面形成的第二外部端子部分7; 半导体元件2通过凸块3接合到内引线部分; 以及封装树脂4，其封装半导体元件和内引线部分的周围。 第一外部端子部分沿着该区域的周边布置在封装树脂的下表面区域中，并且第二外部端子部分暴露在封装树脂的上表面上。 用于电连接的多个端子8以第一外部端子部分内的区域中的网格图案设置并暴露在封装树脂的下表面上。 可以并入多个半导体元件或线圈和电阻器，并且可以堆叠另外的半导体器件。

公开(公告)号：US07436053B2

公开(公告)日：2008-10-14

申请号：US11102736

申请日：2005-04-11

申请人： Masanori Minamio ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Toshiyuki Fukuda

IPC分类号： H01L23/02 ,  H01L23/42

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  Y10T29/49172 ,  H01L2924/00014

摘要： An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.

摘要翻译： 光学装置包括基座，附接到基座的光学元件芯片，附接到光学元件芯片的背面上的集成电路芯片以及透光构件（窗口构件）。 电线埋设在基座内，电线具有内部端子部分，外部端子部分和中点端子部分。 光学元件芯片的焊盘电极通过凸块连接到内部端子部分，并且集成电路芯片的焊盘电极通过细金属线连接到中点端子部分。

公开(公告)号：US20080117324A1

公开(公告)日：2008-05-22

申请号：US11979122

申请日：2007-10-31

申请人： Masanori Minamio ,  Yutaka Harada ,  Takahito Ishikawa ,  Toshiyuki Fukuda ,  Yoshiki Takayama

发明人： Masanori Minamio ,  Yutaka Harada ,  Takahito Ishikawa ,  Toshiyuki Fukuda ,  Yoshiki Takayama

IPC分类号： H04N5/225

CPC分类号： H04N5/2254 ,  H04N5/2253

摘要： A solid-state image sensor includes a first image sensing device, a first flexible substrate connected to the first image sensing device, a second solid-state image sensing device, and a second flexible substrate connected to the second solid-state image sensing device. The solid-state image sensing devices are disposed adjacently to each other such that light receiving surfaces are perpendicular to each other. The second solid-state image sensing device directly receives incident light. However, the first solid-state image sensing device receives the incident light reflected by a mirror. Electronic components are mounted on the two flexible substrates. The first flexible substrate is bent at two bending positions to face the second flexible substrate and electrically connected thereto.

摘要翻译： 固态图像传感器包括第一图像感测装置，连接到第一图像感测装置的第一柔性基板，第二固态图像感测装置和连接到第二固态图像感测装置的第二柔性基板。 固态图像感测装置彼此相邻设置，使得光接收表面彼此垂直。 第二固体摄像装置直接接收入射光。 然而，第一固态图像感测装置接收由反射镜反射的入射光。 电子部件安装在两个柔性基板上。 第一柔性基板在两个弯曲位置处弯曲以面对第二柔性基板并与其电连接。

公开(公告)号：US07359416B2

公开(公告)日：2008-04-15

申请号：US11708478

申请日：2007-02-21

申请人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

发明人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

IPC分类号： H01S3/14 ,  H01S3/07

CPC分类号： H01S5/02272 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L33/20 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32057 ,  H01L2224/48 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/157 ,  H01L2924/3511 ,  H01S5/0071 ,  H01S5/0207 ,  H01S5/02216 ,  H01S5/0224 ,  H01S5/02292 ,  H01S5/02476 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An optical semiconductor device includes a semiconductor laser chip, a base for mounting the semiconductor laser chip and a solder layer sandwiched between the top surface of the base and the bottom surface of the semiconductor laser chip. The semiconductor laser chip is warped in upward convex shape.

摘要翻译： 光半导体器件包括半导体激光器芯片，用于安装半导体激光器芯片的基座和夹在基底的顶表面和半导体激光器芯片的底表面之间的焊料层。 半导体激光芯片翘曲成向上凸出的形状。

公开(公告)号：US07302125B2

公开(公告)日：2007-11-27

申请号：US11260175

申请日：2005-10-28

申请人： Taku Gobara ,  Masanori Minamio ,  Katsutoshi Shimizu ,  Toshiyuki Fukuda

发明人： Taku Gobara ,  Masanori Minamio ,  Katsutoshi Shimizu ,  Toshiyuki Fukuda

IPC分类号： G02B6/12 ,  H04B10/04 ,  H04B10/12

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/18 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate, the translucent member is provided so as to cover a first opening mouth of the opening, and the optical element chip is provided so as to cover a second opening mouth thereof. Part of the conductive portion is exposed at the device substrate to form a terminal portion. The terminal portion is provided so as to be substantially flush with the surface of the device and serves as a mount portion to be directly mounted on the interconnect substrate.

摘要翻译： 根据本发明的光学装置包括器件基板，透光部件，光学元件芯片和导电部分。 在器件基板的表面上，设置有开口部，其大致相对于器件基板的表面在垂直方向上延伸并穿过器件基板，所述透光部件设置成覆盖第一开口 并且设置光学元件芯片以覆盖其第二开口。 导电部分的一部分在器件衬底处露出以形成端子部分。 端子部分设置成与装置的表面基本齐平，并且用作直接安装在互连基板上的安装部分。

公开(公告)号：US07286729B2

公开(公告)日：2007-10-23

申请号：US11396651

申请日：2006-04-04

申请人： Masanori Minamio ,  Toshiyuki Fukuda ,  Noriyuki Yoshikawa ,  Hiroaki Fujimoto ,  Yoshinobu Kunitomo

发明人： Masanori Minamio ,  Toshiyuki Fukuda ,  Noriyuki Yoshikawa ,  Hiroaki Fujimoto ,  Yoshinobu Kunitomo

IPC分类号： G02B6/12

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/92247 ,  H01L2924/01021 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device cavity structure includes: insulator layers and metal layers alternately layered on one another; a first terminal section which is formed on a mounting surface to be mounted on a wiring substrate and which is electrically connected to the wiring substrate; a cavity portion having a generally rectangular opening formed in a central portion of the upper surface; and a light-transmitting member placement section formed on the upper surface surrounding the opening for receiving a light-transmitting member thereon, wherein the light-transmitting member is for transmitting therethrough light to be received by, or light emitted from, an optical element chip.

摘要翻译： 光学器件腔结构包括：彼此交替层叠的绝缘体层和金属层; 第一端子部，形成在安装在布线基板上的与布线基板电连接的安装面上; 空腔部分，其具有形成在所述上表面的中心部分中的大致矩形的开口; 以及透光部件配置部，其形成在所述开口的周围的上表面上，用于容纳透光部件，其中，所述透光部件用于透射由所述光学元件芯片接收的光或从所述光学元件芯片发出的光 。

公开(公告)号：US20070109439A1

公开(公告)日：2007-05-17

申请号：US11540753

申请日：2006-10-02

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H04N5/225

CPC分类号： H01L27/14623 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

摘要翻译： 半导体图像感测元件具有包括图像感测区域，外围电路区域，设置在外围电路区域中的多个电极部分和设置在图像感测区域上的多个微透镜的半导体元件和具有 至少覆盖图像感测区域并通过透明结合部件粘合在微透镜上的构造。 光学构件的侧表面区域形成有用于防止来自侧表面区域的反射光束或散射光束照射摄像区域的遮光膜。