公开(公告)号：US20070228502A1

公开(公告)日：2007-10-04

申请号：US11700124

申请日：2007-01-31

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Toshiyuki Fukuda

IPC分类号： H01L27/14

CPC分类号： H01L27/14618 ,  H01L24/73 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality of micro lenses; a semiconductor package the semiconductor package in which a cavity for mounting the semiconductor imaging element is formed, the semiconductor package including a plurality of internal connection terminals formed inside the periphery of the cavity for being connected with a plurality of electrode terminals of the semiconductor imaging element and a plurality of external connection terminals connected with the internal connection terminals; a fixing member for fixing the semiconductor imaging element to the cavity; and an optical member fixed to the semiconductor package by a sealing member so as to cover the semiconductor imaging element arranged in the cavity. Wherein, a face obtained by connecting vertexes of the micro lenses is formed into a continuous concave curve.

摘要翻译： 一种半导体成像装置，包括：具有成像区域，外围电路区域和电极区域的半导体摄像元件，所述摄像区域包括多个微透镜; 半导体封装，其中形成有用于安装半导体成像元件的空腔的半导体封装，所述半导体封装包括形成在所述腔的周围的多个内部连接端子，用于与所述半导体成像元件的多个电极端子连接 以及与所述内部连接端子连接的多个外部连接端子; 用于将所述半导体成像元件固定到所述空腔的固定构件; 以及光学构件，其通过密封构件固定到所述半导体封装，以覆盖布置在所述空腔中的所述半导体成像元件。 其中，将通过连接微透镜的顶点获得的面形成为连续凹曲线。

公开(公告)号：US07834926B2

公开(公告)日：2010-11-16

申请号：US11540753

申请日：2006-10-02

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H04N5/225 ,  G02B26/00 ,  G02F1/00 ,  H01L21/00

CPC分类号： H01L27/14623 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

摘要翻译： 半导体图像感测元件具有包括图像感测区域，外围电路区域，设置在外围电路区域中的多个电极部分和设置在图像感测区域上的多个微透镜的半导体元件和具有 至少覆盖图像感测区域并通过透明结合部件粘合在微透镜上的构造。 光学构件的侧表面区域形成有用于防止来自侧表面区域的反射光束或散射光束照射摄像区域的遮光膜。

公开(公告)号：US07547955B2

公开(公告)日：2009-06-16

申请号：US11700124

申请日：2007-01-31

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Toshiyuki Fukuda

IPC分类号： H01L27/15

CPC分类号： H01L27/14618 ,  H01L24/73 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality of micro lenses; a semiconductor package the semiconductor package in which a cavity for mounting the semiconductor imaging element is formed, the semiconductor package including a plurality of internal connection terminals formed inside the periphery of the cavity for being connected with a plurality of electrode terminals of the semiconductor imaging element and a plurality of external connection terminals connected with the internal connection terminals; a fixing member for fixing the semiconductor imaging element to the cavity; and an optical member fixed to the semiconductor package by a sealing member so as to cover the semiconductor imaging element arranged in the cavity. Wherein, a face obtained by connecting vertexes of the micro lenses is formed into a continuous concave curve.

摘要翻译： 一种半导体成像装置，包括：具有成像区域，外围电路区域和电极区域的半导体摄像元件，所述摄像区域包括多个微透镜; 半导体封装，其中形成有用于安装半导体成像元件的空腔的半导体封装，所述半导体封装包括形成在所述腔的周围的多个内部连接端子，用于与所述半导体成像元件的多个电极端子连接 以及与所述内部连接端子连接的多个外部连接端子; 用于将所述半导体成像元件固定到所述空腔的固定构件; 以及光学构件，其通过密封构件固定到所述半导体封装，以覆盖布置在所述空腔中的所述半导体成像元件。 其中，将通过连接微透镜的顶点获得的面形成为连续凹曲线。

公开(公告)号：US20070109439A1

公开(公告)日：2007-05-17

申请号：US11540753

申请日：2006-10-02

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H04N5/225

CPC分类号： H01L27/14623 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

摘要翻译： 半导体图像感测元件具有包括图像感测区域，外围电路区域，设置在外围电路区域中的多个电极部分和设置在图像感测区域上的多个微透镜的半导体元件和具有 至少覆盖图像感测区域并通过透明结合部件粘合在微透镜上的构造。 光学构件的侧表面区域形成有用于防止来自侧表面区域的反射光束或散射光束照射摄像区域的遮光膜。

公开(公告)号：US08193091B2

公开(公告)日：2012-06-05

申请号：US10173900

申请日：2002-06-19

申请人： Fumihiko Kawai ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Noboru Takeuchi ,  Shuichi Ogata ,  Katsushi Tara ,  Tadayoshi Nakatsuka

发明人： Fumihiko Kawai ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Noboru Takeuchi ,  Shuichi Ogata ,  Katsushi Tara ,  Tadayoshi Nakatsuka

IPC分类号： H01L23/495

CPC分类号： H01L24/49 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06179 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85191 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/4554

摘要： The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.

摘要翻译： 本发明包括一个管芯焊盘; 信号引线，接地连接引线连接到管芯焊盘; 包括用于接地的电极焊盘的半导体芯片; 金属细线，以及用于封装芯片焊盘和半导体芯片的封装树脂，并封装信号引线和接地连接引线，使得信号引线和接地连接引线的下部被暴露为外部端子。 接地连接引线连接到电极焊盘用于接地，使得树脂封装的半导体器件电稳定。 此外，可以通过管芯焊盘和接地连接引线来抑制通过信号引线的高频信号之间的干扰。

公开(公告)号：US07745834B2

公开(公告)日：2010-06-29

申请号：US11471659

申请日：2006-06-21

申请人： Masanori Minamio ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Toshiyuki Fukuda

IPC分类号： H01L27/148

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor image sensor includes: a semiconductor imaging element including an imaging area, a peripheral circuit area, and an electrode area; cylindrical electrodes provided on electrode terminals so as to be electrically connected with an external device; and a transparent resin layer provided on the upper surface of the semiconductor imaging element. The upper surface of each cylindrical electrode and the upper surface of the transparent resin layer are substantially of the same height.

摘要翻译： 半导体图像传感器包括：半导体成像元件，包括成像区域，外围电路区域和电极区域; 设置在电极端子上以与外部装置电连接的圆柱形电极; 以及设置在半导体摄像元件的上表面上的透明树脂层。 每个圆柱形电极的上表面和透明树脂层的上表面基本上具有相同的高度。

公开(公告)号：US20100091630A1

公开(公告)日：2010-04-15

申请号：US12525227

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzou Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： G11B7/00 ,  H01L21/78 ,  H01L23/29

CPC分类号： G11B7/1275 ,  H01L21/4803 ,  H01L23/055 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14687 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A plurality of parallel rib prototypes are provided on a flat base plate. A plurality of semiconductor elements are placed in each trench between adjacent ones of the rib prototypes, and a transparent member is bonded to each of the semiconductor elements. Electrode pads of the semiconductor elements are wire bonded to connection electrodes. The trenches are then filled with an encapsulating resin. Thereafter, middle portions, in the longitudinal direction, of the rib prototypes are cut with a dicing saw, and adjacent ones of the semiconductor elements are separated from each other, thereby obtaining semiconductor devices.

摘要翻译： 多个平行肋原型设置在平坦的基板上。 多个半导体元件被放置在相邻的肋原型之间的每个沟槽中，并且透明构件被结合到每个半导体元件。 半导体元件的电极焊盘被引线接合到连接电极。 然后用封装树脂填充沟槽。 此后，用切割锯切割肋骨原型的纵向中间部分，并且相邻的半导体元件彼此分离，从而获得半导体器件。

公开(公告)号：US07629688B2

公开(公告)日：2009-12-08

申请号：US11491029

申请日：2006-07-24

申请人： Masanori Minamio ,  Hiroaki Fujimoto ,  Atsuhito Mizutani ,  Hisaki Fujitani ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Hiroaki Fujimoto ,  Atsuhito Mizutani ,  Hisaki Fujitani ,  Toshiyuki Fukuda

IPC分类号： H01L23/48

CPC分类号： H01L24/85 ,  H01L21/2007 ,  H01L21/563 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48455 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/00015

摘要： An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon.

摘要翻译： 通过将铝线压靠在硅电极上的楔形工具将铝线结合到硅电极。 以这种方式，通过依次层叠铝，氧化铝，氧化硅和硅来获得牢固结合的结构。

公开(公告)号：US07582944B2

公开(公告)日：2009-09-01

申请号：US11698100

申请日：2007-01-26

申请人： Toshiyuki Fukuda ,  Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio ,  Yutaka Harada

发明人： Toshiyuki Fukuda ,  Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio ,  Yutaka Harada

IPC分类号： H01L31/0232

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0232 ,  H01L33/483 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05026 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/00014

摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.

摘要翻译： 光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件， 在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂 。 在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光​​学装置的电极和 透明构件电连接并且还通过透明粘合剂粘合。

公开(公告)号：US07495339B2

公开(公告)日：2009-02-24

申请号：US11544633

申请日：2006-10-10

申请人： Masanori Minamio ,  Hiroaki Fujimoto ,  Atsuhito Mizutani ,  Hisaki Fujitani ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Hiroaki Fujimoto ,  Atsuhito Mizutani ,  Hisaki Fujitani ,  Toshiyuki Fukuda

IPC分类号： H01L23/52

CPC分类号： H01L24/10 ,  B23K20/004 ,  B23K20/10 ,  B23K35/002 ,  B23K35/0227 ,  B23K35/286 ,  B23K35/3601 ,  B23K2101/32 ,  B23K2101/40 ,  B23K2103/10 ,  B23K2103/18 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/563 ,  H01L24/05 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48458 ,  H01L2224/4847 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2224/8582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/0002

摘要： There is provided a connection structure between a Si electrode (Si member) and an Al wire (Al member). Between the Si electrode and the Al wire, a first part and second parts are present in interposed relation. Each of the first and second parts is in contact with the Si electrode and with the Al wire. In the first part, a Si oxide layer and an Al oxide layer are present. The Si oxide layer is in contact with the Si electrode. The Al oxide layer is interposed between the Si oxide layer and the Al wire. In some of the second parts, Al is present. In the others of the second parts, a Si portion and an Al portion are present.

摘要翻译： 提供了Si电极（Si构件）和Al线（Al构件）之间的连接结构。 在Si电极和Al线之间，第一部分和第二部分呈中间关系。 第一和第二部分中的每一个与Si电极和Al线接触。 在第一部分中存在Si氧化物层和Al氧化物层。 Si氧化物层与Si电极接触。 Al氧化物层介于Si氧化物层和Al线之间。 在一些第二部分中，Al存在。 在第二部分的其它部分中，存在Si部分和Al部分。