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    Christmas tree
    54.
    外观设计
    Christmas tree 有权

    公开(公告)号：USD1034293S1

    公开(公告)日：2024-07-09

    申请号：US29903949

    申请日：2023-09-28

    申请人： Hua Yang

    设计人： Hua Yang

    摘要： FIG. 1 is a front, right and top perspective view of a Christmas tree showing my new design;
    FIG. 2 is a rear, left and bottom perspective view thereof;
    FIG. 3 is a front elevational view thereof;
    FIG. 4 is a rear elevational view thereof;
    FIG. 5 is a left side elevational view thereof;
    FIG. 6 is a right side elevational view thereof;
    FIG. 7 is a top plan view thereof;
    FIG. 8 is a bottom plan view thereof; and,
    FIG. 9 is an enlarged portion view labeled, “9,” in FIG. 1.
    The long dashed, short dashed broken lines depict boundaries of the enlarged portion view of FIG. 9 in FIGS. 1 and 9 and form no part of the claimed design.
    The even dashed broken lines shown in the drawings represent portions of the Christmas tree that form no part of the claimed design.

    Three-dimensional graphics clipping method, three-dimensional graphics displaying method, and graphics processing apparatus using the same
    58.
    发明授权
    Three-dimensional graphics clipping method, three-dimensional graphics displaying method, and graphics processing apparatus using the same 有权
    三维图形裁剪方法，三维图形显示方法和使用其的图形处理装置

    公开(公告)号：US09030478B2

    公开(公告)日：2015-05-12

    申请号：US13473619

    申请日：2012-05-17

    申请人： Hua Yang

    发明人： Hua Yang

    IPC分类号： G06T13/20 ,  G06T15/30

    CPC分类号： G06T15/30

    摘要： A three-dimensional (3D) graphics clipping method, a 3D graphics displaying method, and a 3D graphics processing apparatus using the same are provided. The 3D graphics clipping method includes following steps. A plurality of vertexes of a triangle is obtained, wherein a 3D object is constructed by using a plane of the triangle. Whether a view point is located between a first near clipping plane and a far clipping plane is determined. A second near clipping plane is set according to the determination result, and a view field is set between the second near clipping plane and the far clipping plane. A near clipping procedure is executed on the triangle according to the second near clipping plane. In the 3D graphics clipping method, a correct view field is determined in advance so that a graphics processing procedure is efficiently sped up and the accuracy of the near clipping procedure is increased.

    摘要翻译： 提供三维（3D）图形裁剪方法，3D图形显示方法和使用其的3D图形处理装置。 3D图形裁剪方法包括以下步骤。 获得三角形的多个顶点，其中通过使用三角形的平面来构造3D对象。 确定视点是否位于第一近剪辑平面和远剪切平面之间。 根据确定结果设置第二近剪裁平面，并且在第二近剪裁平面和远剪切平面之间设置视野。 根据第二近剪辑平面在三角形上执行近剪辑过程。 在3D图形剪辑方法中，预先确定正确的视野，使得图形处理过程被有效地加快，并且近度剪辑过程的精度增加。

    PACKAGING STRUCTURE OF LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME
    59.
    发明申请
    PACKAGING STRUCTURE OF LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME 有权
    发光二极管的包装结构及其制造方法

    公开(公告)号：US20140264266A1

    公开(公告)日：2014-09-18

    申请号：US14232443

    申请日：2012-03-14

    申请人： Jinmin Li ,  Hua Yang ,  Xiaoyan Yi ,  Junxi Wang

    发明人： Jinmin Li ,  Hua Yang ,  Xiaoyan Yi ,  Junxi Wang

    IPC分类号： H01L33/06 ,  H01L33/58 ,  H01L33/56 ,  H01L33/00

    CPC分类号： H01L33/06 ,  H01L24/24 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/385 ,  H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

    摘要： The present disclosure relates to a light emitting diode packaging structure and the method of manufacturing the same. The light emitting diode packaging structure comprises: an insulating substrate with through holes formed on each side of the upper surface thereof, the through hole being filling with conductive metal; a n-type layer formed on the insulating substrate with a hole, which is filled with conductive metal; an active layer provided on the n-type layer; a p-type layer formed on the active layer; an insulating layer configured on one side of the n-type layer, the active layer and the p-type layer and to cover part of the upper surface of the p-type layer; a p-type electrode configured to cover the insulating layer and part of the upper surface of the p-type layer; a n-type electrode provided on a side of the upper surface of the n-type layer and configured to connect with the conductive metal in the through hole in the insulating substrate; a first back electrode provided at one side of back surface of the insulating substrate, the first back electrode connecting with the p-type electrode through the conductive metal in the through hole in the insulating substrate; a second back electrode provided at the other side of back surface of the insulating substrate, the second back electrode connecting with the n-type electrode through the conductive metal in the through hole in the insulating substrate; an optical element packaged on the base substrate, thereby finishing a device.

    摘要翻译： 本公开涉及一种发光二极管封装结构及其制造方法。 所述发光二极管封装结构包括：绝缘基板，其上表面的每一侧形成有通孔，所述通孔填充导电金属; 形成在具有孔的绝缘基板上的n型层，其填充有导电金属; 设置在n型层上的有源层; 形成在有源层上的p型层; 绝缘层，其构造在所述n型层的一侧，所述有源层和p型层的一侧，并且覆盖所述p型层的上表面的一部分; p型电极，被配置为覆盖所述绝缘层和所述p型层的上表面的一部分; n型电极，其设置在所述n型层的上表面的一侧，并且被配置为与所述绝缘基板中的所述通孔中的所述导电金属连接; 设置在所述绝缘基板的背面的一侧的第一背面电极，所述第一背面电极通过所述绝缘基板的通孔中的所述导电性金属与所述p型电极连接; 设置在所述绝缘基板的背面的另一侧的第二背面电极，所述第二背面电极通过所述绝缘基板的通孔中的所述导电金属与所述n型电极连接; 封装在基底基板上的光学元件，从而完成设备。