公开(公告)号：US07166908B2

公开(公告)日：2007-01-23

申请号：US11244083

申请日：2005-10-06

申请人： Masanori Minamio ,  Eizou Fujii ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Eizou Fujii ,  Toshiyuki Fukuda

IPC分类号： H01L23/02

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/18 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate, the translucent member is provided so as to cover a first opening mouth of the opening, and the optical element chip is provided so as to cover the other opening mouth thereof. Part of the conductive portion is buried in the device substrate. The outline of the first opening mouth has a point-asymmetrical shape with respect to an approximate center point of the first opening mouth.

公开(公告)号：US20060121184A1

公开(公告)日：2006-06-08

申请号：US11269748

申请日：2005-11-09

申请人： Masanori Minamio ,  Tetsushi Nishio ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tetsushi Nishio ,  Toshiyuki Fukuda

IPC分类号： B05D5/06

CPC分类号： H01L27/14618 ,  B05D1/286 ,  B05D3/067 ,  H01L23/10 ,  H01L27/14623 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

摘要： An adhesive sheet is attached to a package substrate having a through hole so that an ultraviolet (UV) curable resin layer of the adhesive sheet faces the package substrate. Light is then radiated to the UV curable resin layer through the through hole in order to cure the exposed part of the UV curable resin layer. The cured part of the UV curable resin layer is removed together with a base film of the adhesive sheet. A glass plate is then attached to the UV curable resin remaining on the package substrate. Light is then radiated to bond the glass plate to the package substrate.

摘要翻译： 将粘合片附着到具有通孔的封装基板上，使得粘合片的紫外线（UV）固化树脂层面向封装基板。 然后通过通孔将光照射到UV固化树脂层，以固化UV可固化树脂层的暴露部分。 UV固化树脂层的固化部分与粘合片的基膜一起除去。 然后将玻璃板连接到残留在封装基板上的UV固化树脂。 然后照射光以将玻璃板粘合到封装衬底。

公开(公告)号：US20060108656A1

公开(公告)日：2006-05-25

申请号：US11244083

申请日：2005-10-06

申请人： Masanori Minamio ,  Eizou Fujii ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Eizou Fujii ,  Toshiyuki Fukuda

IPC分类号： H01L31/0203

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/18 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an opening is provided so as to extend substantially in the vertical direction with respect to a surface of the device substrate and pass through the device substrate, the translucent member is provided so as to cover a first opening mouth of the opening, and the optical element chip is provided so as to cover the other opening mouth thereof. Part of the conductive portion is buried in the device substrate. The outline of the first opening mouth has a point-asymmetrical shape with respect to an approximate center point of the first opening mouth.

摘要翻译： 根据本发明的光学装置包括器件基板，透光部件，光学元件芯片和导电部分。 在器件基板的表面上，设置有开口部，其大致相对于器件基板的表面在垂直方向上延伸并穿过器件基板，所述透光部件设置成覆盖第一开口 并且设置光学元件芯片以覆盖其另一个开口。 导电部分的一部分被埋在器件衬底中。 第一开口的轮廓相对于第一开口的近似中心点具有点对称的形状。

公开(公告)号：US06680524B2

公开(公告)日：2004-01-20

申请号：US09983336

申请日：2001-10-24

申请人： Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Toshiyuki Fukuda ,  Toru Nomura

发明人： Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Toshiyuki Fukuda ,  Toru Nomura

IPC分类号： H01L2302

CPC分类号： H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/83141 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor device includes: a wiring substrate; a wiring electrode; a semiconductor chip; a connecting member; and a resin encapsulant. The wiring electrode is formed on the wiring substrate. The semiconductor chip is mounted on the wiring substrate and a second bottom face of the semiconductor chip is in contact with the wiring substrate. An electrode pad formed on the semiconductor chip and the wiring electrode are electrically connected to each other with the connecting member. The semiconductor chip, the wiring electrode, and the connecting member, for example, are molded with the resin encapsulant on the upper surface of the wiring substrate. A level difference exists between a first bottom face and the second bottom face of the semiconductor chip. The first and second bottom faces are respectively located at a peripheral portion and a central portion of the semiconductor chip. A part of the resin encapsulant is interposed between the first bottom face and the upper surface of the wiring substrate. Thus, the resin encapsulant and the semiconductor chip are secured more strongly to each other, and so are the resin encapsulant and the wiring substrate.

摘要翻译： 半导体器件包括：布线基板; 布线电极; 半导体芯片; 连接构件; 和树脂密封剂。 布线电极形成在布线基板上。 半导体芯片安装在布线基板上，半导体芯片的第二底面与布线基板接触。 形成在半导体芯片上的电极焊盘和布线电极通过连接部件彼此电连接。 例如，半导体芯片，布线电极和连接部件用树脂密封剂模制在布线基板的上表面上。 在半导体芯片的第一底面和第二底面之间存在水平差。 第一和第二底面分别位于半导体芯片的周边部分和中心部分。 树脂密封剂的一部分插入在布线基板的第一底面和上表面之间。 因此，树脂密封剂和半导体芯片彼此更牢固地固定，树脂密封剂和布线基板也被固定。

公开(公告)号：US08017418B2

公开(公告)日：2011-09-13

申请号：US12717513

申请日：2010-03-04

申请人： Masanori Minamio ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Toshiyuki Fukuda

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor image sensor includes: a semiconductor imaging element including an imaging area, a peripheral circuit area, and an electrode area; cylindrical electrodes provided on electrode terminals so as to be electrically connected with an external device; and a transparent resin layer provided on the upper surface of the semiconductor imaging element. The upper surface of each cylindrical electrode and the upper surface of the transparent resin layer are substantially of the same height.

摘要翻译： 半导体图像传感器包括：半导体成像元件，包括成像区域，外围电路区域和电极区域; 设置在电极端子上以与外部装置电连接的圆柱形电极; 以及设置在半导体摄像元件的上表面上的透明树脂层。 每个圆柱形电极的上表面和透明树脂层的上表面基本上具有相同的高度。

公开(公告)号：US07790270B2

公开(公告)日：2010-09-07

申请号：US11898971

申请日：2007-09-18

申请人： Yoshihiro Tomita ,  Masanori Minamio ,  Toshiyuki Fukuda

发明人： Yoshihiro Tomita ,  Masanori Minamio ,  Toshiyuki Fukuda

IPC分类号： B32B3/00

CPC分类号： H05K3/3452 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0133 ,  H01L2924/15173 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/285 ,  H05K2201/068 ,  H05K2203/1572 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides a wiring board which may be warped only by a reduced amount when the wiring board is thin and has wiring patterns of different shapes on the opposite surfaces thereof and which enables a thin, small, and reliable semiconductor device to be implemented. The wiring board includes a planar resin base material 12, a first resin film 26 provided on the first surface of the resin base material 12 and shaped to expose the element connection terminals 14, and a second resin film 28 provided on the second surface of the resin base material and shaped to expose the external connection terminals 16, wherein the first resin film 26 and the second resin film 28 are different in at least one of a glass transition point, cure shrinkage, and a thermal expansion coefficient.

摘要翻译： 本发明提供了一种布线基板，其在布线板薄且仅在其相对表面上具有不同形状的布线图案时可能仅通过减少的量翘曲，并且能够实现薄而小的可靠的半导体器件。 布线板包括平面树脂基材12，设置在树脂基材12的第一表面上并成形为暴露元件连接端子14的第一树脂膜26和设置在第二表面上的第二树脂膜28 树脂基材，成形为露出外部连接端子16，其中第一树脂膜26和第二树脂膜28在玻璃化转变点，固化收缩率和热膨胀系数中的至少一个方面不同。

公开(公告)号：US20100001174A1

公开(公告)日：2010-01-07

申请号：US12525499

申请日：2008-03-10

申请人： Junya Furuyashiki ,  Syouzuo Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

发明人： Junya Furuyashiki ,  Syouzuo Moribe ,  Hiroki Utatsu ,  Noriyuki Yoshikawa ,  Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroyuki Ishida

IPC分类号： H01J3/14 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L27/14683 ,  G11B7/1275 ,  G11B7/13 ,  H01L23/055 ,  H01L23/10 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2224/85 ,  H01L2924/00

摘要： In a semiconductor device, a semiconductor element is mounted on a substantially rectangular package. First ribs are respectively provided on a pair of opposite external edges of a mounting surface and project upward from the pair of opposite external edges. External edges of a lid are placed on the upper surfaces of the first ribs, and fixed thereto with an adhesive. Dams are provided on external edges of the first rib upper surfaces. The adhesive is continuously present from side surfaces of the lid to the dams.

摘要翻译： 在半导体器件中，半导体元件安装在大致矩形的封装上。 第一肋分别设置在安装表面的一对相对的外边缘上并从该对相对的外边缘向上突出。 盖的外边缘放置在第一肋的上表面上，并用粘合剂固定在其上。 大坝设置在第一肋上表面的外边缘上。 粘合剂从盖的侧表面连续存在于坝。

公开(公告)号：US07547955B2

公开(公告)日：2009-06-16

申请号：US11700124

申请日：2007-01-31

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Toshiyuki Fukuda

IPC分类号： H01L27/15

CPC分类号： H01L27/14618 ,  H01L24/73 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality of micro lenses; a semiconductor package the semiconductor package in which a cavity for mounting the semiconductor imaging element is formed, the semiconductor package including a plurality of internal connection terminals formed inside the periphery of the cavity for being connected with a plurality of electrode terminals of the semiconductor imaging element and a plurality of external connection terminals connected with the internal connection terminals; a fixing member for fixing the semiconductor imaging element to the cavity; and an optical member fixed to the semiconductor package by a sealing member so as to cover the semiconductor imaging element arranged in the cavity. Wherein, a face obtained by connecting vertexes of the micro lenses is formed into a continuous concave curve.

摘要翻译： 一种半导体成像装置，包括：具有成像区域，外围电路区域和电极区域的半导体摄像元件，所述摄像区域包括多个微透镜; 半导体封装，其中形成有用于安装半导体成像元件的空腔的半导体封装，所述半导体封装包括形成在所述腔的周围的多个内部连接端子，用于与所述半导体成像元件的多个电极端子连接 以及与所述内部连接端子连接的多个外部连接端子; 用于将所述半导体成像元件固定到所述空腔的固定构件; 以及光学构件，其通过密封构件固定到所述半导体封装，以覆盖布置在所述空腔中的所述半导体成像元件。 其中，将通过连接微透镜的顶点获得的面形成为连续凹曲线。

公开(公告)号：US07495319B2

公开(公告)日：2009-02-24

申请号：US11071343

申请日：2005-03-03

申请人： Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Kenichi Itou

发明人： Toshiyuki Fukuda ,  Masanori Minamio ,  Hiroaki Fujimoto ,  Ryuichi Sahara ,  Kenichi Itou

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L21/566 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/645 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/16257 ,  H01L2224/16258 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81385 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01037 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19104 ,  Y10T156/10 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/48145 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/01033

摘要： There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin. A plurality of terminals 8 for electrical connection are provided in a grid pattern in a region inside the first external terminal portions and exposed on a lower surface of the encapsulating resin. A plurality of semiconductor elements or coils and resistors can be incorporated, and further semiconductor devices can be stacked.

摘要翻译： 设置有引线框架，该引线框架包括设置在平面上的多个第一外部端子部分5，由各个第一外部端子部分的后表面形成的内部引线部分6，其布置成围绕内部引线部分内的区域; 由位于相应的内部引线部分外部的凸起部分的最上表面形成的第二外部端子部分7; 半导体元件2通过凸块3接合到内引线部分; 以及封装树脂4，其封装半导体元件和内引线部分的周围。 第一外部端子部分沿着该区域的周边布置在封装树脂的下表面区域中，并且第二外部端子部分暴露在封装树脂的上表面上。 用于电连接的多个端子8以第一外部端子部分内的区域中的网格图案设置并暴露在封装树脂的下表面上。 可以并入多个半导体元件或线圈和电阻器，并且可以堆叠另外的半导体器件。

公开(公告)号：US07436053B2

公开(公告)日：2008-10-14

申请号：US11102736

申请日：2005-04-11

申请人： Masanori Minamio ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Toshiyuki Fukuda

IPC分类号： H01L23/02 ,  H01L23/42

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  Y10T29/49172 ,  H01L2924/00014

摘要： An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.

摘要翻译： 光学装置包括基座，附接到基座的光学元件芯片，附接到光学元件芯片的背面上的集成电路芯片以及透光构件（窗口构件）。 电线埋设在基座内，电线具有内部端子部分，外部端子部分和中点端子部分。 光学元件芯片的焊盘电极通过凸块连接到内部端子部分，并且集成电路芯片的焊盘电极通过细金属线连接到中点端子部分。