POWER SEMICONDUCTOR DEVICE
    53.
    发明申请
    POWER SEMICONDUCTOR DEVICE 有权
    功率半导体器件

    公开(公告)号:US20110260707A1

    公开(公告)日:2011-10-27

    申请号:US13010178

    申请日:2011-01-20

    IPC分类号: G05F3/02

    CPC分类号: H02M1/08 H03K17/063

    摘要: A power semiconductor device comprises: high side and low side switching elements; high side and low side drive circuits; a bootstrap capacitor supplying a drive voltage to the high side drive circuit and having a first terminal connected to a connection point between the high side switching element and the low side switching element and a second terminal connected to a power supply terminal of the high side drive circuit; a bootstrap diode having an anode connected to a power supply and a cathode connected to the second terminal and supplying a current from the power supply to the second terminal; a floating power supply; and a bootstrap compensation circuit supplying a current from the floating power supply to the second terminal, when the high side drive circuit turns ON the high side switching element and the low side drive circuit turns OFF the low side switching element.

    摘要翻译: 功率半导体器件包括:高侧和低侧开关元件; 高侧和低侧驱动电路; 向高侧驱动电路供给驱动电压并具有与高侧开关元件和低侧开关元件之间的连接点连接的第一端子的自举电容器和连接到高侧驱动器的电源端子的第二端子 电路 引导二极管,其具有连接到电源的阳极和连接到第二端子的阴极,并且将电流从电源提供给第二端子; 浮动电源; 以及当所述高侧驱动电路导通所述高侧开关元件并且所述低侧驱动电路使所述低侧开关元件断开时,从所述浮动电源向所述第二端子供给电流的自举补偿电路。

    REACTOR
    54.
    发明申请
    REACTOR 有权
    反应堆

    公开(公告)号:US20110250102A1

    公开(公告)日:2011-10-13

    申请号:US13074912

    申请日:2011-03-29

    申请人: Kenji Sakai

    发明人: Kenji Sakai

    IPC分类号: B01J8/06

    摘要: There is provided a radial flow reactor having a multi-pass structure in which loading and unloading of granular packing are easy and which does not impair the reaction performance. The reactor includes, in an upright tubular reactor vessel: a packing region for housing a continuous packed bed of granular packing; and an outer and an inner passages disposed outside and inside the packing region, respectively, allowing a fluid to flow in the axial direction. The reactor is configured so that the fluid can pass between the packing region and the outer passage and between the packing region and the inner passage. The reactor further includes at least one of an outer partition structure and an inner partition structure. The outer partition structure includes: an outer partition plate partitioning the packing region in the axial direction with a gap allowing the granular packing to pass therethrough between the inner border of the packing region and the outer partition plate; and a blocking section for preventing the fluid from flowing through the outer passage in the axial direction. The inner partition structure includes: an inner partition plate partitioning the packing region in the axial direction with a gap allowing the granular packing to pass therethrough between the outer border of the packing region and the inner partition plate; and a blocking section for preventing the fluid from flowing through the inner passage in the axial direction.

    摘要翻译: 提供了一种具有多通道结构的径向流动反应器,其中颗粒填料的装载和卸载容易并且不损害反应性能。 反应器包括在直立的管式反应器容器中:用于容纳颗粒状填料的连续填充床的填充区域; 以及分别设置在填充区域的外部和内部的外部和内部通道,允许流体沿轴向流动。 反应器构造成使得流体可以在填充区域和外部通道之间以及填充区域和内部通道之间通过。 反应器还包括外分隔结构和内分隔结构中的至少一个。 外分隔结构包括:外隔板,其在轴向方向上分隔填料区域,间隙允许颗粒填料在填料区域的内边界与外隔板之间通过; 以及用于防止流体在轴向上流过外部通道的阻挡部。 内分隔结构包括:内隔板,其在轴向方向上分隔填料区域,间隙允许颗粒填料在填料区域的外边界与内隔板之间通过; 以及用于防止流体在轴向上流过内部通道的阻挡部。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    55.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    接线板及其制造方法

    公开(公告)号:US20110209911A1

    公开(公告)日:2011-09-01

    申请号:US12956826

    申请日:2010-11-30

    IPC分类号: H05K1/11

    摘要: A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.

    摘要翻译: 布线基板包括具有第一表面和第二表面的基底,穿过基底的第一穿透孔,形成在第一孔的内壁上的第一通孔导体,填充在第一导体内部并形成第二穿透孔 以及形成在所述第二孔中的第二通孔导体,在所述基板的第一表面上的第一导电电路,所述基板的第二表面上的第二导电电路,所述第二孔的一端上的第一导电部, 以及在所述第二穿透孔的相对端上的第二导电部分。 第一导体连接第一电路和第二电路。 第二导体由填充在第二孔中的导电材料制成,并且连接第一导电部分和第二导电部分。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    56.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    印刷线路板及其制造方法

    公开(公告)号:US20110048775A1

    公开(公告)日:2011-03-03

    申请号:US12857838

    申请日:2010-08-17

    IPC分类号: H05K1/00 H05K1/11 H05K3/00

    摘要: A printed wiring board includes a substrate having a first surface and a second surface on the opposite side of the first surface and multiple first penetrating holes, a first conductive portion formed on the first surface of the substrate and made of a first plated cover layer, a second conductive portion formed on the second surface of the substrate and made of a second plated cover layer, the second conductive portion being positioned opposite the first conductive portion, and multiple first through-hole conductors made of conductors formed in the multiple first penetrating holes, respectively, the multiple first through-hole conductors connecting the first conductive portion and the second conductive portion. The first conductive portion, the second conductive portion and the first through-hole conductors form a first through-hole connection section which sets up either a power-source through-hole conductor or a ground through-hole conductor.

    摘要翻译: 印刷电路板包括:具有在第一表面的相对侧上的第一表面和第二表面的基板和多个第一穿透孔;形成在基板的第一表面上并由第一镀覆覆盖层制成的第一导电部分, 第二导电部分,形成在基板的第二表面上,由第二镀覆覆盖层制成,第二导电部分与第一导电部分相对定位,多个第一通孔导体由形成在多个第一穿透孔中的导体 分别连接第一导电部和第二导电部的多个第一通孔导体。 第一导电部分,第二导电部分和第一通孔导体形成设置电源通孔导体或接地通孔导体的第一通孔连接部分。

    PLANETARY GEAR SYSTEM
    57.
    发明申请
    PLANETARY GEAR SYSTEM 审中-公开
    行星齿轮系统

    公开(公告)号:US20100285920A1

    公开(公告)日:2010-11-11

    申请号:US12680694

    申请日:2009-02-04

    IPC分类号: F16H57/08

    CPC分类号: B64C27/14 F16H1/30

    摘要: A planetary gear system contains: a sun gear as an input; a fixed ring gear; a planetary career as an output; and a planetary gear unit supported by the planetary career. The planetary gear unit includes: a shaft; a first planetary gear coupled to the shaft and engaging the sun gear; and a second planetary gear coupled to the shaft and engaging the ring gear. The planetary gear unit rotates around a first rotation axis with respect to the planetary career. The planetary career rotates around a second rotation axis. The first rotation axis intersects the second rotation axis.

    摘要翻译: 行星齿轮系统包括:作为输入的太阳齿轮; 固定齿圈; 行星生涯作为产出; 和行星齿轮单元,由行星职业支持。 行星齿轮单元包括:轴; 联接到所述轴并接合所述太阳齿轮的第一行星齿轮; 以及联接到所述轴并接合所述齿圈的第二行星齿轮。 行星齿轮单元相对于行星职业围绕第一旋转轴线旋转。 行星生涯围绕第二个旋转轴旋转。 第一旋转轴线与第二旋转轴线相交。

    Reactor
    58.
    发明授权
    Reactor 有权
    反应堆

    公开(公告)号:US07815874B2

    公开(公告)日:2010-10-19

    申请号:US12125339

    申请日:2008-05-22

    IPC分类号: F28D7/00

    摘要: A reactor including a reactor vessel and heat exchange tubes provided in the reactor vessel. The reactor vessel includes a tubesheet and is configured to receive a reaction fluid. The tubesheet has a first plate member configured to contact the reaction fluid and a second plate member configured to not contact the reaction fluid. Heat exchange tubes are provided in the reactor vessel and fixed to the first plate member. The heat exchange tubes are configured to receive a heat exchange medium. At least a portion of the first plate member configured to contact the reaction fluid is made of a metal that has a high corrosion-resistance against the reaction liquid, and the second plate member is made of a metal that has a low corrosion-resistance against the reaction liquid. The second plate member is detachably fixed to a remainder of the reactor vessel.

    摘要翻译: 包括反应器容器和设置在反应器容器中的热交换管的反应器。 反应器容器包括管板,并且构造成容纳反应流体。 管板具有构造成接触反应流体的第一板构件和构造成不接触反应流体的第二板构件。 热交换管设置在反应器容器中并固定到第一板构件。 热交换管被构造成接收热交换介质。 构成为接触反应流体的第一板状构件的至少一部分由对反应液体具有高耐腐蚀性的金属制成,第二板构件由耐腐蚀性低的金属制成 反应液体。 第二板构件可拆卸地固定到反应器容器的其余部分。