公开(公告)号：US20160278210A1

公开(公告)日：2016-09-22

申请号：US15070120

申请日：2016-03-15

Applicant: Japan Display Inc.

Inventor： Kazuto TSURUOKA ,  Norio OKU ,  Takuya NAKAGAWA

IPC: H05K1/14

CPC classification number: H05K1/144 ,  H05K1/0353 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/147 ,  H05K3/007 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/042 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/016 ,  H05K2203/0554 ,  H05K2203/107

Abstract: A display device includes a flexible insulating substrate, an insulating layer on the insulating substrate, and a plurality of terminals made of a conductive material on the insulating layer. The insulating layer is disposed outside the area located between the terminals. The insulating substrate has a groove between the terminals.

Abstract translation: 显示装置包括柔性绝缘基板，绝缘基板上的绝缘层，以及在绝缘层上由导电材料制成的多个端子。 绝缘层设置在位于端子之间的区域的外侧。 绝缘基板在端子之间具有凹槽。

公开(公告)号：US20160150634A1

公开(公告)日：2016-05-26

申请号：US14904551

申请日：2014-07-24

Applicant: LG CHEM, LTD.

Inventor： Ducksu OH ,  Sung Soo PARK ,  Minsoo KANG

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/028 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/049

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

Abstract translation: 提供了一种安装在显示装置的基板上的柔性印刷电路板。

公开(公告)号：US20150327368A1

公开(公告)日：2015-11-12

申请号：US14446605

申请日：2014-07-30

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/118 ,  H05K1/0215 ,  H05K1/113 ,  H05K1/144 ,  H05K2201/058

Abstract: An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.

Abstract translation: 公开了用于电连接重叠的柔性电路板的导电迹线的互连导电结构。 重叠的柔性电路板包括第一柔性电路板和第二柔性电路板。 在第二柔性电路板中形成通孔，并且在第二柔性电路板的通孔中填充互连导电部件。 互连导电构件电连接到第二柔性电路板的第二焊盘和第一柔性电路板的第一焊盘，以便在第一柔性电路板和第二柔性电路板的导电迹线之间形成重叠连接 板。

公开(公告)号：US20150222068A1

公开(公告)日：2015-08-06

申请号：US14683995

申请日：2015-04-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： David J. Braun ,  Mark G. Clark ,  John R. Dangler ,  Matthew S. Doyle ,  Thomas D. Kidd ,  Jason T. Stoll

IPC: H01R43/01 ,  H05K3/36

CPC classification number: H01R43/01 ,  H01R12/52 ,  H01R12/613 ,  H01R12/778 ,  H01R12/79 ,  H05K1/0219 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/36 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/058 ,  H05K2201/09181 ,  H05K2201/09618 ,  H05K2201/10189 ,  Y10T29/49174 ,  Y10T29/49194 ,  Y10T29/4922

Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.

Abstract translation: 一种电缆组件，用于通过连接到每个电路板的连接器组件将多个电路板互连在一起。 电缆组件包括具有第一端部的第一电缆和具有第二端部的第二电缆。 第一端部的第一周边具有沿着连接器组件的宽度方向共同形成列的多个第一半通孔。 第二端部的第二周边具有沿着连接器组件的宽度方向共同形成列的多个第二半通孔。 第一和第二端部联接在一起以形成连接单元，使得第一半通孔和第二半通孔连接在一起以形成完整的通孔。

公开(公告)号：US20150103500A1

公开(公告)日：2015-04-16

申请号：US14574492

申请日：2014-12-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han-Sung BAE ,  Wonkyu KWAK ,  Cheolgeun AN

IPC: H05K1/11 ,  H05K3/30 ,  H05K13/04 ,  H05K7/02

CPC classification number: H05K1/118 ,  G02F1/13458 ,  H01L23/49572 ,  H01L24/06 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H01L2225/107 ,  H05K1/111 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2203/04 ,  Y02P70/611

Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

Abstract translation: 提供了一种电子部件，其包括：焊盘区域，包括沿着相应的延伸线延伸并沿第一方向布置的多个焊盘;以及信号线，其被配置为从焊盘区域接收驱动信号，其中，所述多个焊盘包括多个焊盘 连续布置的第一垫片和连续布置的多个第二垫片，并且多个第一垫片的延伸线基本上会聚到第一点，并且多个第二垫片的延长线基本上会聚到不同于第一点的第二点。

公开(公告)号：US08491739B2

公开(公告)日：2013-07-23

申请号：US12878297

申请日：2010-09-09

Applicant: Philip R. Germann ,  Mark J. Jeanson

Inventor： Philip R. Germann ,  Mark J. Jeanson

IPC: B32B37/00

CPC classification number: B23K31/00 ,  B23K20/04 ,  B23K2103/16 ,  B32B37/0076 ,  B32B43/00 ,  B32B2457/08 ,  H05K3/328 ,  H05K3/368 ,  H05K3/4691 ,  H05K2201/058 ,  H05K2201/09109

Abstract: A method and apparatus are provided for implementing interleaved-dielectric joining of multi-layer laminates. First and second multi-layer laminates are provided, each having with a laminated portion and an unlaminated portion. The first and second multi-layer laminates are joined together at the unlaminated portions by interleaving a plurality of dielectric layers of the first and second multi-layer laminates. Respective conductors carried by adjacent dielectric layers are connected. The interleaved unlaminated portions are laminated together with heat and pressure, to create a larger laminate of the joined first and second multi-layer laminates.

Abstract translation: 提供了一种用于实现多层层压体的交错电介质接合的方法和装置。 提供第一和第二多层层叠体，每层具有层压部分和未层压部分。 第一和第二多层层叠体通过交织第一和第二多层层压体的多个介电层而在未层压部分连接在一起。 连接由相邻电介质层承载的各导线。 交织的未层压部分通过热和压力层压在一起，以形成接合的第一和第二多层层压体的较大层压体。

公开(公告)号：US08472142B2

公开(公告)日：2013-06-25

申请号：US11902253

申请日：2007-09-20

Applicant: MingGao Yao ,  YiRu Xie

Inventor： MingGao Yao ,  YiRu Xie

IPC: G11B5/60

CPC classification number: G11B5/4853 ,  G11B5/483 ,  H05K3/328 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/10234

Abstract: The present bonded structure uses metal ball to bond or weld the respective bonding surfaces of electrical pads which are arranged to face the same direction. The structure can be controlled visually and thus enables a high connection quality of no short circuit. In addition, the bonding operation of the bonded structure is carried out without using pressure, thus it will not damage surroundings of the electrical components. Accordingly, the manufacture yield is significantly improved and the cost is prominently reduced. The present invention also discloses a bonding method and a head gimbal assembly and a head stack assembly and a drive unit using the bonded structure.

Abstract translation: 本发明的接合结构使用金属球来接合或焊接被设置为面向相同方向的电焊盘的各个接合表面。 该结构可以视觉控制，从而实现无短路的高连接质量。 此外，接合结构的接合操作在不使用压力的情况下进行，因此不会损坏电气部件的周围环境。 因此，制造成品率显着提高，成本显着降低。 本发明还公开了一种接合方法和头部万向节组件以及使用该结合结构的磁头组合组件和驱动单元。

公开(公告)号：US08453314B2

公开(公告)日：2013-06-04

申请号：US13368248

申请日：2012-02-07

Applicant: Alberto F. Viscarra ,  Ethan S. Heinrich ,  Melvin S. Campbell ,  David T. Winslow ,  Kevin C. Rolston ,  Rosalio S. Vidaurri

Inventor： Alberto F. Viscarra ,  Ethan S. Heinrich ,  Melvin S. Campbell ,  David T. Winslow ,  Kevin C. Rolston ,  Rosalio S. Vidaurri

IPC: H01P11/00

CPC classification number: H05K3/0014 ,  H01Q1/38 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/058 ,  H05K2203/0113 ,  H05K2203/0353 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.

Abstract translation: 提供了一种制造折纸形天线辐射结构的方法。 在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道， 衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

公开(公告)号：US20130128474A1

公开(公告)日：2013-05-23

申请号：US13408821

申请日：2012-02-29

Applicant: JungYoul Kang ,  SeongHun Kim

Inventor： JungYoul Kang ,  SeongHun Kim

IPC: H05K1/00 ,  H05K7/00

CPC classification number: H05K1/0271 ,  G02F1/13 ,  G02F1/133 ,  H05K1/00 ,  H05K1/02 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/0281 ,  H05K2201/0154 ,  H05K2201/058 ,  H05K2201/09681 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/2009

Abstract: The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.

Abstract translation: 本公开公开了一种用于显示装置的驱动印刷电路板（PCB）。 更具体地，提供了通过防止PCB翘曲来改善接合的驱动印刷电路板。 后表面加强板包括多边形图案，以防止在表面安装技术（SMT）工艺期间由于与板的热收缩不同而导致驱动印刷电路板的PCB翘曲。

公开(公告)号：US08383947B2

公开(公告)日：2013-02-26

申请号：US12585101

申请日：2009-09-03

Applicant: Yoshitaka Sugiyama ,  Kenichi Hanazaki ,  Tomokatsu Aizawa

Inventor： Yoshitaka Sugiyama ,  Kenichi Hanazaki ,  Tomokatsu Aizawa

IPC: H05K1/00

CPC classification number: H01R12/61 ,  B23K13/01 ,  B23K20/06 ,  B23K2101/38 ,  H01R43/02 ,  H05K3/28 ,  H05K3/328 ,  H05K3/3494 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0382 ,  H05K2201/058 ,  H05K2203/101

Abstract: The present invention is intended to provide an enhanced conductor module capable of reducing a joint area between conductors, and a method for preparing the same. The conductor module has a pair of flattened circuits each of which comprises a rectangular shaped conductors, a pair of sheeted coverings disposed on both sides of the conductor, and at least one hole having a diameter smaller than a width of the conductor, and formed in the coverings so as to expose one surface of the conductor to outside the flattened circuit. The conductor of one flattened circuit is joined to the conductor of the other flattened circuit via the hole by application of electromagnetic welding.

Abstract translation: 本发明旨在提供能够减少导体之间的接合面积的增强导体模块及其制备方法。 导体模块具有一对扁平电路，每个扁平电路包括矩形导体，设置在导体两侧的一对片状覆盖物，以及直径小于导体宽度的至少一个孔，并形成在 覆盖物以使导体的一个表面暴露在扁平电路外部。 一个扁平电路的导体通过电磁焊接通过孔与另一个扁平电路的导体接合。