公开(公告)号：US08221132B2

公开(公告)日：2012-07-17

申请号：US12868370

申请日：2010-08-25

申请人： Myoungsoo Jeon ,  Attalee Snarr Taylor ,  John Joseph Consoli

发明人： Myoungsoo Jeon ,  Attalee Snarr Taylor ,  John Joseph Consoli

IPC分类号： H01R12/00

CPC分类号： H05K3/308 ,  H01R12/585 ,  H05K1/116 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10189

摘要： An electrical connector assembly includes a circuit board and an electrical connector mounted on the circuit board. The circuit board has a circuit board body having first and second surfaces and through-holes bored between the first and second surfaces. The circuit board has signal traces on internal layers of the circuit board that are generally parallel to the first and second surfaces. Portions of the circuit board body within the through-holes are etched away to expose portions of the signal traces beyond the circuit board body within the corresponding through-hole. The electrical connector includes a housing and signal terminals held by the housing. The signal terminals are received in respective through-holes of the circuit board and engage the corresponding signal traces.

摘要翻译： 电连接器组件包括电路板和安装在电路板上的电连接器。 电路板具有电路板主体，其具有在第一表面和第二表面之间钻孔的第一表面和第二表面以及通孔。 电路板在电路板的内层上具有通常平行于第一和第二表面的信号迹线。 蚀刻掉通孔内的电路板主体的部分，以将信号迹线的部分暴露在对应的通孔内的电路板主体之外。 电连接器包括壳体和由壳体保持的信号端子。 信号端子被接收在电路板的相应通孔中并与相应的信号迹线接合。

公开(公告)号：US20100052109A1

公开(公告)日：2010-03-04

申请号：US12261156

申请日：2008-10-30

申请人： Min Suk Suh

发明人： Min Suk Suh

IPC分类号： H01L29/40 ,  H01L23/52

CPC分类号： H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/13021 ,  H01L2224/13025 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/078 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/183 ,  H05K1/184 ,  H05K2201/092 ,  H05K2201/10674 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package includes a substrate including a substrate body having a first face and a second face opposing the first face. A first through electrode passes through the substrate body between the first face and the second face. An insulation member is disposed over the first face; and a connection member having a first conductive unit disposed inside of the insulation member is electrically connected to the first through electrode, and 10 a second conductive unit electrically connected to the first conductive unit is exposed at side faces of the insulation member. A semiconductor chip having third and fourth faces is disposed over the first face of the substrate body in a vertical direction. A second through electrode passes through the substrate body between the third and fourth faces and is electrically connected to the second conductive unit.

摘要翻译： 半导体封装包括：衬底，其包括具有第一面的衬底主体和与第一面相对的第二面。 第一穿透电极在第一面和第二面之间通过衬底本体。 绝缘构件设置在第一面上; 并且具有设置在所述绝缘构件内部的第一导电单元的连接构件与所述第一通孔电连接，并且与所述第一导电单元电连接的第二导电单元在所述绝缘构件的侧面露出。 具有第三和第四面的半导体芯片在垂直方向上设置在基板主体的第一面上。 第二穿透电极在第三和第四面之间通过衬底主体并且电连接到第二导电单元。

公开(公告)号：US20080169121A1

公开(公告)日：2008-07-17

申请号：US12000335

申请日：2007-12-11

申请人： Mitsuo Suehiro

发明人： Mitsuo Suehiro

IPC分类号： H05K1/03 ,  H01L21/00 ,  G01R27/00

CPC分类号： G01R31/048 ,  H05K1/0268 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/092 ,  H05K2201/09781 ,  H05K2203/163

摘要： A through bore penetrates through a substrate. The through bore defines a space surrounded by an insulating wall surface. A lead terminal of an electronic component is received in the through bore. An electrically-conductive body is placed in the through bore to extend to an exposed portion at the surface of the substrate. An auxiliary electrically-conductive body is exposed in the space of the through bore for connection to the electrically-conductive body. The auxiliary electrically-conductive body extends to an exposed portion at the surface of the substrate. The lead terminal contacts with an electrically-conductive body in the through bore. Electrical conduction is detected between the lead terminal and the auxiliary electrically-conductive body for detecting the rising level of the electrically-conductive body. When such electric conduction is detected, the electrically-conductive body is supposed to reach the level of the auxiliary electrically-conductive body.

摘要翻译： 通孔穿过基底。 通孔限定了由绝缘壁表面包围的空间。 电子部件的引线端子被容纳在通孔中。 导电体放置在通孔中以延伸到衬底表面处的暴露部分。 辅助导电体暴露在通孔的空间中以连接到导电体。 辅助导电体延伸到衬底表面处的暴露部分。 引线端子与通孔中的导电体接触。 在引线端子和辅助导电体之间检测导电以检测导电体的上升水平。 当检测到这种导电时，假设导电体达到辅助导电体的高度。

公开(公告)号：US20070072447A1

公开(公告)日：2007-03-29

申请号：US11559928

申请日：2006-11-15

申请人： Galliano Busletta ,  Robert Roessler

发明人： Galliano Busletta ,  Robert Roessler

IPC分类号： H05K1/00

CPC分类号： H05K1/165 ,  H01F2027/2819 ,  H05K3/429 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2201/09645

摘要： The present invention provides a PWB for attaching electrical components thereto. The PWB includes a stack of insulating layers, conductive layers located between the insulating layers, wherein the conductive layers terminate at an edge of the PWB, and an edge plate interconnect located on the edge. The edge plate interconnect is free of a complementary via and contacts and electrically interconnects the conductive layers. The present invention also provides a method of making the PWB and also provides a power converter implementing the edge plate interconnects.

摘要翻译： 本发明提供一种用于将电气部件附接到其上的PWB。 PWB包括堆叠的绝缘层，位于绝缘层之间的导电层，其中导电层终止于PWB的边缘，以及位于边缘上的边缘板互连。 边缘板互连件没有互补的通孔和触点，并且电连接导电层。 本发明还提供一种制造PWB的方法，并且还提供实现边缘板互连的功率转换器。

公开(公告)号：US20060127652A1

公开(公告)日：2006-06-15

申请号：US11297358

申请日：2005-12-09

申请人： Yasuhiko Kanaya ,  Akira Irie ,  Katsuhiro Nagasawa ,  Toru Yuki

发明人： Yasuhiko Kanaya ,  Akira Irie ,  Katsuhiro Nagasawa ,  Toru Yuki

IPC分类号： B32B3/10 ,  B32B3/00 ,  B32B18/00 ,  C04B35/64

CPC分类号： H05K3/429 ,  H05K1/0268 ,  H05K3/0047 ,  H05K2201/092 ,  H05K2201/09718 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/163 ,  H05K2203/175 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926

摘要： There is provided a multi-layered circuit board and a manufacturing method of the multi-layered circuit board that allows electronic parts to be mounted adequately and that will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. A depth of the hole is set based on that the tool electrically conducts with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.

摘要翻译： 提供了一种多层电路板和多层电路板的制造方法，其允许电子部件被适当地安装，并且不会妨碍电子部件的性能。 要安装在多层电路板的表面上的电子部件的电源端子（销）插入到电镀通孔中以与第一导电层连接。 在第一导电层的背面的第二导电层上设置有具有与通孔同轴并且其直径大于通孔的检测孔的检测部。 在第二导电层和工具之间施加电压时，具有大直径的孔由工具沿着通孔从背面形成。 基于工具与检测孔电导通，设定孔的深度。 通孔的不必要的板可以被大孔除去。

公开(公告)号：US20010023781A1

公开(公告)日：2001-09-27

申请号：US09817947

申请日：2001-03-27

发明人： Shigetsugu Muramatsu ,  Kazunari Imai

IPC分类号： H05K001/16

CPC分类号： H05K3/3447 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/4602 ,  H05K2201/092 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/1394 ,  Y10T29/49139

摘要： A substrate for mounting an electronic part or parts thereon, which comprises a core substrate and at least a set of insulation layer and patterned wiring line layer, which is formed on the insulation layer, at at least one side of the core substrate, the core substrate having holes, in each of which a lead pin of the electronic part to be mounted is to be inserted, and being provided with lands which surround the opening of the hole and to which the lead pin inserted in the hole is to be bonded, wherein the insulation layer or layers at at least one side of the core substrate has bores, which expose the land at their bottoms, and communicate with the hole. A method of manufacturing such a substrate is also disclosed.

摘要翻译： 一种用于安装其上的电子部件的基板，其包括在所述芯基板的至少一侧上形成在所述绝缘层上的芯基板和至少一组绝缘层和图案化布线线层，所述芯 具有孔的基板，其中每个要安装的电子部件的引脚插入，并且设置有围绕孔的开口的焊盘，插入孔中的引脚与引脚抵接， 其中所述芯基板的至少一侧的所述绝缘层或多个孔具有孔，其在其底部暴露所述焊盘并与所述孔连通。 还公开了制造这种基板的方法。

公开(公告)号：US6127025A

公开(公告)日：2000-10-03

申请号：US21772

申请日：1998-03-10

申请人： Anilkumar Chinuprasad Bhatt ,  Donald Herman Glatzel ,  Allen F. Moring ,  Voya Rista Markovich ,  Kostas Papathomas ,  David John Russell

发明人： Anilkumar Chinuprasad Bhatt ,  Donald Herman Glatzel ,  Allen F. Moring ,  Voya Rista Markovich ,  Kostas Papathomas ,  David John Russell

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/24 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B15/00

CPC分类号： H05K3/4652 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4602 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/12044 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/092 ,  H05K2201/0959 ,  H05K2203/0191 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0554 ,  H05K3/0023 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/246 ,  H05K3/429 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/249996

摘要： Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil and a peelable film to the substrate, and forming holes in the substrate through the peelable film and foil. A filler material with an organic base may be filled with electroconductive particles or dielectric thermoconductive particles. The filler material is deposited onto a sacrificial carrier and the filler material is heated to at least partially cure it. The filler material is laminated onto the peelable film with sufficient heat and pressure to force the filler material to fill the holes. For thermoconductive filler the holes are filled sufficient for electrical connection through the holes. The peelable layer, sacrificial carrier and filler material remaining therebetween are peeled off the copper foil. The filler material is abraded to the level of the foil and is then copper plated. The copper is patterned to form a wiring layer. A permanent dielectric photoresist layer is formed over the wiring layer and via holes are formed through the photoimagable dielectric over pads and conductors of the wiring layer. Holes are formed through the substrate and the photoimagable dielectric, walls of the via holes, and walls of the through holes are copper plated. The copper plating on the photoimagable dielectric is patterned to form an exterior wiring layer which is covered by solder resist with windows over lands around the through holes and surface mount connection pads of the exterior wiring layer to form a high density circuitized substrate. Surface mount components and/or pin in hole components are attached to the circuitized substrate with solder joints between terminals of the components and the lands and/or connection pads to form a high density circuit board assembly. One or more of the circuit board assemblies are mounted in an enclosure with a power supply, CPU, RAM, and I/O means to form an improved information handling system with increased performance due to shorter signal flight times due to the high component density.

公开(公告)号：US6000129A

公开(公告)日：1999-12-14

申请号：US41845

申请日：1998-03-12

申请人： Anilkumar Chinuprasad Bhatt ,  Donald Herman Glatzel ,  Allen F. Moring ,  Voya Rista Markovich ,  Kostas Papathomas ,  David John Russell

发明人： Anilkumar Chinuprasad Bhatt ,  Donald Herman Glatzel ,  Allen F. Moring ,  Voya Rista Markovich ,  Kostas Papathomas ,  David John Russell

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/24 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/4652 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4602 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/12044 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/092 ,  H05K2201/0959 ,  H05K2203/0191 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0554 ,  H05K3/0023 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/246 ,  H05K3/429 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/249996

摘要： Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil to the substrate, and forming holes in the substrate through the foil. A filler material with an organic base may be filled with electroconductive particles or dielectric thermoconductive particles. The filler material is deposited into the holes and is heated to at least partially cure it. The surface of the filler material is seeded and electrolessly plated to form a conductive coating on the metal foil and the filler material. The coating is then patterned to form a wiring layer. A second set of holes may be formed in the circuitized substrate after the hole filling step, which are also electrolessly plated.

摘要翻译： 电路板通过形成具有电介质表面的基板，将金属箔层压到基板上，并通过箔形成在基板中的孔来制造。 具有有机基底的填充材料可以填充有导电颗粒或介电导热颗粒。 填充材料沉积到孔中并被加热至少部分地固化。 填充材料的表面接种并化学镀，以在金属箔和填料上形成导电涂层。 然后将涂层图案化以形成布线层。 可以在孔填充步骤之后的电路化基板中形成第二组孔，其也是无电镀的。

公开(公告)号：US5822856A

公开(公告)日：1998-10-20

申请号：US672292

申请日：1996-06-28

申请人： Anilkumar Chinuprasad Bhatt ,  Donald Herman Glatzel ,  Allen F. Moring ,  Voya Rista Markovich ,  Kostas Papathomas ,  David John Russell

发明人： Anilkumar Chinuprasad Bhatt ,  Donald Herman Glatzel ,  Allen F. Moring ,  Voya Rista Markovich ,  Kostas Papathomas ,  David John Russell

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/24 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K3/30

CPC分类号： H05K3/4652 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4602 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/12044 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/092 ,  H05K2201/0959 ,  H05K2203/0191 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0554 ,  H05K3/0023 ,  H05K3/0094 ,  H05K3/025 ,  H05K3/246 ,  H05K3/429 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/249996

摘要： Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil and a peelable film to the substrate, and forming holes in the substrate through the peelable film and foil. A filler material with an organic base may be filled with electroconductive particles or dielectric thermoconductive particles. The filler material is laminated onto the peelable film with sufficient heat and pressure to force the filler material to fill the holes. For thermoconductive filler the holes are filled sufficient for electrical connection through the holes. The filler material is abraded to the level of the foil and is then copper plated. The copper is patterned to form a wiring layer. A permanent dielectric photoresist layer is formed over the wiring layer and via holes are formed through the photoimageable dielectric over pads and conductors of the wiring layer. Holes are formed through the substrate and the photoimageable dielectric, walls of the via holes, and walls of the through holes are copper plated. The copper plating on the photoimageable dielectric is patterned of form an exterior wiring layer. Components and/or pins are attached to the surface of the circuitized substrate with solder joints to form a high density circuit board assembly.

摘要翻译： 通过形成具有电介质表面的基板，将金属箔和可剥离膜层压到基板上，通过可剥离膜和箔形成在基板中的孔来制造电路板。 具有有机基底的填充材料可以填充有导电颗粒或介电导热颗粒。 填充材料以足够的热和压力层压到可剥离膜上，以迫使填充材料填充孔。 对于导热填料，孔充满足以通过孔电连接。 填充材料磨损到箔的水平面，然后镀铜。 铜被图案化以形成布线层。 在布线层之上形成永久介电光致抗蚀剂层，并且通过布线层的焊盘和导体上的可光成像电介质形成通孔。 通过基板形成孔，并且可光成像的电介质，通孔的壁和通孔的壁是镀铜的。 可光成像电介质上的镀铜图案化为外部布线层。 组件和/或引脚通过焊接接头附接到电路化基板的表面以形成高密度电路板组件。

公开(公告)号：US4775573A

公开(公告)日：1988-10-04

申请号：US34791

申请日：1987-04-03

申请人： Joseph A. Turek

发明人： Joseph A. Turek

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/24 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/4664 ,  H05K1/116 ,  H05K1/162 ,  H05K1/095 ,  H05K2201/0209 ,  H05K2201/092 ,  H05K2201/09309 ,  H05K2203/044 ,  H05K2203/0571 ,  H05K3/243 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3468 ,  H05K3/3473 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4602 ,  Y10S428/901 ,  Y10T428/24917

摘要： A multilayer printed circuit board which reliably and economically marries conventional copper clad printed circuit board technology with polymeric conductors and insulators. Reliability is enhanced by forming all solder pads of copper, providing conductive tails on solder pads which are to be connected by polymeric inks, and ultimately forming a solder resist over all but the solder pads. As a result, polymer inks can be applied to both sides of the board, and the completed board can be subject to conventional solder dipping or wave soldering operations. According to one feature of the invention, a thin dielectric layer can be applied as intermediate to planar conductive layers which form a power plane having built-in distributed capacitance for decoupling.

摘要翻译： 一种多层印刷电路板，可靠且经济地将传统的铜包层印刷电路板技术与聚合物导体和绝缘体结合在一起。 通过形成铜的所有焊盘来提高可靠性，在焊盘上提供导电尾部，这些焊盘将通过聚合物墨水连接，并最终在除焊盘之外的所有焊料上形成阻焊剂。 结果，可以将聚合物油墨施加到板的两侧，并且完成的板可以进行常规的焊料浸渍或波峰焊操作。 根据本发明的一个特征，可以将薄介电层作为中间层应用于形成具有用于去耦的内置分布电容的功率平面的平面导电层。