中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

2294 records (took 0.054 seconds)

    PACKAGE MODULE
    51.
    发明申请
    PACKAGE MODULE 审中-公开
    包装模块

    公开(公告)号：US20160374223A1

    公开(公告)日：2016-12-22

    申请号：US15067146

    申请日：2016-03-10

    Applicant: Delta Electronics (Shanghai) Co., Ltd.

    Inventor： Hai-Bin XU ,  Tao WANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

    IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18

    CPC classification number: H05K3/30 ,  H05K3/284 ,  H05K5/064 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10636 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y02P70/611

    Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.

    Abstract translation: 封装模块包括电路板，布置在电路板上的电子部件，邻近电子部件的至少一侧设置的框架和密封剂。 在框架和电子部件之间形成间隙。 密封剂包括覆盖电路板的至少一部分的第一部分和填充到间隙的至少一部分中的第二部分。 第一部分具有相对于电路板的第一高度，并且第二部分具有相对于电路板的第二高度，其中第二高度大于第一高度。

    Component-embedded resin substrate
    52.
    发明授权
    Component-embedded resin substrate 有权
    部件嵌入式树脂基板

    公开(公告)号：US09526176B2

    公开(公告)日：2016-12-20

    申请号：US14246682

    申请日：2014-04-07

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Norio Sakai ,  Yoshihito Otsubo

    IPC: H05K1/18 ,  H01L23/498 ,  H01L23/50 ,  H01L23/00 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03

    CPC classification number: H05K1/183 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2924/12042 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/186 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0195 ,  H05K2201/09027 ,  H05K2201/10507 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A component-embedded resin substrate includes a resin structure including a plurality of laminated resin layers and having an end surface surrounding an outer periphery of the resin layers and a plurality of embedded components arranged as embedded in the resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a planar view, the first embedded component has a first outer side extending along a portion of an end surface 5 closest to the first embedded component. When viewed in a planar view, the second embedded component has a second outer side extending along a portion of the end surface closest to the second embedded component. When viewed in a planar view, the outer side is oblique to the second outer side.

    Abstract translation: 嵌入树脂组件的树脂基板包括树脂结构体，该树脂结构体包括多个层压树脂层，并且具有围绕树脂层的外周的端面和嵌入树脂结构体中的多个嵌入部件。 多个嵌入式组件包括第一嵌入组件和第二嵌入组件。 当在平面视图中观察时，第一嵌入部件具有沿最靠近第一嵌入部件的端面5的一部分延伸的第一外侧。 当在平面视图中观察时，第二嵌入部件具有沿最靠近第二嵌入部件的端表面的一部分延伸的第二外侧。 当在平面图中观察时，外侧与第二外侧倾斜。

    SEMICONDUCTOR DEVICE
    54.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20160343915A1

    公开(公告)日：2016-11-24

    申请号：US15158139

    申请日：2016-05-18

    Applicant: NICHIA CORPORATION

    Inventor： Ryosuke WAKAKI

    IPC: H01L33/48 ,  H01L33/24 ,  H01L33/62

    CPC classification number: H01L33/62 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A semiconductor device includes a mounting substrate with a land having a first surface and a second surface higher than the first surface, a side-emission type light emitting device including an external connecting terminal disposed on the first surface, and a bonding member disposed at least on the second surface to bond the external connecting terminal and the land.

    Abstract translation: 半导体器件包括：具有第一表面和第二表面的焊盘的安装基板，包括设置在第一表面上的外部连接端子的侧面发光型发光器件，以及至少设置在第一表面上的接合部件 在第二表面上连接外部连接端子和焊盘。

    WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    56.
    发明申请
    WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    具有内置电子元件的接线板及其制造方法

    公开(公告)号：US20160316566A1

    公开(公告)日：2016-10-27

    申请号：US15138792

    申请日：2016-04-26

    Applicant: IBIDEN CO., LTD.

    Inventor： Kenji SAKAI ,  Tomoyuki IKEDA ,  Toshiki FURUTANI

    IPC: H05K1/18 ,  H05K3/46 ,  H05K3/32 ,  H05K1/02

    CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H05K1/0298 ,  H05K3/32 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09009 ,  H05K2201/09536 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611

    Abstract: A wiring board includes electronic components, a multilayer core substrate including insulating layers and conductive layers such that the insulating layers include a central insulating layer in the center position of the core in the thickness direction, a first build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core, and a second build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core. The core has cavities accommodating the electronic components, respectively, and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness direction and are penetrating through the central layer at centers of the first and second cavities in the thickness direction.

    Abstract translation: 布线板包括电子部件，包括绝缘层和导电层的多层芯基板，使得绝缘层包括在芯的厚度方向的中心位置的中心绝缘层，包括绝缘层的第一累积层和 导电层，使得所述绝缘层具有与所述芯中的绝缘层的树脂组合物不同的树脂组合物，以及包括绝缘层和导电层的第二堆积层，使得所述绝缘层具有与所述绝缘层不同的树脂组合物 核心中的绝缘层。 芯具有分别容纳电子元件的空腔，并且包括第一空腔和第二空腔，使得第一和第二空腔在厚度方向上具有不同的长度，并且在第一和第二空腔的中心穿过中心层 厚度方向。

    Embedded multilayer ceramic electronic component and printed circuit board having the same
    57.
    发明授权
    Embedded multilayer ceramic electronic component and printed circuit board having the same 有权
    嵌入式多层陶瓷电子部件和具有该嵌入式多层陶瓷电子部件的印刷电路板

    公开(公告)号：US09424989B2

    公开(公告)日：2016-08-23

    申请号：US14146590

    申请日：2014-01-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hye Seong Kim ,  Eun Hyuk Chae ,  Hai Joon Lee ,  Young Don Choi ,  Jin Sung Kim

    IPC: H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H05K1/18

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/2325 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: An embedded multilayer ceramic electronic component includes a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second internal electrodes, and first and second external electrodes, wherein the first external electrode includes a first base electrode electrically connected to the first internal electrode, a first intermediate layer, and a first terminal electrode, the second external electrode includes a second base electrode electrically connected to the second internal electrode, a second intermediate layer, and a second terminal electrode, the first and second base electrodes include a first conductive metal and glass, and the first and second terminal electrodes are formed of a second conductive metal.

    Abstract translation: 嵌入式多层陶瓷电子部件包括：陶瓷体，其包括电介质层，具有第一和第二主表面，第一和第二侧表面以及第一和第二端面，第一和第二内部电极以及第一和第二外部电极，其中， 第一外部电极包括与第一内部电极电连接的第一基极，第一中间层和第一端子电极，第二外部电极包括与第二内部电极电连接的第二基极，第二中间层和 第二端子电极，第一和第二基极包括第一导电金属和玻璃，第一和第二端子电极由第二导电金属形成。

Patent Agency Ranking