公开(公告)号：US20160023292A1

公开(公告)日：2016-01-28

申请号：US14806992

申请日：2015-07-23

申请人： MITSUBISHI HEAVY INDUSTRIES, LTD.

发明人： Kosuke NISHIKAWA ,  Hiroyuki KOBAYASHI ,  Hiroyasu MANAKO

IPC分类号： B23K1/00 ,  B23K3/04 ,  B23K35/30 ,  B23K35/32 ,  C25D7/04 ,  C25D5/12 ,  C25D5/50 ,  C25D3/50 ,  C25D3/48 ,  C25D3/46 ,  C25D3/38 ,  C25D3/12 ,  C25D17/02 ,  C23C26/02 ,  C23C18/48 ,  C23C18/42 ,  C23C18/16 ,  B23K1/19

CPC分类号： C23C18/1632 ,  B23K1/19 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/322 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/22 ,  C23C18/42 ,  C23C18/48 ,  C23C28/023 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/48 ,  C25D3/50 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  C25D7/04 ,  C25D17/02

摘要： A joining method for joining a first member and a second member is provided. The joining method includes a step of providing a first brazing layer on the first member by plating, a step of providing a second brazing layer on the first brazing layer by plating, a step of arranging the first member and the second member to oppose each other across the first brazing layer and the second brazing layer, and a step of melting the first brazing layer and the second brazing layer to join the first member and the second member which are arranged to oppose each other.

摘要翻译： 提供了一种用于接合第一构件和第二构件的接合方法。 接合方法包括通过电镀在第一构件上设置第一钎焊层的步骤，通过电镀在第一钎焊层上提供第二钎焊层的步骤，将第一构件和第二构件布置成彼此相对的步骤 横跨第一钎焊层和第二钎焊层，以及熔化第一钎焊层和第二钎焊层以使第一构件和第二构件彼此相对布置的步骤。

公开(公告)号：US20150083599A1

公开(公告)日：2015-03-26

申请号：US14492253

申请日：2014-09-22

申请人： SMS Meer GmbH

发明人： Thomas WINTERFELDT ,  Michael SCHWARZE ,  Hardy JUNGEN

IPC分类号： C25D1/00 ,  B05D3/02 ,  C25D17/10 ,  B22D7/06 ,  C25D17/02 ,  B05B3/00 ,  B05D1/02

CPC分类号： C25D1/00 ,  B05B3/00 ,  B05D1/02 ,  B05D3/0254 ,  B22C3/00 ,  B22C23/02 ,  B22D5/02 ,  B22D25/04 ,  C25D17/02 ,  C25D17/10

摘要： In a method for the production of semi-finished copper products, first copper is melted and cast to produce copper anodes, in one casting procedure, within multiple ingot molds, subsequently copper cathodes are formed by electrolysis, using at least one of the copper anodes, and then these copper cathodes are processed further to produce semi-finished copper products. A long-term coating is applied to at least one of the ingot molds as a wash, a sulfur-free wash is applied to the ingot mold and/or part of the work pieces cast in the ingot molds is directly processed further to produce semi-finished copper products. A method and an apparatus applies a wash to an ingot mold and a system produces semi-finished copper products.

摘要翻译： 在生产半成品铜产品的方法中，首先将铜熔化并铸造以在一个铸造过程中在多个锭模具中生产铜阳极，随后通过电解形成铜阴极，使用至少一个铜阳极 ，然后将这些铜阴极进一步加工成半成品铜制品。 将长期涂层作为洗涤剂施加到铸锭模具中的至少一个，将无硫洗涤剂施加到锭模具和/或铸造在铸模中的部分工件进一步直接加工成半成品 - 铜制品。 一种方法和装置对铸锭模具进行洗涤，并且系统产生半成品铜制品。

公开(公告)号：US08961771B2

公开(公告)日：2015-02-24

申请号：US13559494

申请日：2012-07-26

申请人： Rajesh Baskaran ,  Robert W. Batz, Jr. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

发明人： Rajesh Baskaran ,  Robert W. Batz, Jr. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

IPC分类号： C25D7/12 ,  C25D17/00 ,  C25D17/02 ,  C25D21/12

CPC分类号： C25D7/12 ,  C25D5/00 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02 ,  C25D21/12

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.

摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。

公开(公告)号：US20150034489A1

公开(公告)日：2015-02-05

申请号：US14375041

申请日：2013-02-12

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Takeshi Hatta ,  Akihiro Masuda

IPC分类号： C25D17/02 ,  C25D3/56 ,  C25D21/18

CPC分类号： C25D17/02 ,  C25D3/56 ,  C25D3/60 ,  C25D17/002 ,  C25D21/14 ,  C25D21/18

摘要： To provide a method of electroplating with Sn-alloy in which a problem of deposition of metals on an anode when electroplating with Sn-alloy such as Sn—Ag based-alloy or the like is performed is solved and a soluble anode is enabled to be used. Dividing an inside of a plating tank into a cathode cell and an anode cell by an anion-exchange membrane; supplying plating solution including Sn ions to the cathode cell; supplying acid solution to the anode cell; electroplating by energizing an object to be plated in the cathode cell and an anode made of Sn in the anode cell; and using the acid solution including Sn ions liquated out form the anode made of Sn along with progress of plating as replenishing solution of Sn ions for plating solution in the cathode cell.

摘要翻译： 为了提供一种利用Sn合金进行电镀的方法，其中进行使用诸如Sn-Ag基合金等的Sn合金进行电镀时在阳极上沉积金属的问题，并且使可溶性阳极能够 用过的。 通过阴离子交换膜将镀槽内部分成阴极电池和阳极电池; 向阴极电池供给包含Sn离子的镀液; 向阳极电池供应酸溶液; 通过对在阴极单元中被镀覆的物体进行激励和在阳极单元中由Sn制成的阳极进行电镀; 并且使用包含从Sn形成的阳极液化的Sn离子的酸溶液和电镀的进行作为用于阴极电池中的电镀溶液的Sn离子的补充溶液。

公开(公告)号：US20140238448A1

公开(公告)日：2014-08-28

申请号：US14189468

申请日：2014-02-25

申请人： Frédéric VACHERON

发明人： Frédéric VACHERON

IPC分类号： C25D17/06 ,  C25D17/02

CPC分类号： C25D17/06 ,  B05C3/04 ,  B05C3/09 ,  B05C3/10 ,  C25D17/02

摘要： Installation for surface treatment of parts. The installation includes at least one treatment tank containing a processing liquid in which an arm carrying on one of its ends at least one part support comprising a lower surface and an upper surface holding the parts to be treated is at least partially immersed. The arm is rotationally mounted about an axis located on the outside of the tank and in an area below the area formed by the upper end edge of the tank.

摘要翻译： 安装表面处理零件。 该装置包括至少一个含有处理液体的处理槽，其中承载其一个端部的臂至少包括一个下表面的部分支撑件和保持待处理部件的上表面至少部分地浸没。 臂围绕位于罐外侧的轴旋转安装，并位于由罐的上端边缘形成的区域下方。

公开(公告)号：US20140102906A1

公开(公告)日：2014-04-17

申请号：US13650350

申请日：2012-10-12

申请人： Gennady Volkov ,  David Olshanetskiy

发明人： Gennady Volkov ,  David Olshanetskiy

IPC分类号： C25D17/06 ,  C25D17/02 ,  C25D17/16 ,  C25D5/04 ,  C25D5/02

CPC分类号： C25D5/02 ,  C25D17/06 ,  C25D17/28

摘要： This invention relates generally to an apparatus and method for electroplating selected portions of a connector part, such as a pin or a socket. The selective plating apparatus of the present invention is capable of continuously depositing plating solution on precisely the right contact surface of the connector part irrespective of its shape and center of gravity. According to the preferred embodiment of the present invention, the selective plating apparatus is capable of plating either side of the connector part, such as a pin or a socket, allowing plating of different type of metals on each side of the machined or stamped parts. The parts are handled automatically with minimum physical stress resulting in more consistent and reliable plating deposits.

摘要翻译： 本发明一般涉及一种用于电镀连接器部分（例如销或插座）的选定部分的装置和方法。 本发明的选择性镀覆装置能够连续地将电镀溶液沉积在连接器部分的右接触面上，而不管其形状和重心如何。 根据本发明的优选实施例，选择性电镀装置能够对诸如针或插座的连接器部分的任一侧进行电镀，从而允许在加工或冲压部件的每一侧上镀覆不同类型的金属。 零件以最小的物理应力自动处理，导致更一致和可靠的电镀沉积。

公开(公告)号：US08545687B2

公开(公告)日：2013-10-01

申请号：US12602703

申请日：2008-06-03

申请人： Reinhard Schneider ,  Henry Kunze ,  Ferdinand Wiener

发明人： Reinhard Schneider ,  Henry Kunze ,  Ferdinand Wiener

IPC分类号： C25D5/04 ,  C25D5/08 ,  C25D21/10 ,  C25D17/06 ,  C25D17/02 ,  C25D7/12

CPC分类号： C25D5/08 ,  C25D5/04 ,  C25D17/001 ,  C25D21/10 ,  H05K3/241 ,  H05K2203/0746 ,  H05K2203/1509

摘要： Apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes devices 40, 42 for retaining the product L in the apparatus, one or more flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or more counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, eccentric motor means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed in the treatment agent during treatment.

摘要翻译： 用于使用处理剂电解处理产品L的装置用于使板状产品的处理更均匀。 该装置包括用于将产品L保持在设备中的装置40,42，一个或多个流动装置10，每个流动装置10包括至少一个喷嘴15并且设置成与产品L相对设置，一个或多个对电极30是惰性的 相对于处理剂并且平行于至少一个处理表面设置的偏心马达装置，用于在另一方的产品L和流动装置10和/或对置电极30之间产生相对运动44 在平行于处理表面的至少一个方向上。 产品L可以在处理过程中浸入处理剂中。

公开(公告)号：US08518224B2

公开(公告)日：2013-08-27

申请号：US12734438

申请日：2007-11-02

申请人： Yue Ma ,  Xi Wang ,  Yunwen Huang ,  Zhenxu Pang ,  Voha Nuch ,  David Wang

发明人： Yue Ma ,  Xi Wang ,  Yunwen Huang ,  Zhenxu Pang ,  Voha Nuch ,  David Wang

IPC分类号： C25D17/00 ,  C25D17/02 ,  C25D21/04 ,  C25D7/12

CPC分类号： C25D17/00 ,  C25D17/001 ,  C25D17/10 ,  C25D21/04

摘要： The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose surface is made into pleated channels is implemented for gas removal by collecting small bubbles, coalescing them, and releasing the residual gas. A buffer zone built within the gas bubble collector further allows unstable microscopic bubbles to dissolve.

摘要翻译： 本发明提供具有多个阳极区和阴极区的电镀装置。 每个区域内的电解液流场都由独立的流量控制装置单独控制。 其表面形成打褶通道的气泡收集器通过收集小气泡，聚结并释放残留气体来实现气体去除。 内置在气泡收集器内的缓冲区还允许不稳定的微小气泡溶解。

公开(公告)号：US08398827B2

公开(公告)日：2013-03-19

申请号：US13532016

申请日：2012-06-25

申请人： Mamoru Kawashita ,  Fumiyasu Nomura ,  Shintaro Kuge ,  Toru Miyake

发明人： Mamoru Kawashita ,  Fumiyasu Nomura ,  Shintaro Kuge ,  Toru Miyake

IPC分类号： C25D17/28 ,  C25D17/02 ,  C25D17/04 ,  C25D17/06

CPC分类号： H05K3/241 ,  C25D7/00 ,  C25D7/0657 ,  C25D17/005 ,  H05K1/0393 ,  H05K2203/1545

摘要： Two rotating members placed to face each other and nipping a web such that only an end of the web provided with conductivity is pressed are provided, at least one of the rotating members serves as a feeding electrode, and these rotating members are rotated about the same velocity to a transportation velocity of the web.

摘要翻译： 两个旋转构件被设置为彼此面对并且夹住腹板，使得只有具有导电性的腹板的一端被按压，至少一个旋转构件用作馈送电极，并且这些旋转构件旋转大约相同 速度到网的运输速度。

公开(公告)号：US08293092B2

公开(公告)日：2012-10-23

申请号：US11912591

申请日：2006-04-26

申请人： Karlheinz Arzt ,  Jens-Eric Geissler

发明人： Karlheinz Arzt ,  Jens-Eric Geissler

IPC分类号： C25D3/22 ,  C25D17/02

CPC分类号： C25D3/565 ,  C25D17/002 ,  C25D21/22

摘要： There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane.

摘要翻译： 描述了一种用于在具有阳极和阴极的衬底上沉积锌合金的碱性电镀浴，其中阳极区域和阴极区域通过过滤膜彼此分离。