公开(公告)号：US07625781B2

公开(公告)日：2009-12-01

申请号：US11354391

申请日：2006-02-15

Applicant: Gottfried Beer

Inventor： Gottfried Beer

IPC: H01L21/44

CPC classification number: H01L23/5389 ,  H01L21/288 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/48 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/24226 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device having a plastic housing and external connections, and to a method for producing the same is disclosed. In one embodiment, the plastic housing has a housing external contour made of plastic external areas with a top side, an underside opposite to the top side, and edge sides. Lower external contact areas are arranged on the underside and upper external contact areas are arranged on the top side. Furthermore, the plastic housing has external conductor tracks along the housing external contour, by means of which the lower and upper external contact areas are electrically connected. For this purpose, the external conductor tracks have at least one jet-printed first conductor track layer made of electrically conductive material. Such jet-printed conductor track layers may also be applied to active top sides of semiconductor chips in order to bridge underlying conductor track layers.

Abstract translation: 公开了一种具有塑料外壳和外部连接的半导体器件及其制造方法。 在一个实施例中，塑料外壳具有由塑料外部区域制成的壳体外部轮廓，其具有顶侧，与顶侧相对的下侧和边缘侧。 下部外部接触区域设置在下侧，上部外部接触区域设置在顶侧。 此外，塑料外壳具有沿壳体外部轮廓的外部导体轨道，通过该外部导体轨道，下部和上部外部接触区域电连接。 为此，外部导体轨道具有由导电材料制成的至少一个喷墨印刷的第一导体轨迹层。 这种喷墨印刷导体轨道层也可以应用于半导体芯片的有源顶侧，以便桥接下面的导体轨道层。

公开(公告)号：US20090286357A1

公开(公告)日：2009-11-19

申请号：US12122926

申请日：2008-05-19

Applicant: Gottfried Beer

Inventor： Gottfried Beer

IPC: H01L21/60 ,  H01L21/311 ,  H01L21/44

CPC classification number: H01L24/19 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/544 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/54413 ,  H01L2223/54433 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor structure. One embodiment produces a substrate having at least two semiconductor chips embedded in a molded body. A layer is applied over at least one main surface of the substrate by using a jet printing process.

Abstract translation: 一种制造半导体结构的方法。 一个实施例产生具有嵌入模制体中的至少两个半导体芯片的基板。 通过使用喷墨印刷方法将层施加在基板的至少一个主表面上。

公开(公告)号：US07585701B2

公开(公告)日：2009-09-08

申请号：US11439425

申请日：2006-05-24

Applicant: Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

Inventor： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

IPC: H01L21/00

CPC classification number: H01L24/96 ,  C09J7/35 ,  C09J7/385 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67126 ,  H01L21/67132 ,  H01L2221/68318 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.

Abstract translation: 具有粘合膜的载体片包括具有上侧和下侧的耐热基膜，以及设置在基膜的下侧并且朝向载体片取向的热敏粘合剂层。 基膜的上侧包括固定有半导体芯片的粘合剂层，半导体芯片由膜上侧的粘合剂层的去活化区域包围。

公开(公告)号：US20080121724A1

公开(公告)日：2008-05-29

申请号：US11938857

申请日：2007-11-13

Applicant: Gottfried Beer ,  Werner Weber

Inventor： Gottfried Beer ,  Werner Weber

IPC: G06K19/07 ,  H01L21/66 ,  B65G47/92

CPC classification number: H01L21/67144 ,  G06K19/07718 ,  H01L21/67132 ,  H01L23/49855 ,  H01L24/95 ,  H01L2224/75733 ,  H01L2224/95144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00

Abstract: A TAG chip includes a magnetic coating or an electrostatically chargeable structure. A device for packing semiconductor chips includes an electromagnetic or electrostatic lifter, which picks up singulated semiconductor chips of a semiconductor wafer with a magnetic coating or including an electrostatically chargeable structure from a wafer position and deposits them in a collecting position. A mounting device includes a conveying roller with conveying receptacles for semiconductor chips, which pick up the semiconductor chips in a pick-up position with electromagnetically or electrostatically activatable conveying receptacles and, in a discharge position will discharge, via deactivation of the conveying receptacles, the semiconductor chips onto a corresponding liner or an object.

Abstract translation: TAG芯片包括磁性涂层或静电电荷结构。 用于包装半导体芯片的装置包括电磁或静电提升器，其利用磁性涂层拾取半导体晶片的单个半导体芯片，或者从晶片位置拾取可静电充电的结构，并将它们沉积在收集位置。 安装装置包括具有用于半导体芯片的输送容器的输送辊，其利用电磁或静电可激活的输送容器拾取拾取位置中的半导体芯片，并且在放电位置将通过输送容器的失活将其排出， 半导体芯片到相应的衬里或物体上。

公开(公告)号：US20080101750A1

公开(公告)日：2008-05-01

申请号：US10537717

申请日：2002-12-05

Applicant: Gottfried Beer ,  Hans-Ludwig Althaus

Inventor： Gottfried Beer ,  Hans-Ludwig Althaus

IPC: G02B6/26 ,  G02B6/42

CPC classification number: G02B6/421 ,  G02B6/4204 ,  G02B6/423 ,  G02B6/4246

Abstract: The invention relates to an optical transmitter and/or receiver assembly comprising at least one transmitter component (2) and/or at least one receiver component (3, 4), in addition to a planar optical circuit (5) with at least one integrated waveguide (51). According to the invention, light from the transmitter element (1) is coupled into a waveguide (51) of the planar optical circuit (5) and/or light from the waveguide (51) of the planar optical circuit (5) is uncoupled and guided onto the receiver component (3, 4). The assembly is provided with a lens (14, 15) for optically coupling the waveguide(s) (51) of the planar optical circuit (5) to a fibre-optic that can he fixed to the transmitter and/or receiver assembly (1), said lens (14, 15) being positioned on the planar optical circuit (5).

Abstract translation: 本发明涉及一种包括至少一个发射器部件（2）和/或至少一个接收器部件（3,4）的光发射机和/或接收机组件，除了具有至少一个集成的平面光学电路 波导（51）。 根据本发明，来自发射器元件（1）的光耦合到平面光电路（5）的波导（51）和/或来自平面光电路（5）的波导（51）的光分离，并且 被引导到接收器部件（3,4）上。 组件设置有用于将平面光学电路（5）的波导（51）光学耦合到能够固定到发射器和/或接收器组件（1）的光纤的透镜（14,15） ），所述透镜（14,15）位于平面光电路（5）上。

公开(公告)号：US20070069353A1

公开(公告)日：2007-03-29

申请号：US11526102

申请日：2006-09-25

Applicant: Gottfried Beer ,  Edward Fuergut

Inventor： Gottfried Beer ,  Edward Fuergut

IPC: H01L23/02

CPC classification number: H01L23/552 ,  H01L23/29 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/04105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A semiconductor device with plastic housing composition includes an internal wiring that is electrically insulated from the plastic housing composition by an insulation layer. The plastic housing composition has a high thermal conductivity and a low coefficient of expansion, the coefficient of expansion being adapted to the semiconductor chip of the semiconductor device. This is achieved by forming the plastic housing composition with electrically semiconducting and/or electrically conducting filler particles. In particular, this plastic housing composition is advantageously used for semiconductor devices with flip-chip contacts and/or for semiconductor devices which are constructed according to the “universal packaging concept”.

Abstract translation: 具有塑料外壳组合物的半导体器件包括通过绝缘层与塑料外壳组合物电绝缘的内部布线。 塑料外壳组合物具有高导热性和低膨胀系数，膨胀系数适用于半导体器件的半导体芯片。 这通过用电半导体和/或导电填料颗粒形成塑料外壳组合物来实现。 特别地，该塑料外壳组合物有利地用于具有倒装芯片触点和/或根据“通用封装概念”构造的半导体器件的半导体器件。

公开(公告)号：US20060273469A1

公开(公告)日：2006-12-07

申请号：US11439425

申请日：2006-05-24

Applicant: Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

Inventor： Gottfried Beer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Edward Fuergut

IPC: H01L23/48

CPC classification number: H01L24/96 ,  C09J7/35 ,  C09J7/385 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67126 ,  H01L21/67132 ,  H01L2221/68318 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.

公开(公告)号：US20060189124A1

公开(公告)日：2006-08-24

申请号：US11350287

申请日：2006-02-09

Applicant: Gottfried Beer ,  Jens Pohl

Inventor： Gottfried Beer ,  Jens Pohl

IPC: H01L21/4763 ,  H01L23/48

CPC classification number: H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor device includes a housing composition and a through contact extending through the housing composition. The through contact is provided in a contact hole formed through the housing composition and having an asymmetrical funnel form with at least two opposite inner wall sides oriented substantially perpendicular to the top side of the housing and a further inner wall side inclined in such a way that the contact hole has an elongated-hole cross section at the top side of the housing. In the region of the contact pad, the contact hole has a cross section adapted to the contact pad. The through contact includes a contact-making conductor track that extends from the top side of the housing along the inclined fourth inner wall side to the contact pad.

Abstract translation: 半导体器件包括壳体组合物和延伸穿过壳体组合物的通孔。 通孔形成在通过壳体组合物形成的接触孔中并且具有不对称的漏斗形式，其具有至少两个相对的内壁侧，该至少两个相对的内壁侧基本上垂直于壳体的顶侧定向，另外的内壁侧以如下方式倾斜： 接触孔在壳体的顶侧具有细长孔横截面。 在接触垫的区域中，接触孔具有适于接触垫的横截面。 通孔包括从壳体的顶侧沿着倾斜的第四内壁侧延伸到接触垫的接触导体轨迹。

公开(公告)号：US08866292B2

公开(公告)日：2014-10-21

申请号：US13736641

申请日：2013-01-08

Applicant: Gottfried Beer ,  Maciej Wojnowski ,  Mehran Pour Mousavi

Inventor： Gottfried Beer ,  Maciej Wojnowski ,  Mehran Pour Mousavi

IPC: H01L23/34 ,  H01L23/498 ,  H01L21/768

CPC classification number: H01L23/49816 ,  H01L21/568 ,  H01L21/76802 ,  H01L21/76885 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/17519 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/82101 ,  H01L2224/96 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/181 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q23/00 ,  H01L2224/19 ,  H01L2924/014 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01029 ,  H01L2924/01055 ,  H01L2924/01064 ,  H01L2924/01044 ,  H01L2924/01042 ,  H01L2924/01015 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In accordance with an embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A first chip is disposed in the substrate. The first chip includes a plurality of contact pads at the first major surface. A via bar is disposed in the substrate. An antenna structure is disposed within the via bar.

Abstract translation: 根据本发明的实施例，半导体封装包括具有第一主表面和相对的第二主表面的衬底。 第一芯片设置在基板中。 第一芯片包括在第一主表面处的多个接触垫。 通孔棒设置在基板中。 天线结构设置在通孔条内。

公开(公告)号：US08779583B2

公开(公告)日：2014-07-15

申请号：US13595049

申请日：2012-08-27

Applicant: Klaus Pressel ,  Gottfried Beer

Inventor： Klaus Pressel ,  Gottfried Beer

IPC: H01L23/34 ,  H01L23/00 ,  H01L23/538 ,  B81B7/02 ,  G01L9/00 ,  B81C1/00 ,  H01L21/56 ,  H01L25/16 ,  H01L21/683 ,  H01L23/31 ,  G01P1/02 ,  H01L25/00 ,  H04R1/04 ,  H01L23/498

CPC classification number: G01P1/023 ,  B81B7/02 ,  B81B2207/092 ,  B81B2207/095 ,  B81C1/0023 ,  B81C2203/0154 ,  G01L9/0042 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H04R1/04 ,  H04R2201/003 ,  H01L2224/82 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.

Abstract translation: 半导体器件及其制造方法。 一个实施例提供一种半导体芯片。 封装材料覆盖半导体芯片。 金属层在半导体芯片和封装材料之上。 电压产生单元和显示单元中的至少一个刚性地附接到至少一个封装材料和金属层。