公开(公告)号：US5523544A

公开(公告)日：1996-06-04

申请号：US43321

申请日：1993-04-06

申请人： Gerald T. Hertzel ,  Eugene G. Hill

发明人： Gerald T. Hertzel ,  Eugene G. Hill

IPC分类号： B23K26/38 ,  G03G15/16 ,  B23K26/00

CPC分类号： B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  G03G15/1685 ,  B23K2201/35 ,  B23K2203/172 ,  B23K2203/42 ,  B23K2203/50

摘要： A process for perforating a urethane anti-static filled coating of a metallic drum core with clean holes of substantially uniform size and shape. The process includes placing an electrically conducting absorbing tape between the urethane coating and the metallic core to absorb the urethane melt generated by the laser cutting process. The coated core after being placed in a fixture, is subjected to a laser beam generated by a pulsed CO2 gas laser that passes through a set of rotary optics capable of spinning the beam in circles as it passes through a gas jet/nozzle assembly before beam impact with the coating. Through the use of conductive tape a good ground may be maintained between the anti-static filled coating and the metallic core to prevent static build up on the outer surface of the drum.

摘要翻译： 一种金属鼓芯的聚氨酯防静电填充涂层的穿孔方法，其具有基本均匀的尺寸和形状的清洁孔。 该方法包括在聚氨酯涂层和金属芯之间放置导电吸收带以吸收由激光切割工艺产生的聚氨酯熔体。 被涂覆的芯在被放置在固定装置中之后，经受脉冲CO 2气体激光产生的激光束，该激光束通过一组旋转光学器件，该组旋转光学器件能够在光束通过气体射流/喷嘴组件之前通过圆形旋转 与涂层冲击。 通过使用导电带，可以在防静电填充涂层和金属芯之间保持良好的接地，以防止在鼓的外表面上的静电积聚。

公开(公告)号：US5483100A

公开(公告)日：1996-01-09

申请号：US893518

申请日：1992-06-02

申请人： Robert C. Marrs ,  Tadashi Hirakawa

发明人： Robert C. Marrs ,  Tadashi Hirakawa

IPC分类号： H01L23/538 ,  B23K26/06 ,  B23K26/38 ,  H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40 ,  H01L23/053 ,  H01L23/12 ,  H01L23/495

CPC分类号： H05K3/0035 ,  B23K26/066 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L21/486 ,  H01L23/49827 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/18 ,  B23K2203/30 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  H01L2224/05553 ,  H01L2224/48137 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2924/09701 ,  H01L2924/30107 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/056 ,  H05K2203/107 ,  H05K3/4092

摘要： An integrated circuit package, and a method for forming the integrated circuit package, including a single layer or multilayer substrate in which interconnection vias are formed is described. Laser energy is swept across a surface of a mask in which holes have been formed. Laser energy passing through the holes of the mask forms vias in a substrate held in place below the mask. The laser energy is swept at such a speed and is maintained at such an energy level that the laser energy forms vias in the substrate, but does not penetrate a set of leads attached to the substrate. Vias may be formed in this way by either a mask imaging, contact mask or conformal mask technique. The laser energy is emitted from a non-thermal (e.g., excimer) laser. The substrate is formed of an organic (e.g., epoxy) resin. The resin may include reinforcing fibers (e.g., aramid fibers). Substrates may be formed on one or both sides of the set of leads. After formation in the substrate, the vias are coated with an electrically conductive material. The method of via formation is fast, inexpensive, achieves higher via density, and avoids overheating of the substrate.

摘要翻译： 描述了一种集成电路封装以及用于形成集成电路封装的方法，该集成电路封装包括其中形成有互连通孔的单层或多层基板。 激光能量扫过已经形成孔的掩模的表面。 通过掩模的孔的激光能量在保持在掩模下方的基底中形成通孔。 激光能量以这样的速度扫过并保持在激光能量在衬底中形成通孔但不穿透附着于衬底的一组引线的能级。 可以通过掩模成像，接触掩模或保形掩模技术以这种方式形成通孔。 激光能量从非热（例如准分子激光）发射。 基底由有机（例如环氧）树脂形成。 树脂可以包括增强纤维（例如芳族聚酰胺纤维）。 基板可以形成在该组引线的一侧或两侧上。 在衬底中形成之后，通孔用导电材料涂覆。 通孔形成方法快速，便宜，实现更高的通孔密度，并避免基板过热。

公开(公告)号：US5378869A

公开(公告)日：1995-01-03

申请号：US37209

申请日：1993-03-26

申请人： Robert C. Marrs ,  Tadashi Hirakawa

发明人： Robert C. Marrs ,  Tadashi Hirakawa

IPC分类号： H01L23/538 ,  B23K26/06 ,  B23K26/38 ,  H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40 ,  B23K26/00

CPC分类号： H05K3/0035 ,  B23K26/066 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L21/486 ,  H01L23/49827 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/18 ,  B23K2203/30 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/52 ,  H01L2224/05553 ,  H01L2224/48137 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2924/09701 ,  H01L2924/30107 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/056 ,  H05K2203/107 ,  H05K3/4092

摘要： An integrated circuit package, and a method for forming the integrated circuit package, including a single layer or multilayer substrate in which interconnection vias are formed is described. Laser energy is swept across a surface of a mask in which holes have been formed. Laser energy passing through the holes of the mask forms vias in a substrate held in place below the mask. The laser energy is swept at such a speed and is maintained at such an energy level that the laser energy forms vias in the substrate, but does not penetrate a set of leads attached to the substrate. Vias may be formed in this way by either a mask imaging, contact mask or conformal mask technique. The laser energy is emitted from a non-thermal (e.g., excimer) laser. The substrate is formed of an organic (e.g., epoxy) resin. The resin may include reinforcing fibers (e.g., aramid fibers). Substrates may be formed on one or both sides of the set of leads. After formation in the substrate, the vias are coated with an electrically conductive material. The method of via formation is fast, inexpensive, achieves higher via density, and avoids overheating of the substrate.

摘要翻译： 描述了一种集成电路封装以及用于形成集成电路封装的方法，该集成电路封装包括其中形成有互连通孔的单层或多层基板。 激光能量扫过已经形成孔的掩模的表面。 通过掩模的孔的激光能量在保持在掩模下方的基底中形成通孔。 激光能量以这样的速度扫过并保持在激光能量在衬底中形成通孔但不穿透附着于衬底的一组引线的能级。 可以通过掩模成像，接触掩模或保形掩模技术以这种方式形成通孔。 激光能量从非热（例如准分子激光）发射。 基底由有机（例如环氧）树脂形成。 树脂可以包括增强纤维（例如芳族聚酰胺纤维）。 基板可以形成在该组引线的一侧或两侧上。 在衬底中形成之后，通孔用导电材料涂覆。 通孔形成方法快速，便宜，实现更高的通孔密度，并避免基板过热。

公开(公告)号：US5372646A

公开(公告)日：1994-12-13

申请号：US66348

申请日：1993-05-24

申请人： James B. Foote ,  Steven A. F. Kaake ,  Peter V. Meyers ,  James F. Nolan

发明人： James B. Foote ,  Steven A. F. Kaake ,  Peter V. Meyers ,  James F. Nolan

IPC分类号： H01L31/04 ,  H01L31/073 ,  H01L31/18 ,  C23C14/00

CPC分类号： H01L31/1836 ,  B23K26/364 ,  B23K26/40 ,  B23K2203/172 ,  Y02E10/543 ,  Y02P70/521 ,  Y10S438/907

摘要： A process and apparatus (70) for making a large area photovoltaic device (22) that is capable of generating low cost electrical power. The apparatus (70) for performing the process includes an enclosure (126) providing a controlled environment in which an oven (156) is located. At least one and preferably a plurality of deposition stations (74,76,78) provide heated vapors of semiconductor material within the oven (156) for continuous elevated temperature deposition of semiconductor material on a sheet substrate (24) including a glass sheet (26) conveyed within the oven. The sheet substrate (24) is conveyed on a roller conveyor (184) within the oven (156) and the semiconductor material whose main layer (82) is cadmium telluride is deposited on an upwardly facing surface (28) of the substrate by each deposition station from a location within the oven above the roller conveyor. A cooling station (86) rapidly cools the substrate (24) after deposition of the semiconductor material thereon to strengthen the glass sheet of the substrate.

摘要翻译： 一种用于制造能够产生低成本电力的大面积光伏器件（22）的工艺和设备（70）。 用于执行该过程的设备（70）包括提供烘箱（156）所在的受控环境的外壳（126）。 至少一个并且优选多个沉积站（74,76,78）在烘箱（156）内提供加热的半导体材料的蒸气，用于将半导体材料连续升高温度沉积在包括玻璃板（26）的薄板基材（24）上 ）在烤箱内传送。 片材基板（24）在烘箱（156）内的辊式输送机（184）上输送，并且其主层（82）是碲化镉的半导体材料通过每次沉积沉积在基板的面向上的表面（28）上 车站位于烘箱上方位于滚筒输送机上方。 冷却站（86）在沉积半导体材料之后快速冷却基板（24），以加强基板的玻璃板。

公开(公告)号：US5340658A

公开(公告)日：1994-08-23

申请号：US928751

申请日：1992-08-13

申请人： Tadao Komatsu ,  Seiichiro Miyata

发明人： Tadao Komatsu ,  Seiichiro Miyata

IPC分类号： B23K35/30 ,  B22F5/00

CPC分类号： B23K35/30 ,  B23K2203/16 ,  B23K2203/172 ,  B23K35/3006 ,  B23K35/3033 ,  Y10T428/12014 ,  Y10T428/12063 ,  Y10T428/12097

摘要： The invention provides composites made from a carbon-based material and a meallic material by joining them together by means of a brazing filler metal which is an alloy comprising, as essential components thereof, at least one element selected from among vanadium, niobium, titanium, zirconium and silicon and at least one element selected from among copper, silver, nickel and aluminum as well as welding nozzles made by joining a ring made of a carbon-based material to the tip of a metal nozzle using said brazing filler metal.

摘要翻译： 本发明提供了一种由碳基材料和金属材料制成的复合材料，它们通过钎焊填料金属组合在一起，所述钎料是一种合金，其包括作为其主要成分的至少一种选自钒，铌，钛， 锆和硅以及选自铜，银，镍和铝中的至少一种元素，以及通过使用所述钎料将由碳基材料制成的环连接到金属喷嘴的尖端而制成的焊接喷嘴。

公开(公告)号：US5332680A

公开(公告)日：1994-07-26

申请号：US5170

申请日：1993-01-15

申请人： Shunpei Yamazaki

发明人： Shunpei Yamazaki

IPC分类号： H01L31/00 ,  H01L27/144 ,  H01L31/0224 ,  H01L31/18

CPC分类号： H01L31/1804 ,  B23K26/364 ,  B23K26/40 ,  H01L27/1446 ,  H01L31/022408 ,  B23K2203/172 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S438/94

摘要： A plurality of first electrodes are sequentially arranged on a substrate and covered with a non-single-crystal semiconductor laminate member. On the semiconductor laminate member are formed second electrodes respectively corresponding to the first electrodes. Each first electrode and each second electrode and the region of the semiconductor laminate member sandwiched therebetween constitute one semiconductor photoelectric transducer. The transducer is connected to another transducer adjacent thereto so that the second electrode of the latter is connected to the first electrode of the former through a contact portion extending thereto from the second electrode of the latter into a contact groove cut in the semiconductor laminate member. In this case, the contact groove and the contact portion are not exposed in the side walls of the semiconductor laminate member. The side walls of the first and/or second electrode are retained inside the side walls of the substrate. The first electrodes, the second electrodes and the contact grooves are defined by a laser beam.

摘要翻译： 多个第一电极依次布置在基板上并被非单晶半导体层叠构件覆盖。 在半导体层叠构件上形成分别对应于第一电极的第二电极。 每个第一电极和每个第二电极以及夹在其间的半导体层叠构件的区域构成一个半导体光电传感器。 换能器连接到与其相邻的另一传感器，使得后者的第二电极通过从其延伸的接触部分从第一电极连接到成形器的第一电极，该接触部分从后者的第二电极延伸到切割在半导体层叠部件中的接触槽中。 在这种情况下，接触槽和接触部分不会暴露在半导体层叠构件的侧壁中。 第一和/或第二电极的侧壁保持在基板的侧壁内。 第一电极，第二电极和接触槽由激光束限定。

公开(公告)号：US5313043A

公开(公告)日：1994-05-17

申请号：US920926

申请日：1992-07-28

申请人： Yasuo Yamagishi

发明人： Yasuo Yamagishi

IPC分类号： B23K26/06 ,  B23K26/40 ,  G02B27/09 ,  H05K3/00 ,  H05K3/46 ,  B23K26/00

CPC分类号： G02B27/0988 ,  B23K26/066 ,  B23K26/40 ,  G02B27/09 ,  H05K3/0026 ,  B23K2203/172 ,  H05K2203/056 ,  H05K3/0035

摘要： An equipment for excimer laser ablation machining provided a laser (11), a main body (14) housing a mirror (12) for reflecting an ultraviolet ray emitted by the laser and an optical system (13) for arranging the ultraviolet ray to a parallel ray, and a means (15) for moving the relative position of an object to be machined and the parallel ray, the means (15) being a supporter of an object to be machined and having a means (16) for arranging a dielectric mirror mask (7), leaving a space of 0.1 mm through 50 mm, preferably 0.1 mm through 1 mm, between the object to be machined and the dielectric mirror mask (7), the equipment to be employed specifically for producing a via hole of a multi-layered circuit board, and a method for excimer laser ablation machining conducted by employing the foregoing equipment.

摘要翻译： 准分子激光烧蚀加工设备提供激光器（11），容纳用于反射由激光器发射的紫外线的反射镜（12）的主体（14）和用于将紫外线布置成平行的光学系统（13） 以及用于移动待加工物体和平行光线的相对位置的装置（15），所述装置（15）是待加工物体的支撑件，并具有用于布置电介质镜的装置（16） 掩模（7），在被加工物体与电介质镜掩模（7）之间留出0.1mm至50mm，优选0.1mm至1mm的空间，专门用于制造通孔的设备 多层电路板，以及采用上述设备进行的准分子激光烧蚀加工方法。

公开(公告)号：US5216543A

公开(公告)日：1993-06-01

申请号：US21458

申请日：1987-03-04

申请人： Clyde D. Calhoun

发明人： Clyde D. Calhoun

IPC分类号： B23K26/00 ,  B23K26/067 ,  G02B3/00 ,  H01L31/0232

CPC分类号： G02B3/005 ,  B23K26/0006 ,  B23K26/067 ,  B23K26/0676 ,  H01L31/0232 ,  B23K2201/40 ,  B23K2203/08 ,  B23K2203/10 ,  B23K2203/14 ,  B23K2203/172 ,  B23K2203/26 ,  B23K2203/42 ,  B23K2203/50 ,  Y10S430/147 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2848

摘要： The present invention relates to an apparatus and method for patterning areas of a radiation absorbent film material. In the preferred embodiment, the film material is at least partially electrically conductive. The radiation is focused onto the film by a lenticular lens having a plurality of optically active elements to provide a radiation pattern on the film and remove or displace portions of the film to form a corresponding pattern, preferably a conductive pattern. The film may have one or more layers or regions, but at least one region must be radiation absorbent in order to allow the formation of patterns in the film in accordance with the present invention. The areas of the film affected by the phenomenon of radiation absorption are non-conductive voids which may separate the film into a plurality of conductive grid lines whereby the film is useful with a conductive lens film to increase the apparent efficiency of a photovoltaic cell.

摘要翻译： 本发明涉及一种用于图案化放射线吸收膜材料的区域的装置和方法。 在优选实施例中，薄膜材料至少部分导电。 通过具有多个光学活性元件的双凸透镜将辐射聚焦到膜上，以在膜上提供辐射图案，并移除或取代膜的部分以形成相应的图案，优选导电图案。 膜可以具有一个或多个层或区域，但是至少一个区域必须是辐射吸收剂，以便允许根据本发明在膜中形成图案。 受辐射吸收现象影响的膜的区域是非导电空隙，其可以将膜分离成多个导电栅格线，由此该膜可用于导电透镜膜以增加光伏电池的表观效率。

公开(公告)号：US5071359A

公开(公告)日：1991-12-10

申请号：US515830

申请日：1990-04-27

申请人： Barbara E. Arnio ,  Lynn E. Burdick ,  Mark J. Owens ,  Mike St. Lawrence ,  Scott S. Simpson

发明人： Barbara E. Arnio ,  Lynn E. Burdick ,  Mark J. Owens ,  Mike St. Lawrence ,  Scott S. Simpson

IPC分类号： H01R11/01 ,  B23K26/38 ,  H01L21/48 ,  H01L23/498 ,  H01R12/51 ,  H01R13/22 ,  H01R24/00 ,  H01R43/00 ,  H05K3/42

CPC分类号： H01L21/486 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L23/49827 ,  H01R13/22 ,  H05K3/42 ,  B23K2201/35 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  B23K2203/50 ,  H01L2924/0002 ,  H05K2201/09563 ,  H05K2201/09736

摘要： Connector and processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed elastomeric sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.

摘要翻译： 连接器及其制备方法，用于可互换连接接触焊盘阵列。 连接器具有预先形成的弹性体片状部件，该部件设置有一系列通孔，每个孔通过导电镀金属沉积物延伸。 沉积物的整体端向外突出超过片状构件的表面，形成用于可释放地接合焊盘的接触表面。

公开(公告)号：US5063280A

公开(公告)日：1991-11-05

申请号：US553666

申请日：1990-07-18

申请人： Hideho Inagawa ,  Shigenobu Nojo

发明人： Hideho Inagawa ,  Shigenobu Nojo

IPC分类号： B23K26/03 ,  B23K26/38 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42

CPC分类号： B23K26/032 ,  B23K26/0622 ,  B23K26/0853 ,  B23K26/382 ,  B23K26/40 ,  H05K3/0038 ,  B23K2201/34 ,  B23K2201/42 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  H05K1/0269 ,  H05K2203/0207 ,  H05K2203/163 ,  H05K3/427

摘要： A method of forming holes into a printed circuit board whereby when a hole is formed into the printed circuit board by using an energy beam such as a laser beam or the like, a focal point position of the beam is moved with the progressing of the hole forming process. To move the focal point position of the beam with the progressing of the hole forming process when a hole is formed into the printed circuit board by using an energy beam such as a laser beam or the like, a mechanism to move a converging optical system in the direction of the optical axis is provided. Also provided is a method of checking a penetrating state of a through hole in the case where a through hole is worked into a circuit pattern portion of a printed circuit board by using an energy beam such as a laser beam and where the beam is irradiated from the surface of the printed circuit board and the material constructing the printed circuit board is fused and discharged and penetrated to the back surface, thereby forming a through hole.

摘要翻译： 一种在印刷电路板中形成孔的方法，由此当通过使用诸如激光束等的能量束将印刷电路板形成孔时，梁的焦点位置随着孔的进行而移动 成型工艺。 当通过使用诸如激光束等的能量束将孔形成到印刷电路板中时，随着孔形成处理的进行而移动光束的焦点位置，使得会聚光学系统在 提供光轴的方向。 还提供了一种在通过使用诸如激光束的能量束并且其中照射光束的通孔加工到印刷电路板的电路图案部分的情况下检查通孔的穿透状态的方法 印刷电路板的表面和构成印刷电路板的材料熔融并排出并渗透到背面，从而形成通孔。