公开(公告)号：US20140069702A1

公开(公告)日：2014-03-13

申请号：US14113541

申请日：2012-04-24

Applicant: Yoshihide Sekito

Inventor： Yoshihide Sekito

IPC: G03F7/035 ,  H05K1/03

CPC classification number: G03F7/035 ,  C08F290/067 ,  C09D5/18 ,  G03F7/033 ,  G03F7/037 ,  G03F7/038 ,  G03F7/0388 ,  H05K1/0373 ,  H05K3/287 ,  H05K2201/012 ,  Y10T428/24355 ,  Y10T428/25 ,  Y10T428/259

Abstract: The photosensitive resin composition contains a (A) binder polymer, (B) cross-linked polymer particles, (C) thermosetting resin, (D) photo-polymerization initiator, and a (E) phosphoric flame retardant, in which a content of the (B) cross-linked polymer particles is 30 parts by weight to 100 parts by weight with respect to the 100 parts by weight of the (A) binder polymer, and an average particle diameter of the (B) cross-linked polymer particles is 1 μm to 10 μm. Therefore, the photosensitive resin composition (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing, (iii) is formed into a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) causes a substrate to have a small warpage after being cured.

Abstract translation: 感光性树脂组合物含有（A）粘合剂聚合物，（B）交联聚合物颗粒，（C）热固性树脂，（D）光聚合引发剂和（E）磷酸阻燃剂，其中 （B）交联聚合物颗粒相对于100重量份（A）粘合剂聚合物为30重量份至100重量份，（B）交联聚合物颗粒的平均粒径为 1个妈妈到10个妈妈 因此，感光性树脂组合物（i）在施加和干燥后获得优异的无粘性，（ii）可以进行精细加工，（iii）形成为具有优异的柔性，阻燃性和电气性的固化膜 绝缘可靠性，（iv）使基材在固化后具有小的翘曲。

公开(公告)号：US08445177B2

公开(公告)日：2013-05-21

申请号：US12950353

申请日：2010-11-19

Applicant: Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Masaaki Yasuda

Inventor： Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Masaaki Yasuda

IPC: G03F7/00 ,  G03F7/004 ,  G03F7/027

CPC classification number: H01L23/488 ,  C09J179/08 ,  G03F7/037 ,  H01L21/2007 ,  H01L21/76251 ,  H01L21/78 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  Y10T156/1002 ,  Y10T428/24479 ,  Y10T428/24802 ,  H01L2924/00014

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Abstract translation: 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

公开(公告)号：US08409784B2

公开(公告)日：2013-04-02

申请号：US12596952

申请日：2008-04-23

Applicant: Katsuhiko Funaki ,  Etsuo Ohkawado ,  Kousuke Hirota ,  Syuji Tahara

Inventor： Katsuhiko Funaki ,  Etsuo Ohkawado ,  Kousuke Hirota ,  Syuji Tahara

IPC: G03C1/00 ,  G03F7/037 ,  G03F7/027 ,  G03F7/00

CPC classification number: C08F283/04 ,  C08F283/00 ,  G03F7/027 ,  G03F7/037 ,  H05K3/287 ,  Y10T428/24917

Abstract: Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].

Abstract translation: 公开了一种感光性树脂组合物，其不含有对环境施加负担高的任何卤化物或任何锑化合物，其在固化后具有良好的阻燃性，并且特别符合最近的严格要求 抗弯性和绝缘可靠性。 具体公开了一种光敏树脂组合物，其包含：（A）由通式（1）表示的（甲基）丙烯酸酯化合物; （B）聚酰亚胺前体; 和（C）光聚合引发剂[式中，R1表示氢原子或甲基; R2表示氢原子或一价有机基团; n和m独立地表示1〜5的整数。 p表示0〜6的整数， q和r独立地表示0〜4的整数。 s表示0〜6的整数，条件是p，q，r和s的和为6，p和s的总和可以为3〜6，优选为6〜6。

公开(公告)号：US08349700B2

公开(公告)日：2013-01-08

申请号：US12745594

申请日：2008-12-02

Applicant: Takashi Masuko ,  Takashi Kawamori ,  Kazuyuki Mitsukura ,  Shigeki Katogi

Inventor： Takashi Masuko ,  Takashi Kawamori ,  Kazuyuki Mitsukura ,  Shigeki Katogi

IPC: H01L21/30

CPC classification number: H01L24/27 ,  C08G18/8116 ,  C09J175/16 ,  C09J179/08 ,  G03F7/037 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/16225 ,  H01L2224/29076 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for manufacturing a semiconductor device 1, comprising a first step of providing a photosensitive adhesive (insulating resin layer 7) on a board 3 which has a connecting terminal, a second step of patterning the photosensitive adhesive by light exposure and development so that openings 13 are formed where the connecting terminal is exposed, a third step of filling the openings 13 with a conductive material to form a conductive layer 9, and a fourth step of directly bonding a semiconductor chip 5 having a connecting electrode section to the photosensitive adhesive while electrically connecting the connecting terminal of the board 3 and the connecting electrode section of the semiconductor chip 5 via the conductive layer 9.

Abstract translation: 一种用于制造半导体器件1的方法，包括在具有连接端子的基板3上设置感光性粘接剂（绝缘树脂层7）的第一工序，通过曝光和显影来图案化感光性粘接剂的第二工序， 13形成连接端子露出的第三步骤，用导电材料填充开口13以形成导电层9的第三步骤，以及将具有连接电极部分的半导体芯片5直接接合到感光性粘合剂的第四步骤，同时 通过导电层9电连接板3的连接端子和半导体芯片5的连接电极部分。

公开(公告)号：US20120248632A1

公开(公告)日：2012-10-04

申请号：US13410702

申请日：2012-03-02

Applicant: Kazuyuki MITSUKURA ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi

Inventor： Kazuyuki MITSUKURA ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi

IPC: G03F7/004 ,  B32B7/12 ,  C09J7/00 ,  H01L23/28

CPC classification number: C09J7/0203 ,  C08G73/105 ,  C08L63/00 ,  C09J7/35 ,  C09J179/08 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2479/08 ,  G03F7/027 ,  G03F7/037 ,  G03F7/038 ,  H01L21/6836 ,  H01L23/293 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/27002 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/27622 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/24802 ,  Y10T428/2817 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.

Abstract translation: 本发明涉及一种感光性粘合剂组合物，其通过曝光和显影进行图案化后具有对粘合剂的热压粘合性，并且能够进行碱显影，其中在曝光和进一步热固化后110℃下的储能弹性模量不小于10 MPa。

公开(公告)号：US20120133061A1

公开(公告)日：2012-05-31

申请号：US13380349

申请日：2010-06-28

Applicant: Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi

Inventor： Kazuyuki Mitsukura ,  Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi

IPC: H01L23/12 ,  C09J179/02 ,  B32B3/10 ,  C09J163/00 ,  B32B27/38

CPC classification number: C09J4/00 ,  C08G73/1039 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J179/08 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2479/08 ,  G03F7/0046 ,  G03F7/037 ,  G03F7/40 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/24802 ,  Y10T428/2809 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: To provide a photosensitive adhesive which is sufficiently excellent in terms of all the properties of attachment, pattern formability, thermocompression bondability and high-temperature adhesion, and which has thermocompression bondability for adherends after patterning by exposure and development, and is capable of alkali development, as well as a film adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer and a semiconductor device, which employ the same. A photosensitive adhesive comprising (A) an imide group-containing resin with a fluoroalkyl group, (B) a radiation-polymerizable compound, (C) a photoinitiator and (D) a thermosetting component.

Abstract translation: 为了提供在附着性，图案形成性，热压接性和高温粘合性的全部性能方面均充分优异的感光性粘接剂，通过曝光和显影对图案化后的被粘物具有热压接性，能够进行碱显影， 以及胶粘剂，粘合片，粘合剂图案，具有粘合剂层的半导体晶片和半导体器件。 一种感光性粘合剂，其包含（A）含氟代烷基的含酰亚胺基的树脂，（B）辐射聚合性化合物，（C）光引发剂和（D）热固性组分。

公开(公告)号：US08133550B2

公开(公告)日：2012-03-13

申请号：US11855302

申请日：2007-09-14

Applicant: Kenichiro Sato ,  Tsukasa Yamanaka

Inventor： Kenichiro Sato ,  Tsukasa Yamanaka

IPC: C08J7/04 ,  G03F7/00 ,  G03F7/26

CPC classification number: H01L21/02118 ,  C08F2/50 ,  C08G69/48 ,  C08G73/22 ,  G03F7/0233 ,  G03F7/037 ,  H01L21/312

Abstract: A polybenzoxazole precursor is represented by the following formula (1): wherein R1a to R4a, R1b to R4b, X1, Y1 and m are defined in the specification.

Abstract translation: 聚苯并恶唑前体由下式（1）表示：其中R1a至R4a，R1b至R4b，X1，Y1和m在本说明书中定义。

公开(公告)号：US20120015298A1

公开(公告)日：2012-01-19

申请号：US13257989

申请日：2010-03-24

Applicant: Yasuyuki Takao

Inventor： Yasuyuki Takao

IPC: G03F7/038 ,  C08G73/12

CPC classification number: C08F299/022 ,  C08F2/50 ,  C08F290/145 ,  C08G73/1042 ,  C08G73/1075 ,  C08G73/12 ,  C08G73/16 ,  C09D179/085 ,  G03F7/037 ,  H05K3/287

Abstract: Disclosed is a photosensitive resin composition capable of displaying satisfactory patterning performance against an alkaline developer and yielding a cured film of a sufficiently low coefficient of linear thermal expansion. The photosensitive resin composition contains a photopolymerization initiator and a polyimide precursor obtained by the reaction of an ester-containing diamine such as 4-aminophenyl 4′-aminobenzoate, a biphenyl-based diamine such as 4,4′-diamino-2,2′-dimethylbiphenyl, and an unsaturated group-containing diamine such as 4,4′-diamino-2,2′-divinylbiphenyl with an acid anhydride such as pyromellitic dianhydride. The content of the structural unit derived from the unsaturated group-containing diamine in the polyimide precursor is 5-60 mol %.

Abstract translation: 公开了能够对碱性显影剂显示令人满意的图案化性能并产生足够低的线性热膨胀系数的固化膜的感光性树脂组合物。 感光性树脂组合物含有光聚合引发剂和通过含酯二胺如4'-氨基苯甲酸4-氨基苯酯，联苯基二胺如4,4'-二氨基-2,2' 二甲基联苯和含不饱和基团的二胺如4,4'-二氨基-2,2'-二乙烯基联苯与酸酐如1,2,4,5-苯四酸二酐。 来自聚酰亚胺前体中的不饱和基团的二胺的结构单元的含量为5-60摩尔％。

公开(公告)号：US20100314783A1

公开(公告)日：2010-12-16

申请号：US12859720

申请日：2010-08-19

Applicant: Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Masaaki Yasuda

Inventor： Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Masaaki Yasuda

IPC: H01L23/48 ,  G03F7/004 ,  G03F7/20 ,  B32B7/12

CPC classification number: H01L23/488 ,  C09J179/08 ,  G03F7/037 ,  H01L21/2007 ,  H01L21/76251 ,  H01L21/78 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  Y10T156/1002 ,  Y10T428/24479 ,  Y10T428/24802 ,  H01L2924/00014

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Abstract translation: 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

公开(公告)号：US07851131B2

公开(公告)日：2010-12-14

申请号：US11969358

申请日：2008-01-04

Applicant: Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Masaaki Yasuda

Inventor： Takashi Kawamori ,  Takashi Masuko ,  Shigeki Katogi ,  Masaaki Yasuda

IPC: G03F7/00 ,  G03F7/004

CPC classification number: H01L23/488 ,  C09J179/08 ,  G03F7/037 ,  H01L21/2007 ,  H01L21/76251 ,  H01L21/78 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  Y10T156/1002 ,  Y10T428/24479 ,  Y10T428/24802 ,  H01L2924/00014

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Abstract translation: 一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; （C）光聚合引发剂。