公开(公告)号：US07015556B2

公开(公告)日：2006-03-21

申请号：US10813393

申请日：2004-03-31

申请人： Masahiro Nakano ,  Katsuhiko Gunji ,  Yasunobu Oikawa ,  Katsuo Sato

发明人： Masahiro Nakano ,  Katsuhiko Gunji ,  Yasunobu Oikawa ,  Katsuo Sato

IPC分类号： H01L29/84 ,  H01L22/48

CPC分类号： H03H9/1071 ,  H01L2224/16225 ,  H01L2224/45144 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/08 ,  H01L2924/00

摘要： A basic portion layer 21 of a substrate electrode 12a connected to a projecting electrode 13 electrically and mechanically on a substrate member of ceramics. The substrate member on which the basic portion layer 21 is formed is subjected to sintering. A surface of the basic portion layer 21 in the sintered substrate member is polished. On the polished basic portion layer 21, the plating layers 22, 23 are formed, so that surface roughness of the substrate electrode 12a may be, for example, not larger than 0.1 μmRMS. Accordingly, junction strength of an integrated circuit element mounted on a packaging substrate by a flip-chip method can be improved.

摘要翻译： 衬底电极12a的基本部分层21，其在陶瓷的衬底构件上电连接到突出电极13。 对其上形成有碱性部分层21的基材进行烧结。 研磨烧结基板部件中的基体部分层21的表面。 在抛光的基底层21上形成镀层22,23，使得基板电极12a的表面粗糙度例如可以不大于0.1μmumRMS。 因此，可以提高通过倒装芯片方法安装在封装基板上的集成电路元件的结合强度。

公开(公告)号：US06922119B2

公开(公告)日：2005-07-26

申请号：US10338459

申请日：2003-01-07

申请人： Shigetoshi Matsuta ,  Shoji Kai ,  Hideki Kondo ,  Akihiko Inoue

发明人： Shigetoshi Matsuta ,  Shoji Kai ,  Hideki Kondo ,  Akihiko Inoue

IPC分类号： H03H9/64 ,  H03H9/05 ,  H03H9/25 ,  H03H9/10

CPC分类号： H03H9/1071 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H03H9/0585 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface acoustic wave (SAW) filter includes a SAW chip mounted in a recession of a multi-layer substrate, a sealing plate covering the recession, an end surface electrode that is provided on the outer surface of the substrate and is in conduction with the SAW chip, a metal conductor for radiating heat that is provided on the surface at the opposite side from the sealing plate of the multi-layer substrate, and a through hole provided in the substrate, one end thereof being connected to the metal conductor. The other end of the through hole is connected with the SAW chip through the intermediary of a metal constituent, such as an electrically conductive adhesive layer.

摘要翻译： 表面声波（SAW）滤波器包括安装在多层基板的凹部中的SAW芯片，覆盖该凹部的密封板，设置在该基板的外表面上并与该基板导通的端面电极 SAW芯片，用于散热的金属导体，其设置在与多层基板的密封板相反的一侧的表面上，以及设置在基板中的通孔，其一端连接到金属导体。 通孔的另一端通过诸如导电粘合剂层的金属成分的介质与SAW芯片连接。

公开(公告)号：US20050104192A1

公开(公告)日：2005-05-19

申请号：US10967338

申请日：2004-10-19

申请人： Shingo Masuko ,  Satoshi Ichikawa

发明人： Shingo Masuko ,  Satoshi Ichikawa

IPC分类号： H01L23/02 ,  H01L21/50 ,  H03H9/10 ,  H03H9/25 ,  H01L23/12

CPC分类号： H03H9/0585 ,  H01L21/50 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/16195 ,  H03H9/1071 ,  H01L2924/00014

摘要： An electronic device having a cavity, which is included in a package, can be sealed with a lid surely and efficiently. A SAW device comprises a SAW chip that is fixed to a plane portion of a stem. A rear surface of the package is hermetically sealed with glass. An opening of a cavity provided on an upper surface of the package is hermetically sealed by a lid with seam welding. Glass is filled to reach the backside of flange of the stem. Such glass prevents the flange from being distorted by the weight of roller electrodes, and keeps the lid and the flange in contact with each other. In addition, the glass serves as a support, and prevents the current from leaking. Therefore, the lid and the flange are sufficiently and surely welded together.

摘要翻译： 包括在包装中的具有空腔的电子设备可以被确定地且有效地用盖子密封。 SAW器件包括固定到杆的平面部分的SAW芯片。 包装的后表面用玻璃气密密封。 设置在包装的上表面上的空腔的开口由具有缝焊的盖子气密地密封。 玻璃被填充以到达茎的法兰的背面。 这种玻璃防止凸缘由于辊电极的重量而变形，并且使盖和凸缘保持彼此接触。 此外，玻璃用作支撑体，防止电流泄漏。 因此，盖和凸缘被充分且可靠地焊接在一起。

公开(公告)号：US20050093171A1

公开(公告)日：2005-05-05

申请号：US10911983

申请日：2004-08-05

申请人： Tsuyoshi Sugiura

发明人： Tsuyoshi Sugiura

IPC分类号： H03H9/25 ,  H01L23/48 ,  H03H9/05 ,  H03H9/10

CPC分类号： H03H9/1071 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2224/73265 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H2009/0019 ,  H01L2924/00014

摘要： A SAW apparatus is provided capable of realizing a small size without adverse affect while mounting the active surfaces of the semiconductor integrated circuit and the surface acoustic wave element. The SAW apparatus comprises a semiconductor IC and a SAW element. The semiconductor IC is flip-chip mounted on a bottom of the package, a non-active surface of the SAW element is bonded to a non-active surface of the semiconductor IC by using an adhesive, and an electrode portion arranged in the active surface is wire-bonded to an electrode pattern formed on the side walls of the package by using wires.

摘要翻译： 提供了一种能够在安装半导体集成电路和表面声波元件的有源表面的同时实现小尺寸而不利影响的SAW装置。 SAW器件包括半导体IC和SAW元件。 半导体IC被倒装安装在封装的底部，SAW元件的非有效表面通过使用粘合剂结合到半导体IC的非有源表面，并且布置在有源表面中的电极部分 通过使用导线将导线接合到形成在包装的侧壁上的电极图案。

公开(公告)号：US20050085016A1

公开(公告)日：2005-04-21

申请号：US10949847

申请日：2004-09-24

申请人： Bruce McWilliams ,  Giles Humpston

发明人： Bruce McWilliams ,  Giles Humpston

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making a chip assembly is provided which includes the steps of: (a) assembling (i) a capped chip including a chip, a cap overlying a front surface of the chip and a sacrificial layer overlying the cap with (ii) one or more further components; and (b) after the assembling step, removing the sacrificial layer from the capped chip. A method of making a plurality of capped chip assemblies is provided which includes the steps of: (a) assembling a lid member and a chip member including a plurality of chips to one another so that the lid member overlies the chip member and a top surface of the lid member faces away from the chip member; (b) severing the lid member and chip member to form a plurality of individual units each including one or more of the chips and a portion of the lid member; (c) providing a sacrificial layer overlying the top surface of the lid member prior to the severing step; and (d) removing the sacrificial layer after the severing step.

摘要翻译： 提供了一种制造芯片组件的方法，其包括以下步骤：（a）组装（i）包括芯片的封盖芯片，覆盖在芯片的前表面上的盖和覆盖盖的牺牲层，（ii）一个 或更多的组分; 和（b）在组装步骤之后，从封盖的芯片上去除牺牲层。 提供一种制造多个封盖芯片组件的方法，其包括以下步骤：（a）将包括多个芯片的盖构件和芯片构件彼此组装，使得盖构件覆盖在芯片构件和顶表面 所述盖构件背离所述芯片构件; （b）切断盖部件和芯片部件以形成多个单独的单元，每个单独的单元包括一个或多个芯片和盖部件的一部分; （c）在切割步骤之前提供覆盖盖构件的顶表面的牺牲层; 和（d）在切割步骤之后去除牺牲层。

公开(公告)号：US20050067688A1

公开(公告)日：2005-03-31

申请号：US10949693

申请日：2004-09-24

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/48 ,  H01L29/40

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A capped chip is provided which includes a chip and a cap member, the chip having a front surface and a plurality of bond pads exposed at the front surface, the cap member having a bottom surface facing the front surface of the chip and having a top surface opposite the front surface. A plurality of through holes extend from the bottom surface of the cap member to the top surface. The capped chip assembly further includes a plurality of metallic interconnects extending from the bond pads at least partially through the through holes, the metallic interconnects including stud bumps joined to the bond pads, the stud bumps contacting and engaging at least one of (i) the top surface of the cap member surrounding the through holes and (ii) inner surfaces of the through holes.

摘要翻译： 提供一种封盖芯片，其包括芯片和盖构件，所述芯片具有前表面和暴露在前表面的多个接合焊盘，所述盖构件具有面向芯片的前表面的底表面，并且具有顶部 表面与前表面相对。 多个通孔从盖构件的底表面延伸到顶表面。 所述封装芯片组件还包括多个金属互连件，所述多个金属互连件至少部分地穿过所述通孔从所述接合焊盘延伸，所述金属互连件包括连接到所述接合焊盘的柱形凸块，所述凸块凸块接触并接合（i） 围绕通孔的帽构件的顶表面和（ii）通孔的内表面。

公开(公告)号：US20030132517A1

公开(公告)日：2003-07-17

申请号：US10338459

申请日：2003-01-08

申请人： Alps Electric Co., Ltd.

发明人： Shigetoshi Matsuta ,  Shoji Kai ,  Hideki Kondo ,  Akihiko Inoue

IPC分类号： H01L023/10

CPC分类号： H03H9/1071 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H03H9/0585 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface acoustic wave (SAW) filter includes a SAW chip mounted in a recession of a multi-layer substrate, a sealing plate covering the recession, an end surface electrode that is provided on the outer surface of the substrate and is in conduction with the SAW chip, a metal conductor for radiating heat that is provided on the surface at the opposite side from the sealing plate of the multi-layer substrate, and a through hole provided in the substrate, one end thereof being connected to the metal conductor. The other end of the through hole is connected with the SAW chip through the intermediary of a metal constituent, such as an electrically conductive adhesive layer.

摘要翻译： 表面声波（SAW）滤波器包括安装在多层基板的凹部中的SAW芯片，覆盖该凹部的密封板，设置在该基板的外表面上并与该基板导通的端面电极 SAW芯片，用于散热的金属导体，其设置在与多层基板的密封板相反的一侧的表面上，以及设置在基板中的通孔，其一端连接到金属导体。 通孔的另一端通过诸如导电粘合剂层的金属成分的介质与SAW芯片连接。

公开(公告)号：US06556105B1

公开(公告)日：2003-04-29

申请号：US09890280

申请日：2001-08-10

申请人： Ngoc-Tuan Nguyen ,  Jean-Marc Bureau ,  Christian LeLong

发明人： Ngoc-Tuan Nguyen ,  Jean-Marc Bureau ,  Christian LeLong

IPC分类号： H03H964

CPC分类号： H03H9/0585 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention relates to a surface wave device linked to a base by a conductive material which is anisotropic in a direction perpendicular to the plane of the surface wave device and of the base. This anisotropic conductive material provides for the mechanical efficacy and the encapsulation of the surface wave device. It is deposited locally in the plane of the base, in such a way as to provide for the presence of a cavity in which the surface acoustic waves can propagate.

摘要翻译： 本发明涉及一种通过导电材料连接到基底的表面波器件，该导电材料在垂直于表面波器件和基底的平面的方向上是各向异性的。 这种各向异性导电材料提供了表面波器件的机械效能和封装。 它以局部沉积在基底的平面中，以便提供表面声波可以传播的空腔的存在。

公开(公告)号：US20010055668A1

公开(公告)日：2001-12-27

申请号：US09884276

申请日：2001-06-19

申请人： Murata Manufacturing Co., Ltd

发明人： Michio Kadota

IPC分类号： B32B001/08 ,  B05D007/00 ,  B05D005/12

CPC分类号： H03H9/1078 ,  B32B3/30 ,  H01L21/561 ,  H01L23/3135 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H03H9/0542 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1085 ,  Y10T428/1307 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/24983 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A surface acoustic wave device includes a SAW element that is mounted on a substrate. Grooves are provided in the substrate at the outer periphery of the SAW element, and a flexible resin layer is provided at the inner portion of the grooves so as to cover the SAW element. An outer resin layer that is harder than the flexible resin layer is provided at the exterior of the flexible resin layer. This configuration facilitates reduction in size and profile of the surface acoustic wave device, contributes to reduction in cost, and exhibits high environmental resistance.

摘要翻译： 表面声波装置包括安装在基板上的SAW元件。 沟槽在SAW元件的外周设置在基板中，并且在凹槽的内部设置柔性树脂层以覆盖SAW元件。 在柔性树脂层的外部设置有比柔性树脂层更硬的外侧树脂层。 该构造有助于降低声表面波装置的尺寸和轮廓，有助于降低成本，并且表现出高的耐环境性。

公开(公告)号：US6154940A

公开(公告)日：2000-12-05

申请号：US90489

申请日：1998-06-03

申请人： Keiji Onishi ,  Hideki Iwaki ,  Shun-ichi Seki ,  Yutaka Taguchi ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Osamu Kawasaki ,  Kazuo Eda

发明人： Keiji Onishi ,  Hideki Iwaki ,  Shun-ichi Seki ,  Yutaka Taguchi ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Osamu Kawasaki ,  Kazuo Eda

IPC分类号： H03H3/08 ,  H03H9/10 ,  H04R17/00

CPC分类号： H03H9/0509 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1071 ,  H03H9/1085 ,  H03H9/1092 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/09701 ,  H01L2924/16152 ,  Y10T29/42 ,  Y10T29/4913 ,  Y10T29/49146

摘要： The present invention relates to an electronic part used for mobile communications apparatuses and the like, and more particularly to an electronic part, such as an acoustic surface-wave device, a piezoelectric ceramic device or the like, which requires an oscillation space near the surface of the functional device chip thereof, and a method of production thereof. With this method, a space retainer for forming a sealed space at the functional portion of the chip can be hermetically sealed and have high moisture resistance, and the process of forming the space retainer can be carried out easily.The electronic part of the present invention comprises a functional device chip, a space retainer for forming a sealed space at the functional portion of the chip, a circuit substrate to which the chip is secured, electrode interconnection portions for establishing electric connection between the chip and the circuit substrate, and a sealing resin for covering and sealing at least the space retainer, wherein the space retainer comprises a support layer made of a synthetic resin film, provided with an opening enclosing the functional portion and joined onto the main surface, and a cover formed and joined onto the support layer so as to cover the functional portion and form a sealed space between the cover and the functional portion.

摘要翻译： 本发明涉及用于移动通信设备等的电子部件，更具体地涉及需要在表面附近的振荡空间的诸如声表面波器件，压电陶瓷器件等的电子部件 的功能元件芯片及其制造方法。 利用这种方法，在芯片的功能部分处形成密封空间的空间保持器可以被气密地密封并且具有高的耐湿性，并且可以容易地进行形成空间保持器的工艺。 本发明的电子部件包括功能元件芯片，用于在芯片的功能部分形成密封空间的空间保持器，固定有芯片的电路基板，用于建立芯片与芯片之间的电连接的电极互连部分 电路基板和用于至少覆盖和密封空间保持器的密封树脂，其中，所述空间保持器包括由合成树脂膜制成的支撑层，所述支撑层设置有封闭所述功能部分并且接合到所述主表面上的开口，以及 盖形成并接合到支撑层上以覆盖功能部分并在盖和功能部分之间形成密封空间。