公开(公告)号：US07140883B2

公开(公告)日：2006-11-28

申请号：US10692114

申请日：2003-10-23

申请人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier, II ,  William D. Smith

发明人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier, II ,  William D. Smith

IPC分类号： G01R31/02

CPC分类号： H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

摘要： An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

摘要翻译： 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US5806181A

公开(公告)日：1998-09-15

申请号：US789147

申请日：1997-01-24

申请人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

发明人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

IPC分类号： H01R43/16 ,  H05K1/11

CPC分类号： H01R43/16 ,  H05K1/11 ,  Y10T29/49144 ,  Y10T29/49204

摘要： The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated from a semiconductor wafer.

摘要翻译： 本发明涉及在电子部件之间进行暂时的压力连接，更具体地说，涉及在半导体器件封装之前优选地在各个半导体器件从半导体晶片分离之前对半导体器件进行测试和老化过程的技术。

公开(公告)号：US07880489B2

公开(公告)日：2011-02-01

申请号：US12264751

申请日：2008-11-04

申请人： Benjamin N. Eldridge ,  Yoshikazu Hatsukano ,  Igor Y. Khandros ,  Gaetan L. Mathieu

发明人： Benjamin N. Eldridge ,  Yoshikazu Hatsukano ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC分类号： G01R31/02

CPC分类号： G01R3/00 ,  B33Y10/00 ,  B33Y80/00 ,  G01R1/06716 ,  G01R1/07342 ,  H05K3/1241 ,  H05K3/4664 ,  Y10T29/49126 ,  Y10T29/49147

摘要： A probe substrate for use in testing semiconductor devices can include a base substrate that can have first electrical terminals at a first pitch. One or more redistribution layers on the base substrate can include droplets of a conductive material that form redistribution traces extending from the first terminals to second electrical terminals at a second pitch different from the first pitch.

摘要翻译： 用于测试半导体器件的探针衬底可以包括可以具有第一间距的第一电端子的基底衬底。 基底衬底上的一个或多个再分配层可以包括形成以不同于第一间距的第二间距从第一端子延伸到第二电端子的再分布迹线的导电材料的液滴。

公开(公告)号：US07701243B2

公开(公告)日：2010-04-20

申请号：US12331163

申请日：2008-12-09

申请人： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

发明人： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

IPC分类号： G01R31/02

CPC分类号： G01R31/2886 ,  G01R31/2887

摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

摘要翻译： 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

公开(公告)号：US20080231305A1

公开(公告)日：2008-09-25

申请号：US12054289

申请日：2008-03-24

申请人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

发明人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

IPC分类号： G01R31/02

CPC分类号： H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

摘要： An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

摘要翻译： 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US07218127B2

公开(公告)日：2007-05-15

申请号：US10781369

申请日：2004-02-18

申请人： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

发明人： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

IPC分类号： G01R31/02

CPC分类号： G01R31/2886 ,  G01R31/2887

摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

摘要翻译： 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

公开(公告)号：US06215196B1

公开(公告)日：2001-04-10

申请号：US09536223

申请日：2000-03-27

申请人： Benjamin N. Eldridge ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen

发明人： Benjamin N. Eldridge ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen

IPC分类号： H01L2348

CPC分类号： H01L24/10 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/0508 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/00

摘要： Spring contact elements are fabricated at areas on an electronic component remote from terminals to which they are electrically connected. For example, the spring contact elements may be mounted to remote regions such as distal ends of extended tails (conductive lines) which extend from a terminal of an electronic component to positions which are remote from the terminals. In this manner, a plurality of substantially identical spring contact elements can be mounted to the component so that their free (distal) ends are disposed in a pattern and at positions which are spatially-translated from the pattern of the terminals on the component. The spring contact elements include, but are not limited to, composite interconnection elements and plated-up structures. The electronic component includes, but is not limited to, a semiconductor device, a memory chip, a portion of a semiconductor wafer, a space transformer, a probe card, a chip carrier, and a socket.

摘要翻译： 弹簧接触元件制造在远离其电连接的端子的电子部件上的区域。 例如，弹簧接触元件可以安装到远程区域，例如从电子部件的端子延伸到远离端子的位置的延伸尾部（导电线）的远端。 以这种方式，可以将多个基本相同的弹簧接触元件安装到部件上，使得它们的自由（远端）端部以图案和从部件上的端子的图案空间平移的位置设置。 弹簧接触元件包括但不限于复合互连元件和电镀结构。 电子部件包括但不限于半导体器件，存储器芯片，半导体晶片的一部分，空间变压器，探针卡，芯片载体和插座。

公开(公告)号：US07063541B2

公开(公告)日：2006-06-20

申请号：US09746716

申请日：2000-12-22

申请人： Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

发明人： Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC分类号： H01R12/00

CPC分类号： G01R1/06727 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/72 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

摘要： An improved microelectronic spring structure, and method of making the same, are disclosed. The improvement comprises, in a spring contact of the type comprising a beam attached to a post, of replacing the post with a plurality of column elements. The beam component is thus provided with one or more column elements which both structurally support and electrically connect one end of the beam to an electronic component. The column elements are preferably comprised of relatively straight segments of wire elements that are ball-bonded to a substrate and are over-coated with suitable structural and/or conducting materials. In the alternative, the improvement comprises a single column element comprised of a relatively straight segment of wire that is ball-bonded to a substrate and over-coated with suitable structural and conducting materials, wherein the column element is essentially rigid. The improved spring structures are especially useful for use as spring contacts on substrates such as probe cards, interposers, semiconductor devices, and other electronic components.

摘要翻译： 公开了一种改进的微电子弹簧结构及其制造方法。 该改进包括在包括附接到柱的梁的类型的弹簧接触中，用多个柱元件替换柱。 因此，梁部件设置有一个或多个列元件，其两个结构上支撑并将电子束的一端电连接到电子部件。 柱元件优选地由相对直的线元件组成，其被球形结合到基底并且被适当的结构和/或导电材料覆盖。 在替代方案中，改进包括单柱元件，其由相对直的导线段组成，其与球体结合到基底上并用适当的结构和导电材料涂覆，其中柱元件基本上是刚性的。 改进的弹簧结构特别适用于诸如探针卡，插入件，半导体器件和其它电子部件的基板上的弹簧触点。

公开(公告)号：US06442831B1

公开(公告)日：2002-09-03

申请号：US08794202

申请日：1997-01-24

申请人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

发明人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

IPC分类号： H01R900

CPC分类号： H05K3/4015 ,  G01R1/06744 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/13018 ,  H01L2224/13144 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/45144 ,  H01L2224/81192 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2203/049 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  H01L2924/00012 ,  H01L2224/1134 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01004

摘要： Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate element, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.

摘要翻译： 通过使用成形工具（512）来形成软质材料（例如金或软铜）的细长芯元件（502），形成用于电子元件的互连元件，其具有期望的机械特性（例如弹性，用于形成压力接触） 电线）具有弹性形状（包括悬臂梁，S形，U形），并用硬质材料（例如镍及其合金）涂覆成形芯体元件，以赋予期望的弹簧（弹性）特性 所得到的复合互连元件。 可以对复合互连元件施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。 所得到的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外罩材料将复合互连元件锚定到电子部件上的端子等），可以被安装 以支撑用作内插件的基板，并且可以安装到用作探针卡或探针卡插入件的基板。 成形工具可以是砧座（622）和模具（624），并且可以切割或切断细长元件的连续成形部分，并且细长元件可以是固有的硬（弹性）材料。 描述了在牺牲基板上制造互连元件的方法。 还描述了在互连元件的末端处制造尖端结构（258）和接触尖端的方法。

公开(公告)号：US06701612B2

公开(公告)日：2004-03-09

申请号：US09753296

申请日：2000-12-29

申请人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

发明人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

IPC分类号： H05K300

CPC分类号： H05K3/4015 ,  G01R1/06744 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/13018 ,  H01L2224/13144 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/45144 ,  H01L2224/81192 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2203/049 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  H01L2924/00012 ,  H01L2224/1134 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01004

摘要： Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.

摘要翻译： 通过使用成形工具（512）来形成软质材料（例如金或软铜）的细长芯元件（502），形成用于电子部件的互连元件，其具有期望的机械特性（例如弹性，用于形成压力接触） 电线）具有弹性形状（包括悬臂梁，S形，U形），并用硬质材料（例如镍及其合金）涂覆成形芯元件，以赋予期望的弹簧（弹性）特性 所得到的复合互连元件。 可以对复合互连元件施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。 所得到的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外罩材料将复合互连元件锚定到电子部件上的端子等），可以被安装 以支撑用作内插件的基板，并且可以安装到用作探针卡或探针卡插入件的基板。 成型工具可以是砧座（622）和模具（624），并且可以切割或切断细长元件的连续成形部分，并且细长元件可以是固有的硬（弹性）材料。 描述了在牺牲基板上制造互连元件的方法。 还描述了在互连元件的末端处制造尖端结构（258）和接触尖端的方法。