公开(公告)号：US06442831B1

公开(公告)日：2002-09-03

申请号：US08794202

申请日：1997-01-24

申请人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

发明人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

IPC分类号： H01R900

CPC分类号： H05K3/4015 ,  G01R1/06744 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/13018 ,  H01L2224/13144 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/45144 ,  H01L2224/81192 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2203/049 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  H01L2924/00012 ,  H01L2224/1134 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01004

摘要： Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate element, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.

摘要翻译： 通过使用成形工具（512）来形成软质材料（例如金或软铜）的细长芯元件（502），形成用于电子元件的互连元件，其具有期望的机械特性（例如弹性，用于形成压力接触） 电线）具有弹性形状（包括悬臂梁，S形，U形），并用硬质材料（例如镍及其合金）涂覆成形芯体元件，以赋予期望的弹簧（弹性）特性 所得到的复合互连元件。 可以对复合互连元件施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。 所得到的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外罩材料将复合互连元件锚定到电子部件上的端子等），可以被安装 以支撑用作内插件的基板，并且可以安装到用作探针卡或探针卡插入件的基板。 成形工具可以是砧座（622）和模具（624），并且可以切割或切断细长元件的连续成形部分，并且细长元件可以是固有的硬（弹性）材料。 描述了在牺牲基板上制造互连元件的方法。 还描述了在互连元件的末端处制造尖端结构（258）和接触尖端的方法。

公开(公告)号：US06701612B2

公开(公告)日：2004-03-09

申请号：US09753296

申请日：2000-12-29

申请人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

发明人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

IPC分类号： H05K300

CPC分类号： H05K3/4015 ,  G01R1/06744 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/13018 ,  H01L2224/13144 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/45144 ,  H01L2224/81192 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2203/049 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  H01L2924/00012 ,  H01L2224/1134 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01004

摘要： Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.

摘要翻译： 通过使用成形工具（512）来形成软质材料（例如金或软铜）的细长芯元件（502），形成用于电子部件的互连元件，其具有期望的机械特性（例如弹性，用于形成压力接触） 电线）具有弹性形状（包括悬臂梁，S形，U形），并用硬质材料（例如镍及其合金）涂覆成形芯元件，以赋予期望的弹簧（弹性）特性 所得到的复合互连元件。 可以对复合互连元件施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。 所得到的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外罩材料将复合互连元件锚定到电子部件上的端子等），可以被安装 以支撑用作内插件的基板，并且可以安装到用作探针卡或探针卡插入件的基板。 成型工具可以是砧座（622）和模具（624），并且可以切割或切断细长元件的连续成形部分，并且细长元件可以是固有的硬（弹性）材料。 描述了在牺牲基板上制造互连元件的方法。 还描述了在互连元件的末端处制造尖端结构（258）和接触尖端的方法。

公开(公告)号：US06836962B2

公开(公告)日：2005-01-04

申请号：US09753188

申请日：2000-12-29

申请人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

发明人： Igor Y. Khandros ,  Thomas H. Dozier ,  Gary W. Grube ,  Gaetan L. Mathieu

IPC分类号： B21D39/00 ,  B23K31/02 ,  H01R9/00

CPC分类号： B21D39/00 ,  B23K31/02 ,  H01R9/00 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49208 ,  Y10T29/49211 ,  Y10T29/49213

摘要： Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.

摘要翻译： 通过使用成形工具（512）来形成软质材料（例如金或软铜）的细长芯元件（502），形成用于电子部件的互连元件，其具有期望的机械特性（例如弹性，用于形成压力接触） 电线）具有弹性形状（包括悬臂梁，S形，U形），并用硬质材料（例如镍及其合金）涂覆成形芯元件，以赋予期望的弹簧（弹性）特性 所得到的复合互连元件。 可以对复合互连元件施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。 所得到的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外罩材料将复合互连元件锚定到电子部件上的端子等），可以被安装 以支撑用作内插件的基板，并且可以安装到用作探针卡或探针卡插入件的基板。 成型工具可以是砧座（622）和模具（624），并且可以切割或切断细长元件的连续成形部分，并且细长元件可以是固有的硬（弹性）材料。 描述了在牺牲基板上制造互连元件的方法。 还描述了在互连元件的末端处制造尖端结构（258）和接触尖端的方法。

公开(公告)号：US06741085B1

公开(公告)日：2004-05-25

申请号：US08994799

申请日：1997-12-19

申请人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

发明人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

IPC分类号： G01R3102

CPC分类号： H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

摘要： A plurality of contact elements, such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates which, in turn, are mounted and connected to a relatively large electronic component substrate, thereby populating the electronic component with a plurality of contact elements while avoiding the necessity of yielding the contact elements directly upon the electronic component. The relatively large electronic component is suitably a space transformer component of a probe card assembly. In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-level burn-in, and the like. Solder balls, z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates and the electronic component. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the tiles can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described. Techniques for maintaining a prescribed x-y and z-axis alignment of the tiles to the relatively large substrate are disclosed.

摘要翻译： 多个接触元件，例如接触凸起或包括单片和复合互连元件的独立弹簧触点，安装到相对较小的瓦片衬底上，该衬底又安装并连接到相对较大的电子部件衬底，由此填充 电子部件具有多个接触元件，同时避免了必须直接在电子部件上产生接触元件。 相对较大的电子部件适当地是探针卡组件的空间变压器部件。 以这种方式，可以一次对整个半导体晶片进行压力连接，以提供晶片级老化等。 焊接球，z轴导电粘合剂或柔性连接适用于在瓦片基片和电子部件之间进行电连接。 使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置瓦片以优化整个晶片的探测。 作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。 公开了用于将瓷砖的规定的x-y和z轴对准维持在相对较大的衬底上的技术。

公开(公告)号：US20080231305A1

公开(公告)日：2008-09-25

申请号：US12054289

申请日：2008-03-24

申请人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

发明人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

IPC分类号： G01R31/02

CPC分类号： H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

摘要： An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

摘要翻译： 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US5806181A

公开(公告)日：1998-09-15

申请号：US789147

申请日：1997-01-24

申请人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

发明人： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

IPC分类号： H01R43/16 ,  H05K1/11

CPC分类号： H01R43/16 ,  H05K1/11 ,  Y10T29/49144 ,  Y10T29/49204

摘要： The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated from a semiconductor wafer.

摘要翻译： 本发明涉及在电子部件之间进行暂时的压力连接，更具体地说，涉及在半导体器件封装之前优选地在各个半导体器件从半导体晶片分离之前对半导体器件进行测试和老化过程的技术。

公开(公告)号：US6150186A

公开(公告)日：2000-11-21

申请号：US217589

申请日：1998-12-22

申请人： Jimmy Kuo-Wei Chen ,  Benjamin N. Eldridge ,  Thomas H. Dozier ,  Junjye J. Yeh ,  Gayle J. Herman

发明人： Jimmy Kuo-Wei Chen ,  Benjamin N. Eldridge ,  Thomas H. Dozier ,  Junjye J. Yeh ,  Gayle J. Herman

IPC分类号： B23K20/00 ,  B81B7/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/00 ,  C25D7/12 ,  C25D21/02 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01H1/00 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L21/768 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC分类号： B23K20/004 ,  B81B7/0006 ,  C23C18/1692 ,  C23C18/36 ,  C23C18/50 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/326 ,  H05K3/4015 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  C25D7/123 ,  G01R1/06761 ,  G01R3/00 ,  H01H1/0036 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/13144 ,  H01L2224/1357 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L24/45 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1532 ,  H01L2924/30107 ,  H05K1/141 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  Y02P70/611 ,  Y10T428/12438

摘要： Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25.degree. C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed "stress relief" heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating a shape and heat treating provides a shaped deposit with improved material properties. Coating a shape with a portion connected to a base and a portion detached therefrom can provide a resilient, conductive contact useful for electronic applications.

摘要翻译： 将金属沉积在优选的形状中，包括部件上的涂层或独立材料，以及随后的热处理以提供改进的机械性能。 特别地，该方法给出具有较高屈服强度的产品。 产品通常具有相对较高的弹性模量，并且是热稳定的，在高于25℃的温度下保持高的屈服强度。该技术涉及在选定的添加剂的存在下沉积材料，然后使沉积的材料经受温和 热处理。 这种适度的热处理与使用较低温度和/或更短时间的其它常用的“应力消除”热处理不同，优选刚好足以将材料重组成新的期望形式。 涂覆形状和热处理提供具有改善的材料性质的成形沉积物。 涂覆具有连接到基部的部分和从其分离的部分的形状可以提供用于电子应用的弹性导电接触。