公开(公告)号：US10431499B2

公开(公告)日：2019-10-01

申请号：US16134650

申请日：2018-09-18

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Guowei Xu ,  Hui Zang ,  Haiting Wang ,  Yue Zhong

IPC: H01L21/8238 ,  H01L21/8234 ,  H01L27/02 ,  H01L27/088 ,  H01L21/311 ,  H01L29/66 ,  H01L21/3213 ,  H01L21/3105 ,  H01L21/02 ,  H01L21/027

Abstract: One illustrative integrated circuit product disclosed herein includes a first final gate structure for a first transistor device, a second final gate structure for a second transistor device, the first and second transistors having a gate width direction and a gate length direction that is substantially normal to the gate width direction, and an insulating gate separation structure positioned between the first and second final gate structures, the insulating gate separation structure comprising an upper portion and a lower portion, the lower portion having a first lateral width in the gate width direction that is substantially uniform throughout a vertical height of the lower portion, the upper portion having a substantially uniform second lateral width in the gate width direction that is substantially uniform throughout a vertical height of the upper portion, wherein the second lateral width is less than the first lateral width.

公开(公告)号：US10403742B2

公开(公告)日：2019-09-03

申请号：US15712748

申请日：2017-09-22

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Wei Zhao ,  Haiting Wang ,  David P. Brunco ,  Jiehui Shu ,  Shesh Mani Pandey ,  Jinping Liu ,  Scott Beasor

IPC: H01L29/66 ,  H01L21/02 ,  H01L21/762 ,  H01L29/417 ,  H01L21/8234 ,  H01L21/8238 ,  H01L27/088 ,  H01L27/092 ,  H01L29/10 ,  H01L21/84 ,  H01L27/12

Abstract: Methods of forming a structure for a fin-type field-effect transistor and structures for a fin-type field-effect transistor. An etch stop layer, a sacrificial layer, and a dielectric layer are arranged in a layer stack formed on a substrate. a plurality of openings are formed that extend through the layer stack to the substrate. A semiconductor material is epitaxially grown inside each of the plurality of openings from the substrate to form a plurality of fins embedded in the layer stack. The sacrificial layer is removed selective to the etch stop layer to reveal a section of each of the plurality of fins.

公开(公告)号：US10396206B2

公开(公告)日：2019-08-27

申请号：US15643940

申请日：2017-07-07

Applicant: GLOBALFOUNDRIES INC.

Inventor： Ashish Kumar Jha ,  Haiting Wang ,  Wei Hong ,  Wei Zhao ,  Tae Jeong Lee ,  Zhenyu Hu

IPC: H01L29/78 ,  H01L27/088 ,  H01L21/3213 ,  H01L21/8234 ,  H01L21/311 ,  H01L21/033 ,  H01L21/02 ,  H01L21/027 ,  H01L21/321 ,  H01L21/3105 ,  H01L21/3205 ,  H01L29/66 ,  H01L21/475 ,  H01L29/43 ,  H01L27/02 ,  H01L27/118

Abstract: A method of manufacturing a semiconductor device includes the formation of an oxide spacer layer to modify the critical dimension of a gate cut opening in connection with a replacement metal gate process. The oxide spacer layer is deposited after etching a gate cut opening in an overlying hard mask such that the oxide spacer layer is deposited onto sidewall surfaces of the hard mask within the opening and directly over the top surface of a sacrificial gate. The oxide spacer may also be deposited into recessed regions within an interlayer dielectric located adjacent to the sacrificial gate. By filling the recessed regions with an oxide, the opening of trenches through the oxide spacer layer and the interlayer dielectric to expose source/drain junctions can be simplified.

公开(公告)号：US20190244865A1

公开(公告)日：2019-08-08

申请号：US16134650

申请日：2018-09-18

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Guowei Xu ,  Hui Zang ,  Haiting Wang ,  Yue Zhong

IPC: H01L21/8234 ,  H01L21/3213 ,  H01L27/02 ,  H01L27/088 ,  H01L21/311 ,  H01L29/66 ,  H01L21/3105 ,  H01L21/02 ,  H01L21/027

CPC classification number: H01L21/823437 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/0228 ,  H01L21/0274 ,  H01L21/31053 ,  H01L21/31111 ,  H01L21/31144 ,  H01L21/32133 ,  H01L21/32139 ,  H01L21/823431 ,  H01L21/823481 ,  H01L27/0207 ,  H01L27/0886 ,  H01L29/66545

Abstract: One illustrative integrated circuit product disclosed herein includes a first final gate structure for a first transistor device, a second final gate structure for a second transistor device, the first and second transistors having a gate width direction and a gate length direction that is substantially normal to the gate width direction, and an insulating gate separation structure positioned between the first and second final gate structures, the insulating gate separation structure comprising an upper portion and a lower portion, the lower portion having a first lateral width in the gate width direction that is substantially uniform throughout a vertical height of the lower portion, the upper portion having a substantially uniform second lateral width in the gate width direction that is substantially uniform throughout a vertical height of the upper portion, wherein the second lateral width is less than the first lateral width.

公开(公告)号：US20190035633A1

公开(公告)日：2019-01-31

申请号：US15665183

申请日：2017-07-31

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Ashish Kumar Jha ,  Hui Zhan ,  Hong Yu ,  Zhenyu Hu ,  Haiting Wang ,  Edward Reis ,  Charles Vanleuvan

IPC: H01L21/28 ,  H01L21/762 ,  H01L21/8234 ,  H01L21/475

Abstract: A shallow trench isolation (STI) structure is formed from a conventional STI trench structure formed of first dielectric material extending into the substrate. The conventional STI structure undergoes further processing, including removing a first portion of the dielectric material and adjacent portions of the semiconductor substrate to create a first recess, and then removing another portion of the dielectric material to create a second recess in just the dielectric material. A nitride layer is formed above remaining dielectric material and on the sidewalls of the substrate. A second dielectric material is formed on the spacer layer and fills the remainder of first and second recesses. The nitride layer provides an “inner spacer” between the first insulating material and the second insulating material and also separates the substrate from the second insulating material. An isotropic Fin reveal process is performed and the STI structure assists in equalizing fin heights and increasing active S/D region area/volume.

公开(公告)号：US09698269B2

公开(公告)日：2017-07-04

申请号：US15059793

申请日：2016-03-03

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Wei Hua Tong ,  Tien-Ying Luo ,  Yan Ping Shen ,  Feng Zhou ,  Jun Lian ,  Haoran Shi ,  Min-hwa Chi ,  Jin Ping Liu ,  Haiting Wang ,  Seung Kim

IPC: H01L29/78 ,  H01L29/51 ,  H01L21/324 ,  H01L21/02 ,  H01L21/321 ,  H01L21/28 ,  H01L29/66

CPC classification number: H01L29/7851 ,  H01L21/02247 ,  H01L21/02252 ,  H01L21/02312 ,  H01L21/02332 ,  H01L21/0234 ,  H01L21/28185 ,  H01L21/28202 ,  H01L21/28211 ,  H01L21/321 ,  H01L21/324 ,  H01L29/511 ,  H01L29/512 ,  H01L29/513 ,  H01L29/518 ,  H01L29/66795 ,  H01L29/785

Abstract: Fin-type transistor fabrication methods and structures are provided having one or more nitrided conformal layers, to improve reliability of the semiconductor device. The method includes, for example, providing at least one material layer disposed, in part, conformally over a fin extending above a substrate, the material layer(s) including a gate dielectric layer; and performing a conformal nitridation process over an exposed surface of the material layer(s), the conformal nitridation process forming an exposed, conformal nitrided surface.

公开(公告)号：US09425100B1

公开(公告)日：2016-08-23

申请号：US14694276

申请日：2015-04-23

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Zhaoxu Shen ,  Min-hwa Chi ,  Haiting Wang ,  Qin Wang ,  Meixiong Zhao ,  Duohui Bei

IPC: H01L21/00 ,  H01L21/8234 ,  H01L27/088 ,  H01L21/306 ,  H01L29/06 ,  H01L29/10 ,  H01L21/308

CPC classification number: H01L21/823412 ,  H01L21/76224 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823481 ,  H01L27/088 ,  H01L27/0886 ,  H01L29/045 ,  H01L29/1033 ,  H01L29/1037 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/7853

Abstract: Methods and transistors for circuit structures are provided. The methods include, for instance: defining a channel region in a substrate, the channel region having at least one channel region sidewall adjoining an isolation material; recessing the isolation material to expose an upper portion of the at least one channel region sidewall; and providing a gate structure over a gate interface area with the channel region. The gate interface area includes at least the upper portion of the at least one channel region sidewall and an upper surface of the channel region so that a threshold voltage of the gate structure may be reduced. The methods may also include etching an elongate notch in the upper portion of the at least one channel region sidewall to increase a size of the gate interface area and further reduce the threshold voltage of the gate structure.

Abstract translation: 提供了用于电路结构的方法和晶体管。 所述方法包括例如：在衬底中限定沟道区，所述沟道区具有邻近隔离材料的至少一个沟道区侧壁; 使隔离材料凹陷以暴露至少一个通道区域侧壁的上部; 以及在与沟道区域的栅极接口区域上提供栅极结构。 栅极界面区域至少包括至少一个沟道区域侧壁的上部和沟道区域的上表面，使得可以减小栅极结构的阈值电压。 所述方法还可以包括蚀刻在所述至少一个沟道区域侧壁的上部中的细长凹口以增加栅极界面面积的尺寸并进一步降低栅极结构的阈值电压。

公开(公告)号：US09331159B1

公开(公告)日：2016-05-03

申请号：US14615470

申请日：2015-02-06

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Ashish Kumar Jha ,  Yan Ping Shen ,  Wei Hua Tong ,  Haiting Wang ,  Min-Hwa Chi

IPC: H01L21/336 ,  H01L21/8234 ,  H01L29/417 ,  H01L29/66 ,  H01L21/311 ,  H01L21/306 ,  H01L21/02 ,  H01L29/04 ,  H01L29/08 ,  H01L29/78

CPC classification number: H01L29/41783 ,  H01L21/02233 ,  H01L21/30608 ,  H01L21/3083 ,  H01L21/31111 ,  H01L29/045 ,  H01L29/0847 ,  H01L29/6653 ,  H01L29/66568 ,  H01L29/66636 ,  H01L29/78

Abstract: Methods of fabricating transistors having raised active region(s) with at least partially angled upper surfaces are provided. The method includes, for instance: providing a gate structure disposed over a substrate, the gate structure including a conformal spacer layer; forming a raised active region adjoining a sidewall of the conformal spacer layer; providing a protective material over the raised active region; selectively etching-back the sidewall of the conformal spacer layer, exposing a side portion of the raised active region below the protective material; and etching the exposed side portion of the raised active region to partially undercut the protective material, wherein the etching facilitates defining, at least in part, an at least partially angled upper surface of the raised active region of the transistor.

Abstract translation: 提供了制造具有至少部分成角度的上表面的具有凸起的有源区域的晶体管的方法。 该方法包括例如：提供设置在衬底上的栅极结构，所述栅极结构包括共形间隔层; 形成邻接所述共形间隔层的侧壁的凸起的有源区; 在凸起的活动区域上提供保护材料; 选择性地蚀刻保形间隔层的侧壁，将凸起的有源区域的侧部暴露在保护材料下方; 并且蚀刻凸起的有源区域的暴露的侧部分以部分地切割保护材料，其中蚀刻有助于至少部分地限定晶体管的凸起的有源区的至少部分成角度的上表面。

公开(公告)号：US20140193957A1

公开(公告)日：2014-07-10

申请号：US13738270

申请日：2013-01-10

Applicant: GLOBALFOUNDRIES INC.

Inventor： Ashish K. Jha ,  Tae-Hoon Kim ,  Tae Hoon Lee ,  Chang Ho Maeng ,  Songkram Srivathanakul ,  Haiting Wang

IPC: H01L21/8238

CPC classification number: H01L21/823828 ,  H01L21/82385 ,  H01L21/823864 ,  H01L27/092

Abstract: In general, aspects of the present invention relate to approaches for forming a semiconductor device such as a FET with reduced gate stack height variance. Specifically, when a gate stack height variance is detected/identified between a set of gate stacks, a hard mask layer and sets of spacers are removed from the uneven gate stacks leaving behind (among other things) a set of dummy gates. A liner layer and an inter-layer dielectric are formed over the set of dummy gates. The liner layer is then removed from a top surface (or at least a portion thereof) of the set of dummy gates, and the set of dummy gates are then removed. The result is a set of gate regions having less height variance/disparity.

Abstract translation: 通常，本发明的方面涉及用于形成半导体器件（例如具有降低的栅叠层高度差异的FET）的方法。 具体地，当在一组栅极堆叠之间检测/识别栅堆叠高度方差时，从不均匀栅极堆叠中去除硬掩模层和隔离层组，留下（尤其是）一组虚拟栅极。 衬套层和层间电介质形成在该组虚拟栅极上。 然后将衬垫层从该组虚拟栅极的顶表面（或其至少一部分）移除，然后去除该组虚拟栅极。 结果是具有较小高度变化/差异的一组栅极区域。

公开(公告)号：US10833067B1

公开(公告)日：2020-11-10

申请号：US16519135

申请日：2019-07-23

Applicant: GLOBALFOUNDRIES INC.

Inventor： Haiting Wang ,  Sipeng Gu ,  Jiehui Shu ,  Scott H. Beasor ,  Zhenyu Hu

IPC: H01L27/06 ,  H01L49/02 ,  H01L29/66 ,  H01L29/51 ,  H01L29/78 ,  H01L29/06

Abstract: A structure includes a first dielectric over a trench silicide (TS) contact and over a gate structure, and at least one cavity in the first dielectric. A metal resistor layer is on a bottom and sidewalls of the at least one cavity and extends over the first dielectric. A first contact is on the metal resistor layer over the first dielectric; and a second contact is on the metal resistor layer over the first dielectric. The metal resistor layer is over the TS contact and over the gate structure. Where a plurality of cavities are provided in the dielectric, a resistor structure formed by the metal resistor layer may have an undulating cross-section over the plurality of cavities and the dielectric.