公开(公告)号：US20150313013A1

公开(公告)日：2015-10-29

申请号：US14443213

申请日：2014-10-30

Applicant: LG CHEM, LTD.

Inventor： Yong Chan KIM ,  Jin Hyong LIM ,  Ki-Hwan KIM ,  Junghwan YOON ,  Ilha LEE

IPC: H05K1/09 ,  H05K1/02 ,  H05K3/06 ,  G06F1/16 ,  H01L31/0224 ,  H05K5/00 ,  G06F3/041

CPC classification number: H05K1/09 ,  G06F1/16 ,  G06F3/041 ,  H01B1/026 ,  H01L31/022433 ,  H01L31/022475 ,  H01L31/022483 ,  H01L31/1884 ,  H01L51/445 ,  H05K1/0274 ,  H05K1/0298 ,  H05K3/06 ,  H05K5/0017 ,  H05K2201/0108 ,  H05K2201/0338 ,  Y02E10/50

Abstract: The present application relates to a conductive film, a method for manufacturing the same, and a display device including the same.

Abstract translation: 本申请涉及导电膜，其制造方法和包括该导电膜的显示装置。

公开(公告)号：US09161456B1

公开(公告)日：2015-10-13

申请号：US14476059

申请日：2014-09-03

Applicant: Ronald Steven Cok ,  Mitchell Stewart Burberry

Inventor： Ronald Steven Cok ,  Mitchell Stewart Burberry

IPC: H01L21/4763 ,  H05K3/12 ,  H05K3/00

CPC classification number: H05K3/1258 ,  H05K3/0014 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2203/0108 ,  H05K2203/088

Abstract: A method of making a micro-wire rib structure includes providing a substrate and locating a curable layer on or over the substrate. The curable layer is imprinted and cured to form a cured layer including a cured-layer surface and a micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A curable conductive material is located in the micro-channel and cured to provide a cured electrical conductor forming a micro-wire in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s), to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.

Abstract translation: 制造微线肋结构的方法包括提供衬底并将可固化层定位在衬底上或衬底上。 可固化层被印迹固化以形成固化层，该固化层包括固化层表面和具有微通道深度的微通道，微通道底部，第一和第二微通道侧，以及一个或多个肋，其具有 相对的肋侧面和肋顶部限定肋高度小于微通道深度。 每个肋条位于第一和第二微通道侧之间，并且从微通道底部向固化层表面延伸。 可固化导电材料位于微通道中并固化以提供在微通道中形成微线的固化电导体。 微线从第一微通道侧，微通道底部，肋侧和肋顶部连续延伸到第二微通道侧，从第一微通道侧形成来自第一微通道侧的连续电导体 通道侧到第二微通道侧。

公开(公告)号：US20150289370A1

公开(公告)日：2015-10-08

申请号：US14000186

申请日：2012-12-20

Applicant: NANCHANG O-FILM TECH. CO., LTD.

Inventor： Yulong Gao ,  Zheng Cui ,  Hongwei Kang

IPC: H05K1/11 ,  H05K3/10 ,  H05K1/02

CPC classification number: H05K1/11 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/092 ,  H05K3/06 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/09681 ,  H05K2203/0514 ,  H05K2203/0545 ,  Y02E10/50 ,  Y10T29/49155

Abstract: A double-sided patterned transparent conductive film includes an upper surface conductive layer (12) and a lower surface conductive layer (12). The upper surface conductive layer is a patterned trench network; the lower surface conductive layer is a full-surface trench network. A trench of the upper surface conductive layer is filled with conductive material (13), and a trench of the lower surface conductive layer is intermittently filled with conductive material (13). The double-sided patterned transparent conductive film has a high resolution, transmittance, independently adjustable square resistance and many other advantages, such that the transparent conductive film saves a cost of PET. According to the manufacturing method, the alignment is not needed for double-sided imprinting of a single flexible substrate, thus the process is simple, low cost, advantageous for industrial production.

Abstract translation: 双面图案化的透明导电膜包括上表面导电层（12）和下表面导电层（12）。 上表面导电层是图案化的沟槽网络; 下表面导电层是全表面沟槽网络。 上表面导电层的沟槽填充有导电材料（13），并且下表面导电层的沟槽间歇地填充有导电材料（13）。 双面图案化的透明导电膜具有高分辨率，透射率，独立可调的方形电阻等许多优点，使得透明导电膜节省了PET的成本。 根据制造方法，对于单个柔性基板的双面印刷不需要对准，因此该工艺简单，成本低，对于工业生产是有利的。

公开(公告)号：US20150257258A1

公开(公告)日：2015-09-10

申请号：US14639318

申请日：2015-03-05

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Katsuyuki NAITO ,  Norihiro YOSHINAGA ,  Tianyi YANG ,  Yoshihiro AKASAKA

IPC: H05K1/02 ,  H01L33/62 ,  H05K1/14 ,  H01L33/48

CPC classification number: H05K1/0274 ,  H01L33/42 ,  H01L33/486 ,  H01L33/62 ,  H05K1/144 ,  H05K2201/0108 ,  H05K2201/0323 ,  H05K2201/0379

Abstract: According to one embodiment, a transparent conductor includes a transparent substrate; a metal nanowire layer disposed on the transparent substrate and including a plurality of metal nanowires; a graphene oxide layer covering the metal nanowire layer; and an electrical insulating resin layer disposed in contact with the graphene oxide layer.

Abstract translation: 根据一个实施例，透明导体包括透明基板; 金属纳米线层，其设置在所述透明基板上并且包括多个金属纳米线; 覆盖金属纳米线层的石墨烯氧化物层; 以及与所述石墨烯氧化物层接触地设置的电绝缘性树脂层。

公开(公告)号：US20150255186A1

公开(公告)日：2015-09-10

申请号：US14626937

申请日：2015-02-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： AKIRA TSUJIMOTO ,  TAKASHI ICHIRYU ,  KAZUMA MIMA

IPC: H01B1/22 ,  C23F1/00 ,  C23F1/16 ,  H05K1/09 ,  H01L31/0224

CPC classification number: H01B5/14 ,  C23F1/02 ,  C23F1/16 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04103 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/022491 ,  H01L51/442 ,  H05K1/092 ,  H05K3/282 ,  H05K2201/0108 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/24331 ,  Y10T428/31678

Abstract: A aspect of the present disclosure provides a base material with a transparent conductive film on or above the base material. The transparent conductive film includes a conductive layer containing metal wires, and a protective layer being located on a side of the conductive layer and containing a resin and a particle, the side not opposing to the base material. The particle is soluble in an acidic etching solution, and the resin is resistant to the acidic etching solution.

Abstract translation: 本公开的一个方面提供了在基材上或上方具有透明导电膜的基材。 透明导电膜包括含有金属线的导电层和保护层，该保护层位于导电层的一侧，并且包含树脂和颗粒，该基材不与基底材料相对。 该颗粒可溶于酸性蚀刻溶液中，并且该树脂对酸蚀刻溶液具有耐受性。

公开(公告)号：US20150222966A1

公开(公告)日：2015-08-06

申请号：US14172282

申请日：2014-02-04

Applicant: Raytheon Company

Inventor： Michael H. Robson ,  Michael T. Pace

IPC: H04Q11/00 ,  H04B10/2575

CPC classification number: H04Q11/0003 ,  H04B10/00 ,  H04B10/2575 ,  H04Q3/00 ,  H05K1/0274 ,  H05K1/0373 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/10128

Abstract: A method of dynamically routing a transmission line in a photosensitive layer including optically switching elements and a system to dynamically route a transmission line are described. The method includes determining dimensions of the transmission line based on a radio frequency signal for transmission through the transmission line. The method also includes controlling a light source to illuminate a portion of the optical switching elements of the photosensitive layer according to the dimensions to route the transmission line.

Abstract translation: 描述了一种在包括光开关元件的光敏层中动态路由传输线的方法和用于动态路由传输线的系统。 该方法包括基于用于通过传输线传输的射频信号确定传输线的尺寸。 该方法还包括控制光源以根据传输线的尺寸来照射光敏层的光开关元件的一部分。

公开(公告)号：US20150181702A1

公开(公告)日：2015-06-25

申请号：US14640458

申请日：2015-03-06

Applicant: Eastman Kodak Company

Inventor： Ronald Steven Cok ,  David Paul Trauernicht

IPC: H05K1/02 ,  H05K1/09

CPC classification number: H05K1/097 ,  H05K3/1258 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/09736 ,  H05K2201/09845

Abstract: A connection-pad structure includes a substrate and a An electrical conductor including a plurality of micro-wires form an electrically continuous connection pad on or in the substrate. An electrical connector is electrically connected to the electrical conductor.

Abstract translation: 连接焊盘结构包括基板和包括多根微导线的电导体在基板上或基板中形成电连续的连接焊盘。 电连接器电连接到电导体。

公开(公告)号：US20150160414A1

公开(公告)日：2015-06-11

申请号：US14097812

申请日：2013-12-05

Applicant: Ronald Steven Cok ,  Todd Mathew Spath

Inventor： Ronald Steven Cok ,  Todd Mathew Spath

IPC: G02B6/13 ,  H01L31/12 ,  H01L31/18

CPC classification number: G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12126 ,  G02B2006/12147 ,  G06F3/044 ,  H01L21/76895 ,  H01L23/5386 ,  H01L31/12 ,  H01L31/18 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/10 ,  H05K3/101 ,  H05K3/1258 ,  H05K3/32 ,  H05K2201/0108 ,  H05K2201/09036 ,  H05K2201/10356 ,  H05K2203/0108 ,  H01L2924/00

Abstract: A method of making an imprinted optical micro-channel structure for transmitting light to an optical receiver or receiving light from an optical transmitter includes forming a curable optical layer over a substrate and imprinting one or more optical micro-channels in the optical layer with a first stamp. The curable optical layer is cured to form a cured optical layer having the optical micro-channels imprinted in the cured optical layer. A curable light-transparent material is located in the optical micro-channels and cured to form light-pipes of cured light-transparent material in the optical micro-channels. The optical transmitter located in alignment with a light-pipe for transmitting light through the light-pipe or the optical receiver is located in alignment with a light-pipe for receiving light from the light-pipe.

Abstract translation: 一种制造用于将光传输到光接收器或从光发射器接收光的压印光学微通道结构的方法包括在衬底上形成可固化的光学层，并在第一个光学层中印刷一个或多个光学微通道 邮票。 固化光学层被固化以形成固化的光学层，该光学层具有印刷在固化的光学层中的光学微通道。 可光固化的透光材料位于光学微通道中并固化，以在光学微通道中形成固化的透光材料的光管。 与用于透过光管或光接收器透射光的光管对准的光发射器与用于接收来自光管的光的光管对准。

公开(公告)号：US20150155453A1

公开(公告)日：2015-06-04

申请号：US14617067

申请日：2015-02-09

Applicant: Heraeus Noblelight GmbH

Inventor： Michael PEIL ,  Florin OSWALD ,  Harald MAIWEG

IPC: H01L33/56 ,  H01L27/15 ,  H01L27/144 ,  H01L31/0203

CPC classification number: H01L33/54 ,  F21K9/90 ,  F21Y2115/10 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3121 ,  H01L27/1446 ,  H01L27/15 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H05K1/0274 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/0162 ,  H05K2201/0175 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/0126 ,  H01L2924/00

Abstract: A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.

Abstract translation: 提供了一种用于涂覆光电芯片模块的方法，其包括具有一个或多个光电子部件的平坦基板，其具有由一个或多个硅氧烷构成的透明的耐紫外线和耐温涂层。 还提供了相应的光电芯片组模块和具有多个光电芯片模块的系统。 该方法包括以下步骤：a）将待涂覆的基材预热至第一温度; b）在预热的基底上施加包围待涂覆的基底的表面积或部分区域的坝，所述坝由在第一温度下固化的第一可热固化的高反应性硅树脂制成; c）用液体第二硅胶填充由大坝封闭的基板的表面积或部分区域; 和d）固化第二硅氧烷。

公开(公告)号：US20150083565A1

公开(公告)日：2015-03-26

申请号：US14560528

申请日：2014-12-04

Applicant: INNOLUX CORPORATION

Inventor： KAI MENG ,  LIEN-HSIN LEE

IPC: H03K17/96

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/041 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112 ,  H03K17/9622 ,  H03K2017/9613 ,  H03K2217/96075 ,  H03K2217/960755 ,  H03K2217/960765 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/10 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/017 ,  Y10T29/49105 ,  Y10T29/49155 ,  Y10T29/49162

Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.