公开(公告)号：US6163070A

公开(公告)日：2000-12-19

申请号：US977669

申请日：1997-11-24

Applicant: Ryuichiro Mori

Inventor： Ryuichiro Mori

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H05K3/36 ,  H05K13/04 ,  H01L23/02

CPC classification number: H01L23/4985 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K3/363 ,  H05K13/046 ,  H05K2201/055 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10681 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A semiconductor package having a plurality of electrodes arranged along one side of a rectangular semiconductor element; a plurality of wirings, one end of the wiring to be electrically connected with the electrode being arranged adjacent to the electrode and the other end of the wiring being exposed from an opening for external connection; a conductive member provided on the opening for external connection; a flexible wiring substrate on which the semiconductor element is mounted, and the wiring and the conductive member are arranged; and a sealing resin for sealing, except for the conductive member, the semiconductor element and a periphery of the semiconductor element. The semiconductor package can be connected in a horizontal or inclined condition with respect to the substrate for packaging by folding the flexible wiring substrate.

Abstract translation: 一种半导体封装，具有沿矩形半导体元件的一侧布置的多个电极; 多个布线，与电极电连接的布线的一端布置成与电极相邻，并且布线的另一端从用于外部连接的开口露出; 设置在所述开口上用于外部连接的导电构件; 布置有半导体元件的柔性布线基板，布线和导电部件布置; 以及用于密封除了导电构件，半导体元件和半导体元件的周边之外的密封树脂。 半导体封装可以通过折叠柔性布线基板而相对于用于封装的基板以水平或倾斜状态连接。

公开(公告)号：US6031318A

公开(公告)日：2000-02-29

申请号：US47854

申请日：1998-03-25

Applicant: Kenji Sunaga ,  Hideo Hoshi ,  Masayoshi Shiraishi ,  Kishirou Nakamura ,  Takashi Konno

Inventor： Kenji Sunaga ,  Hideo Hoshi ,  Masayoshi Shiraishi ,  Kishirou Nakamura ,  Takashi Konno

IPC: H03H9/02 ,  H03H3/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/19 ,  H05K3/30 ,  H01L41/04

CPC classification number: H03H9/0504 ,  H05K3/303 ,  H05K2201/09781 ,  H05K2201/10075 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K3/301 ,  Y02P70/613

Abstract: A crystal oscillating device comprises an outer case having a longitudinal axis, a cavity, a pair of first surfaces extending along the longitudinal axis, a pair of second surfaces extending in a direction generally transverse to the longitudinal axis, a first opening portion in one of the first surfaces for providing access into the cavity, a second opening portion in one of the second surfaces, and a groove in the other of the second surfaces. A crystal oscillator is disposed in the cavity of the outer case and has lead terminals extending through the second opening portion of the outer case for electrically connecting the crystal oscillator to a circuit board. A bonding material is disposed in the cavity of the outer case for bonding the crystal oscillator to the outer case. A connecting member is disposed in the groove of the outer case for connecting the outer case to the circuit board.

Abstract translation: 一种晶体振荡装置包括具有纵向轴线的外壳体，腔体，沿着纵向轴线延伸的一对第一表面，沿着大致横向于纵向轴线的方向延伸的一对第二表面， 用于提供进入空腔的第一表面，在第二表面之一中的第二开口部分和另一个第二表面中的凹槽。 晶体振荡器设置在外壳的空腔中，并且具有延伸穿过外壳的第二开口部分的引线端子，用于将晶体振荡器电连接到电路板。 接合材料设置在外壳的空腔中，用于将晶体振荡器接合到外壳。 连接构件设置在外壳的槽中，用于将外壳连接到电路板。

公开(公告)号：US6011741A

公开(公告)日：2000-01-04

申请号：US121348

申请日：1998-07-23

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G06F3/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/38 ,  G06K7/00 ,  G11C5/00 ,  G11C5/02 ,  G11C7/00 ,  G11C16/04 ,  G11C16/06 ,  H05K1/14

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G06K7/0047 ,  G11C5/04 ,  H05K1/141 ,  H05K7/1431 ,  G06F2003/0694 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H05K3/3421

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

公开(公告)号：US5867417A

公开(公告)日：1999-02-02

申请号：US907111

申请日：1997-08-06

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G06F3/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/38 ,  G06K7/00 ,  G11C5/00 ,  G11C5/02 ,  G11C7/00 ,  G11C16/04 ,  G11C16/06 ,  H05K1/14

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G06K7/0047 ,  G11C5/04 ,  H05K1/141 ,  H05K7/1431 ,  G06F2003/0694 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H05K3/3421

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

公开(公告)号：US5635760A

公开(公告)日：1997-06-03

申请号：US697604

申请日：1996-08-27

Applicant: Toru Ishikawa

Inventor： Toru Ishikawa

IPC: H01L23/50 ,  H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/28

CPC classification number: H01L23/3107 ,  H01L23/49555 ,  H01L25/105 ,  H05K1/181 ,  H05K3/303 ,  H01L2224/48247 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H05K2201/09954 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10696 ,  H05K3/3421 ,  Y02P70/611 ,  Y02P70/613

Abstract: A semiconductor device of the present invention includes a plurality of lead terminals extending from only one side surface of a package main body having major surfaces and side surfaces, the lead terminal extending parallel to the major surface by a predetermined size and being substantially perpendicularly bent to project from the major surface by a predetermined size in a vertical mount type semiconductor device, or being substantially perpendicularly bent to project from the major surface by a predetermined size and bent again at a distal end portion in parallel to the major surface in a horizontal mount type semiconductor device, and a supporting means projecting from the package main body by substantially the same size as the projecting size of the lead terminals. A method of manufacturing the semiconductor device of the present invention includes the steps of lead frame formation, chip mounting and bonding, mold sealing, and lead terminal formation.

Abstract translation: 本发明的半导体器件包括从仅具有主表面和侧表面的封装主体的仅一个侧表面延伸的多个引线端子，引线端子平行于主表面延伸预定尺寸并基本上垂直弯曲成 在垂直安装型半导体器件中从主表面突出预定尺寸，或者基本上垂直弯曲以从主表面突出预定尺寸，并且在水平安装件中平行于主表面的远端部分再次弯曲 以及从封装主体以与引线端子的突出尺寸大致相同的尺寸突出的支撑装置。 本发明的半导体器件的制造方法包括引线框架形成，芯片安装和接合，模具密封和引线端子形成的步骤。

公开(公告)号：US4818823A

公开(公告)日：1989-04-04

申请号：US70343

申请日：1987-07-06

Applicant: Robert F. Bradley

Inventor： Robert F. Bradley

IPC: H05K1/18 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/284 ,  H05K3/305 ,  H05K3/321 ,  H05K1/181 ,  H05K2201/0373 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10628 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/10795 ,  H05K2201/10984 ,  H05K2203/0191 ,  H05K2203/1311 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mounting method which utilizes an adhesive component to mount the electrical components to a printed circuit board instead of solder and which includes the use, between the contacting surfaces, of a flowable, corrosion-resistant material which bridges contact imperfections and penetrates surface films. The method may also be implemented to connect two electrical conductors.

Abstract translation: 一种表面安装方法，其利用粘合剂部件将电气部件安装到印刷电路板而不是焊料，并且包括在接触表面之间使用桥接接触缺陷并渗透表面膜的可流动的耐腐蚀材料。 还可以实现该方法来连接两个电导体。

公开(公告)号：US4567543A

公开(公告)日：1986-01-28

申请号：US466466

申请日：1983-02-15

Applicant: Jay J. Miniet

Inventor： Jay J. Miniet

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/38 ,  H05K1/00

CPC classification number: H05K1/189 ,  H05K3/3415 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/096 ,  H05K2201/1034 ,  H05K2201/10462 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/1311 ,  H05K2203/1572 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/284 ,  H05K3/305 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/386 ,  Y02P70/611 ,  Y02P70/613

Abstract: A double-sided flexible electronic circuit module is provided having a flexible printed circuit board. The flexible circuit board has a plurality of conductive paths on each surface and a plurality of conductively plated-through apertures being connected to the conductive paths. One side of the flexible circuit board is adapted to carry components with leads; the other side of the flexible circuit board is adapted to receive components without leads. A carrier member, larger than the flexible circuit board and of a size and shape sufficient to accommodate the placement of at least one flexible circuit board, is also provided. The carrier member has a plurality of apertures which are in alignment with the apertures of the flexible circuit board, and a plurality of elongated slots in predetermined positions which extend the entire width of the flexible circuit board which is temporarily affixed onto the carrier member. All of the components are soldered to the flexible circuit board, the carrier member acting as a support member to the components having leads.

Abstract translation: 提供具有柔性印刷电路板的双面柔性电子电路模块。 柔性电路板在每个表面上具有多个导电路径，并且多个电导通孔与导电路径连接。 柔性电路板的一侧适用于携带带导线的部件; 柔性电路板的另一侧适于接收不带引线的部件。 还提供了大于柔性电路板的载体构件以及足以容纳至少一个柔性电路板的放置的尺寸和形状。 载体构件具有与柔性电路板的孔对准的多个孔，以及在预定位置上的多个细长槽，其延伸柔性电路板的整个宽度，该柔性电路板临时固定在承载构件上。 所有的部件被焊接到柔性电路板上，承载部件用作具有引线的部件的支撑部件。

公开(公告)号：US4467401A

公开(公告)日：1984-08-21

申请号：US513000

申请日：1983-07-12

Applicant: Rainer Siebert ,  Erich Bock

Inventor： Rainer Siebert ,  Erich Bock

IPC: H01G9/08 ,  H05K3/30 ,  H05K7/12 ,  H01G1/14

CPC classification number: H05K3/305 ,  H01G9/08 ,  H01L2924/0002 ,  H05K2201/10462 ,  H05K2203/049 ,  Y02P70/613

Abstract: An arrangement for the mechanical fastening and electrical connection of a pellet, particularly a tantalum pellet, covered with a surface-adherent electrode, to a support. The electrode cannot be subjected to inertial forces of the pellet. An intermediate sheathing is positioned between the electrode and the support. The sheathing non-adhesively encompasses the pellet in a form-fitting manner. The intermediate sheathing is glued to the support. The electrode is electrically connected with the support through a flexible conductor element.

Abstract translation: 用于将表面粘附电极覆盖的颗粒，特别是钽颗粒机械紧固和电连接到支撑件的装置。 电极不能受到颗粒的惯性力。 中间护套位于电极和支架之间。 护套以形式配合的方式非粘合地包住沉淀物。 中间护套粘合到支撑件上。 电极通过柔性导体元件与支撑件电连接。

公开(公告)号：US3435449A

公开(公告)日：1969-03-25

申请号：US3435449D

申请日：1967-01-16

Applicant: CHARLES S SLOAN

Inventor： SLOAN CHARLES S

IPC: F21S8/00 ,  H05K3/30 ,  G09F7/06 ,  G09F9/30

CPC classification number: H05K3/306 ,  F21W2111/00 ,  H05K2201/09781 ,  H05K2201/10113 ,  H05K2201/10462

公开(公告)号：US11903131B2

公开(公告)日：2024-02-13

申请号：US17643100

申请日：2021-12-07

Applicant: WÜRTH ELEKTRONIK EISOS GMBH & CO. KG

Inventor： Alexander Treml ,  Julia Sanwald ,  Stefan Klingler

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K2201/1028 ,  H05K2201/10037 ,  H05K2201/10462 ,  H05K2201/10643

Abstract: The invention relates to a holder for a button cell, wherein the holder is intended to be fastened on a printed circuit board, wherein the holder has at least two first latching arms which protrude from the printed circuit board when the holder is in the mounted state, wherein the button cell is received between the first latching arms when the button cell is in the mounted state, wherein the first latching arms, at one end, are each connected to a main body which has a base area which is connected to the printed circuit board when the holder is in the mounted state, wherein the first latching arms each have at least one first latching lug in order to hold the button cell on the printed circuit board, and wherein the first latching lugs are arranged at a first distance from the base area of the main body.