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    Surface mount assembly of devices using AdCon interconnections
    73.
    发明授权
    Surface mount assembly of devices using AdCon interconnections 失效
    使用AdCon互连的设备的表面安装组件

    公开(公告)号：US5365656A

    公开(公告)日：1994-11-22

    申请号：US61753

    申请日：1993-05-14

    申请人： Donald W. Dahringer ,  Alan M. Lyons

    发明人： Donald W. Dahringer ,  Alan M. Lyons

    IPC分类号： H05K3/32 ,  H01R4/04 ,  H05K3/30 ,  H05K13/04

    CPC分类号： H05K3/303 ,  H01R4/04 ,  H05K13/0469 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2203/0173 ,  H05K2203/0278 ,  H05K2203/085 ,  H05K3/321 ,  H05K3/323 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49146

    摘要： A process of batch assembly of sundry leaded or padded devices, encapsulated and non-encapsulated, onto a printed wiring board (PWB), which exhibit significant improvements in both manufacturability and reliability. A pressure frame assembly apparatus permits an application of uniformly distributed pressures to a variety of leaded packages and padded semiconductor chips during cure of conductive adhesives (AdCons), and leads to the reduction of variations in initial interconnection resistance, and thereby to the enhancement of the reliability of AdCon interconnections. The pressures are applied to the devices by an external application of a fluid under pressure to a flexible, resiliently stretchable membrane which conformably envelops outlines of the devices and adjacent areas of the PWB. Application of vacuum suction to within the cavity, formed by the pressure frame and the membrane, prior to the external application of the fluid pressure to the membrane, further improving the reliability of surface mounted assembly of packages on the interconnection board. The external application of pressure enhances thermal conductivity needed for curing the AdCon, increases the range of processing parameters usable for this technique and reduces assembly times. Assembly yields approaching 100% were observed for a variety of surface mounted packages indicating that the system will be highly reliable.

    摘要翻译： 将印刷线路板（PWB）的封装和非封装的各种含铅或填充装置批量组装的过程，其显示出可制造性和可靠性的显着改进。 压力框架组装装置允许在导电粘合剂（AdCons）固化期间向各种引线封装和填充半导体芯片施加均匀分布的压力，并且导致初始互连电阻的变化的减小，从而增强 AdCon互连的可靠性。 通过将压力下的流体外部施加到柔性的可弹性拉伸膜上来施加压力，该膜顺应地包围装置的轮廓和PWB的相邻区域。 在将流体压力外部施加到膜之前，由压力框架和膜形成的空腔内的真空吸力的应用进一步提高了互连板上的表面安装组件的可靠性。 压力的外部应用提高了AdCon固化所需的热导率，增加了可用于该技术的加工参数的范围，并减少了装配时间。 对于各种表面贴装的封装观察到组装产量接近100％，表明系统将是高度可靠的。

    Conductive connecting method
    77.
    发明授权
    Conductive connecting method 失效
    导电连接方法

    公开(公告)号：US5123986A

    公开(公告)日：1992-06-23

    申请号：US602715

    申请日：1990-10-24

    申请人： Kazuhiro Sugiyama ,  Yoshinori Atsumi

    发明人： Kazuhiro Sugiyama ,  Yoshinori Atsumi

    IPC分类号： G02F1/13 ,  G02F1/1339 ,  G02F1/1345 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  B44C1/165

    CPC分类号： H01R4/04 ,  G02F1/1345 ,  H05K3/323 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681 ,  H05K3/361

    摘要： A conductive connecting method for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.

    摘要翻译： 公开了一种用于电连接具有以小间距布置的多个连接端子的第一和第二电子部件的导电连接方法。 在第一和第二电子部件的多个连接端子之间插入有导电性接合剂。 通过在绝缘粘合剂中混合多个细连接颗粒来制备导电粘合剂。 每个细连接颗粒被设计成使得在其表面上形成有镀层的细导电颗粒或细绝缘颗粒被由热压接合断裂的材料构成的绝缘层覆盖。 当导电粘合剂在第一和第二电子部件的连接端子之间经受热压接时，由各个精细连接端子推动的细连接颗粒的部分被破坏。 然而，平面方向上的细连接颗粒的绝缘层不会断裂并保持原样。 在该导电连接结构中，即使细连接粒子的比例增加，相邻的细连接粒子彼此接触，也可以在平面方向上保持绝缘性，而仅在厚度方向上获得传导 。

    Method of manufacturing an electrical circuit system and electrical circuit system
    78.
    发明授权
    Method of manufacturing an electrical circuit system and electrical circuit system 失效
    制造电路系统和电路系统的方法

    公开(公告)号：US5042971A

    公开(公告)日：1991-08-27

    申请号：US510465

    申请日：1990-04-16

    申请人： Stephen D. Ambrose

    发明人： Stephen D. Ambrose

    IPC分类号： H01R4/04 ,  H01R12/62 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32

    CPC分类号： H01R4/04 ,  H01R12/62 ,  H05K1/189 ,  H05K3/326 ,  H05K1/0286 ,  H05K1/0289 ,  H05K1/118 ,  H05K1/145 ,  H05K1/182 ,  H05K2201/052 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09172 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10689 ,  Y10S439/912

    摘要： A method of manufacturing an electrical circuit system comprising electrical conductors on a flexible film and an article of manufacture made thereby, which may be used in place of printed circuit boards and which conductors form connector means for readily connecting to the leads of one or more sides of an electronic package. The electrical conductors also form a means for selectably connecting each electrical conductor from each pin to a selected input or output conductor, comprising a first and second plurality of conductors, such as a matrix having a column of conductors and a row of conductors. The electrical circuit system may be manufactured by numerous methods such as applying a conductive ink or paint by screening, photolithography or drawn by a digital plotter on a plastic film, such as Mylar. The film may include electrical edge connection means to provide input or output to or from said conductors. All or most of the system is integral, thus forming the conductors and the in-line connector portion of the conductors in continuum, using the same conductive material, such as ink, or paint and the same dielectric material, such as ink, or paint. A dielectric covers the appropriate portion of the system.

    摘要翻译： 一种制造电路系统的方法，该电路系统包括柔性膜上的电导体和由此制成的制品，其可用于代替印刷电路板，并且哪些导体形成用于容易地连接到一个或多个侧面的引线的连接器装置 的电子包装。 电导体还形成用于将每个引脚的每个电导体可选地连接到选定的输入或输出导体的装置，该导体包括第一和第二多个导体，例如具有导体列和一排导体的矩阵。 电路系统可以通过许多方法来制造，例如通过筛选，光刻或通过数字绘图仪在诸如Mylar的塑料膜上涂抹导电油墨或涂料。 该胶片可以包括电边缘连接装置，以向所述导体提供输入或输出。 所有或大部分系统是一体的，因此使用相同的导电材料（例如墨水或涂料）和相同的电介质材料（例如油墨或油漆）在连续体中形成导体的导体和直列连接器部分 。 电介质覆盖系统的适当部分。