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382 条记录 (耗时 0.02 秒)

    Light Emitting Device and Method of Fabricating Light Emitting Device
    81.
    发明申请
    Light Emitting Device and Method of Fabricating Light Emitting Device 有权
    发光装置及其制造方法

    公开(公告)号：US20080164488A1

    公开(公告)日：2008-07-10

    申请号：US11883078

    申请日：2006-01-26

    申请人： Hitoshi Ikeda ,  Masayoshi Obara

    发明人： Hitoshi Ikeda ,  Masayoshi Obara

    IPC分类号： H01L33/00 ,  B23K31/02

    CPC分类号： H01L33/40 ,  B23K1/0016 ,  B23K35/001 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/40 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L33/0079 ,  H01L33/30 ,  H01L33/382 ,  H01L33/62 ,  H01L2224/29144 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48463 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2933/0016 ,  H01L2924/0105 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

    摘要： A second electrode (16) formed on a second main surface of a compound semiconductor layer (100) of a light emitting element (1) is arranged in contact with the second main surface of the compound semiconductor layer (100) and has a junction alloying layer (31) for reducing the resistance due to the junction with said compound semiconductor layer (100) and a solder layer (34) for connecting said junction metal layer to an electoconductive support (52). In the solder layer (34), there are formed an Sn-based solder layer (34s) which is arranged on the junction alloying layer (31) side and comprises an Sn-based metal containing Sn as a main component and having a melting point lower than that of the junction alloying layer (31) and an Au—Sn based solder layer (34m) which is arranged on the side opposite to the junction alloying layer (31) with respect to said Sn-based solder layer (34s) and in contact therewith and contains 30 to 90 mass % of Au and 10 to 70 mass % of Sn and has a total content of Au and Sn of 80 mass % or more and has a melting point higher than that of the Sn-based solder layer (34s). The above structure of an element is excellent in the reliability of the junction between an Au—Sn based solder layer and a junction alloying layer, which results in making the Au—Sn based solder layer less prone to exfoliation, in the case of a light-emitting element which adopts the mounting using an Au—Sn based solder layer.

    摘要翻译： 形成在发光元件（1）的化合物半导体层（100）的第二主表面上的第二电极（16）与化合物半导体层（100）的第二主表面接触并且具有接合合金化 层（31），用于降低由于与所述化合物半导体层（100）的结的电阻和用于将所述连接金属层连接到电导体支撑件（52）的焊料层（34）。 在焊料层（34）中，形成配置在接合合金层（31）侧的Sn系焊料层（34s），其包含以锡为主成分的Sn系金属，其熔融 相对于所述Sn基焊料层（34）配置在与所述接合合层（31）相反的一侧的Au-Sn系焊料层（34μm） s），与其接触，含有30〜90质量％的Au和10〜70质量％的Sn，Au和Sn的总含量为80质量％以上，熔点高于Sn- （34秒）。 元素的上述结构在Au-Sn基焊料层和接合合金层之间的接合的可靠性优异，这导致Au-Sn基焊料层在光的情况下更不易剥离 采用基于Au-Sn基焊料层的安装元件。

    Hermetic MEMS package and method of manufacture
    82.
    发明授权
    Hermetic MEMS package and method of manufacture 失效
    密封MEMS封装及其制造方法

    公开(公告)号：US07358106B2

    公开(公告)日：2008-04-15

    申请号：US11071038

    申请日：2005-03-03

    申请人： Curtis Nathan Potter

    发明人： Curtis Nathan Potter

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00269 ,  B81C2203/0109 ,  H01L21/50 ,  H01L23/045 ,  H01L23/10 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/16315

    摘要： A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral gasket 425 on a package base. A material extension of the package cover 450 is simultaneously folded under the package base to supply force maintenance for permanent hermaticity. The swage hermetic sealing of single or an array of covers to an extended wafer or substrate is accomplished by a cutting and flowing edge 560. Permanent force maintenance is achieved through a re-entrant cavity 565 and annular ring 535 on the wafer or substrate.

    摘要翻译： 使用高强度的MEMS或微型器件或纳米器件封装的密封密封。 切割和流动边缘430形成在封装盖上，该封盖被压入封装基座上的配合的一体式衬垫425中。 封装盖450的材料延伸部分同时折叠在封装基座下面，以提供维持永久性的弹性。 通过切割和流动的边缘560来实现单个或一组盖子到延伸的晶片或基底的塑模密封。 通过晶片或衬底上的入口腔565和环形环535实现永久性力维持。

    HERMETICALLY SEALED CERAMIC PACKAGE
    84.
    发明申请
    HERMETICALLY SEALED CERAMIC PACKAGE 失效
    密封陶瓷包装

    公开(公告)号：US20070190851A1

    公开(公告)日：2007-08-16

    申请号：US11354434

    申请日：2006-02-15

    申请人： Dino Nicoletta ,  Robert Satriano

    发明人： Dino Nicoletta ,  Robert Satriano

    IPC分类号： H01R13/52

    CPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0603 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/05599

    摘要： A hermetically sealed package embodying the invention includes a base member having top and bottom surfaces. An electronic device having multiple electrodes is securely mounted on the top surface of the base member. The electrodes of the electronic device are made accessible to external circuits via wire connection to conducting leads disposed through pre-formed holes extending vertically from the top surface to the bottom surface of the base member. The conductive leads then extend horizontally along preformed grooves formed along the bottom surface of the base member. The holes with the leads passing though them are hermetically sealed. A portion of selected conductive leads extending above the top surface are selectively bonded to selected electrodes of the electronic device. A ceramic cap is mounted over and around the electronic device and the conductive leads,and encompasses them. The cap has a bottom rim which fits into a preformed trench running along the outer periphery of the base member. The rim and trench are pre-metallized to enable the formation of a hermetic seal.

    摘要翻译： 实施本发明的密封包装包括具有顶表面和底表面的基底构件。 具有多个电极的电子装置被牢固地安装在基底部件的上表面上。 电子设备的电极可通过导线连接到外部电路，以便通过从底部构件的顶表面垂直延伸到预先形成的孔而布置的导电引线。 然后，导电引线沿着沿着基底构件的底表面形成的预制凹槽水平延伸。 带有通过它们的引线的孔被气密密封。 在顶表面上方延伸的选定导电引线的一部分选择性地结合到电子器件的选定电极。 陶瓷盖安装在电子设备和导电引线上方并围绕它们。 盖具有底部边缘，该底部边缘适合沿着基部构件的外周边延伸的预成型沟槽。 边缘和沟槽被预先金属化以形成气密密封。

    Control unit and method for producing the same
    86.
    发明申请
    Control unit and method for producing the same 有权
    控制单元及其制造方法

    公开(公告)号：US20060023431A1

    公开(公告)日：2006-02-02

    申请号：US10528973

    申请日：2004-07-13

    申请人： Gerhard Wetzel

    发明人： Gerhard Wetzel

    IPC分类号： H05K1/14

    CPC分类号： H05K5/0082 ,  B60R16/0239 ,  H01L21/50 ,  H01L23/04 ,  H01L23/047 ,  H01L23/10 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/4823 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K5/061 ,  H05K5/069 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： The present invention relates to a control unit (1), for automotive applications in particular, with: a frame (8) that includes a recess (9) across which electrical conductive tracks (10) extend to supply electrical power; a base plate (11) that is inserted in the frame (8); a circuit carrier (12) on which electronic components are mounted and which is installed on the base plate (11); an electrical connection (14) for connecting the circuit carrier (12) with the conductive tracks (10); and a cover (4) for hermetically sealing the control unit (1), the cover including a shaped section that is insertable in the associated recess (9) in the frame (8); whereby a sealing gel (16) is provided in recess (9) with a viscosity such that the sealing gel (16) can flow around the electrical conductive tracks (10) that extend across the recess (9). The present invention further relates to a manufacturing method for manufacturing a control unit (1) of this type.

    摘要翻译： 本发明涉及一种用于汽车应用的控制单元（1），具体包括：框架（8），其包括凹部（9），导电轨道（10）延伸以提供电力; 插入框架（8）中的基板（11）; 其上安装有电子部件并安装在基板（11）上的电路载体（12）; 用于将电路载体（12）与导电轨道（10）连接的电连接（14）; 以及用于密封所述控制单元（1）的盖（4），所述盖包括可插入所述框架（8）中的相关联的凹部（9）中的成形部分; 由此在凹部（9）中提供密封凝胶（16），粘度使得密封凝胶（16）能够围绕延伸穿过凹部（9）的导电轨道（10）流动。 本发明还涉及这种类型的控制单元（1）的制造方法。