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336 条记录 (耗时 0.023 秒)

    Modular Interconnection System
    81.
    发明申请
    Modular Interconnection System 失效
    模块化互连系统

    公开(公告)号：US20110223776A1

    公开(公告)日：2011-09-15

    申请号：US12724388

    申请日：2010-03-15

    申请人： Robert R. Ferber, JR.

    发明人： Robert R. Ferber, JR.

    IPC分类号： H01R11/30 ,  H01R12/00

    CPC分类号： H01R12/00 ,  H01L31/0504 ,  H01M2/202 ,  H01M2/348 ,  H01M8/0202 ,  H01M10/4235 ,  H01M2200/10 ,  H01R11/30 ,  H05K1/189 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/083 ,  H05K2201/10037 ,  H05K2201/10143 ,  Y02E10/50

    摘要： A modular interconnection system in the form of a releasable modular interconnect is provided. The releasable modular interconnect may include a substrate with a plurality of releasable contact regions, where each releasable contact region may be positioned to overlay a respective terminal of a power cell. The releasable modular interconnect may also include at least one conductive interconnect member affixed to the substrate, where the conductive interconnect member includes at least a one conductive releasable contact disposed within a releasable contact region of the substrate. The conductive releasable contact may be positioned to form a releasable electrical connection with a terminal of a power cell when a force is applied to the first releasable contact region in a direction toward the terminal of the power cell. Additional and related methods and apparatuses are also provided.

    摘要翻译： 提供了可释放模块化互连形式的模块化互连系统。 可释放的模块化互连可以包括具有多个可释放接触区域的基板，其中每个可释放的接触区域可以被定位成覆盖功率单元的相应端子。 可释放的模块化互连还可以包括固定到衬底的至少一个导电互连构件，其中导电互连构件包括设置在衬底的可释放接触区域内的至少一个导电可释放触点。 当向朝向动力单元的端子的方向向第一可释放接触区域施加力时，导电可释放接触件可被定位成与功率单元的端子形成可释放的电连接。 还提供了附加的和相关的方法和装置。

    System and method for proportional cooling with liquid metal
    82.
    发明授权
    System and method for proportional cooling with liquid metal 有权
    用液态金属比例冷却的系统和方法

    公开(公告)号：US08017872B2

    公开(公告)日：2011-09-13

    申请号：US12284670

    申请日：2008-09-24

    申请人： David W. Cripe ,  Bryan S. McCoy ,  Nathan P. Lower ,  Ross K. Wilcoxon

    发明人： David W. Cripe ,  Bryan S. McCoy ,  Nathan P. Lower ,  Ross K. Wilcoxon

    IPC分类号： H05K1/00

    CPC分类号： H05K7/20254 ,  H01L2924/0002 ,  H01L2924/01019 ,  H05K1/0272 ,  H05K2201/083 ,  H05K2203/128 ,  H01L2924/00

    摘要： A circuit board may include a pump and a channel. The channel may include a liquid metal and a coating. The liquid metal may be pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal may carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly. The pump may be driven by electric current that is utilized by one or more electronic components on the circuit board.

    摘要翻译： 电路板可以包括泵和通道。 通道可以包括液态金属和涂层。 液体金属可以通过泵泵送通过通道，并且涂层减少了液态金属与通道的至少部分之间的扩散和化学反应。 液态金属可以承载热能以在衬底上的两个或更多个位置之间用作热传递机构。 衬底可以包括电互连以允许将电气部件填充到衬底上以形成电子组件。 泵可以由电路板上的一个或多个电子部件使用的电流驱动。

    Solderable elastic electric contact terminal
    85.
    发明授权
    Solderable elastic electric contact terminal 有权
    可焊接弹性电接触端子

    公开(公告)号：US07931475B2

    公开(公告)日：2011-04-26

    申请号：US12393948

    申请日：2009-02-26

    申请人： Sun-Ki Kim ,  Sung-Ho Cho ,  Han-Jin Cheon ,  Hwan-min Yeo

    发明人： Sun-Ki Kim ,  Sung-Ho Cho ,  Han-Jin Cheon ,  Hwan-min Yeo

    IPC分类号： H01R12/00

    CPC分类号： H05K3/4015 ,  H01R12/57 ,  H01R12/714 ,  H01R13/24 ,  H05K3/222 ,  H05K3/325 ,  H05K3/341 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/083

    摘要： Provided is a solderable elastic electric contact terminal. The solderable elastic electric contact terminal includes a tube-shaped insulating elastic core, an insulating non-foam rubber coating layer adhered to the insulating elastic core to surround the insulating elastic core, and a heat-resistant polymer film having one surface adhered to the insulating non-foam rubber coating layer to surround the insulating non-foam rubber coating layer, and another surface integrally provided with a metal layer.

    摘要翻译： 提供了可焊接的弹性电接触端子。 可焊接弹性电接触端子包括管状绝缘弹性芯，粘附到绝缘弹性芯以包围绝缘弹性芯的绝缘非泡沫橡胶涂层，以及耐热聚合物膜，其一个表面粘附到绝缘 非泡沫橡胶涂层包围绝缘非泡沫橡胶涂层，以及一体地设置有金属层的另一表面。

    METHODS OF EMBEDDING THIN-FILM CAPACITORS INTO SEMICONDUCTOR PACKAGES USING TEMPORARY CARRIER LAYERS
    88.
    发明申请
    METHODS OF EMBEDDING THIN-FILM CAPACITORS INTO SEMICONDUCTOR PACKAGES USING TEMPORARY CARRIER LAYERS 有权
    使用临时载波层将薄膜电容器嵌入半导体封装的方法

    公开(公告)号：US20100270644A1

    公开(公告)日：2010-10-28

    申请号：US12763412

    申请日：2010-04-20

    申请人： Lynne E. Dellis ,  Karl Hartmann Dietz ,  David Ross McGregor

    发明人： Lynne E. Dellis ,  Karl Hartmann Dietz ,  David Ross McGregor

    IPC分类号： H01L27/08 ,  H01L21/50

    CPC分类号： H05K1/162 ,  H01L2224/16225 ,  H05K3/025 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/083 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09718 ,  H05K2201/10674 ,  H05K2203/104

    摘要： Disclosed are methods of making a semiconductor package comprising at least one thin-film capacitor embedded into at least one build-up layer of said semiconductor package. A thin-film capacitor is provided wherein the thin-film capacitor has a first electrode and a second electrode separated by a dielectric. A temporary carrier layer is applied to the first electrode and the second electrode is patterned. A PWB core and a build-up material are provided, and the build-up material is placed between the PWB core and the patterned second electrode of said thin-film capacitor. The patterned electrode side of the thin-film capacitor is laminated to the PWB core by way of the build-up material, the temporary carrier layer is removed, and the first electrode is patterned.

    摘要翻译： 公开了制造半导体封装的方法，该半导体封装包括嵌入到所述半导体封装的至少一个堆积层中的至少一个薄膜电容器。 提供了一种薄膜电容器，其中薄膜电容器具有由电介质隔开的第一电极和第二电极。 临时载体层被施加到第一电极并且第二电极被图案化。 提供PWB芯和堆积材料，并且积聚材料被放置在PWB芯和所述薄膜电容器的图案化的第二电极之间。 薄膜电容器的图案化电极侧通过积聚材料层叠到PWB芯上，去除临时载体层，并对第一电极进行图案化。