公开(公告)号：US20070045847A1

公开(公告)日：2007-03-01

申请号：US11512181

申请日：2006-08-30

Applicant: Koji Arai ,  Tomofumi Kikuchi ,  Atsushi Maruyama ,  Hideyuki Wakabayashi

Inventor： Koji Arai ,  Tomofumi Kikuchi ,  Atsushi Maruyama ,  Hideyuki Wakabayashi

IPC: H01L23/48

CPC classification number: H05K3/243 ,  H01L2224/13 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0191 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2203/0571 ,  H05K2203/1476

Abstract: The invention is characterized in a printed wiring board having a wiring pattern including a pad for mounting a solder ball as a connection terminal, wherein the pad is constituted by laminating a conductive layer constituting the wiring pattern, a lower layer plating layer, and an upper layer plating layer in this order; an immediate vicinity region surrounding the pad is constituted by laminating the conductive layer, at least the lower layer plating layer in the lower layer plating layer and the higher layer plating layer, and a solder resist layer in the order; a thickness of the upper layer plating layer is a thickness negligible in comparison with respective thicknesses of the lower layer plating layer and the upper layer plating layer; and a height of an upper face of the pad does not exceed a height of an upper face of the immediate vicinity region.

Abstract translation: 本发明的特征在于一种印刷线路板，其具有包括用于安装焊球作为连接端子的焊盘的布线图案，其中该焊盘通过层叠构成布线图案的导电层，下层镀层和上层 层电镀层; 围绕焊盘的紧邻区域通过层叠导电层，至少下层镀层中的下层镀层和较高层镀层，以及阻焊层的顺序层叠; 上层镀层的厚度与下层镀层和上层镀层的厚度相比可以忽略不计， 并且垫的上表面的高度不超过紧邻区域的上表面的高度。

公开(公告)号：US07180005B2

公开(公告)日：2007-02-20

申请号：US10514657

申请日：2003-05-19

Applicant: Wataru Urano

Inventor： Wataru Urano

IPC: H05K1/03

CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/81191 ,  H05K3/3436 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10674

Abstract: The printed wiring board includes a substrate, an electrically conductive pattern formed on the substrate, and an electrical insulator covering the substrate and the electrically conductive pattern therewith, wherein a region of the electrically conductive pattern exposed through an opening formed throughout the electrical insulator is used as the pad, and a region except the pad is used as a circuit wire. The opening has opposite ends extending in a first direction beyond the electrically conductive pattern such that opposite ends of the pad in the first direction are defined by the electrically conductive pattern, and further has opposite ends extending in a second direction perpendicular to the first direction to intersect with the electrically conductive pattern such that the pad is defined in shape in the second direction by the opposite ends of the opening extending in the second direction. The pad is smaller in length in the first direction than the circuit wire.

Abstract translation: 印刷布线板包括基板，形成在基板上的导电图案，以及覆盖基板和导电图案的电绝缘体，其中使用通过整个电绝缘体形成的开口露出的导电图案的区域被使用 作为焊盘，除了焊盘之外的区域用作电路线。 该开口具有相对端部，该第一方向延伸超过该导电图案，使得该第一方向上的该焊盘的相对端部由该导电图案限定，并且还具有沿垂直于该第一方向的第二方向延伸的相对端 与导电图案相交，使得垫沿着在第二方向上延伸的开口的相对端在第二方向上限定形状。 焊盘在第一方向的长度小于电路线。

公开(公告)号：US07173342B2

公开(公告)日：2007-02-06

申请号：US10322308

申请日：2002-12-17

Applicant: Cheng Siew Tay ,  Swee Kian Cheng ,  Eng Huat Goh

Inventor： Cheng Siew Tay ,  Swee Kian Cheng ,  Eng Huat Goh

IPC: H01L23/485

CPC classification number: H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/3452 ,  H05K2201/09418 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A method and apparatus is provided that pertains to resisting crack initiation and propagation in electrical interconnections between components and substrates in ball grid array microelectronic packages. A hybrid of dielectric defined and non-dielectric defined electrical interconnects reduces the potential for electrical interconnection failure without having to control the dielectric defined interconnect ratio of substrates. In addition selective orientation of the dielectric defined edge portion of the electrical interconnect away from the point where cracks initiate resists crack propagation and component failure.

Abstract translation: 提供了一种方法和装置，其涉及抵抗在球栅阵列微电子封装中的部件和基板之间的电互连中的裂纹起始和传播。 电介质限定和非介质限定的电互连的混合物减少了电互连故障的可能性，而不必控制介质限定的衬底互连比。 此外，电互连的电介质限定边缘部分远离开始点的选择性取向抵抗裂纹扩展和部件故障。

公开(公告)号：US07064435B2

公开(公告)日：2006-06-20

申请号：US10877733

申请日：2004-06-25

Applicant: Myung-Kee Chung ,  Min-Keun Kwak ,  Kil-Soo Kim

Inventor： Myung-Kee Chung ,  Min-Keun Kwak ,  Kil-Soo Kim

IPC: H01L23/48

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L2224/81385 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: A semiconductor package has ball lands each configured to have a composite structure of SMD type and NSMD type. One peripheral portion of the ball land is covered with a mask layer, thus forming the SMD type, whereas the other peripheral portion is exposed through an opening area of the mask layer, thus forming the NSMD type. In one embodiment, the first peripheral portion is disposed to face a central point of a ball-mounting surface of a substrate, and the second peripheral portion is disposed to face the opposite direction to the central point. The composite structure of the ball lands provides more stable and enhanced connections between connection balls, such as solder balls, and the ball-mounting surface.

Abstract translation: 半导体封装具有各自被配置为具有SMD型和NSMD型的复合结构的球形焊盘。 球面的一个周边部分被掩模层覆盖，从而形成SMD型，而另一个周边部分通过掩模层的开口区域露出，从而形成NSMD型。 在一个实施例中，第一周边部分设置成面对基板的球安装表面的中心点，并且第二周边部分设置成面向与中心点相反的方向。 球面的复合结构在连接球（例如焊球）和球安装表面之间提供更稳定和增强的连接。

公开(公告)号：US20060067062A1

公开(公告)日：2006-03-30

申请号：US11226305

申请日：2005-09-15

Applicant: Toshio Ishimoto ,  Naofumi Okayama ,  Toshihiko Sasaki

Inventor： Toshio Ishimoto ,  Naofumi Okayama ,  Toshihiko Sasaki

IPC: H05K7/04 ,  H05K7/06

CPC classification number: H05K9/0039 ,  H05K1/0215 ,  H05K3/325 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/099 ,  H05K2201/10409

Abstract: To provide a grounding structure for connecting and fixing a printed circuit board and a conductive frame to a conductive chassis of an electronic apparatus, the height of solder applied to the grounding land is made uniform, thereby ensuring electrical connection between the printed circuit board and the conductive chassis. A copper-foil coating 54 formed on a printed circuit board 50 is divided by a substantially-lattice-shaped resist 55 to form a grounding land 56 including a plurality of obliquely elongated land elements 56c in an area close to the edge of an opening 51 and a plurality of rhombic land elements 56a in the remaining area, and the grounding land 56 is brought into contact with and screw-clamped to a conductive chassis 60 using a locking leg 41.

Abstract translation: 为了提供一种用于将印刷电路板和导电框架连接和固定到电子设备的导电底盘的接地结构，施加到接地台面的焊料的高度被均匀，从而确保印刷电路板和 导电底盘。 形成在印刷电路板50上的铜箔涂层54由基本上格子状的抗蚀剂55分开，以形成接地片56，该接地片56包括在接近开口边缘的区域中的多个倾斜细长的接地元件56c 51和其余区域中的多个菱形陆片元件56a，并且接地平台56使用锁定腿41与导电底盘60接触并螺纹夹紧。

公开(公告)号：US07019393B2

公开(公告)日：2006-03-28

申请号：US10920659

申请日：2004-08-18

Applicant: Shigetaka Toriyama

Inventor： Shigetaka Toriyama

IPC: H01L23/48 ,  G02F1/1345

CPC classification number: H01L24/83 ,  G02F1/13452 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0106 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/1189

Abstract: On a glass substrate of a liquid crystal display device, electrode parts to which metallic electrodes (bumps) of an IC circuit are connected from an upper part are formed. The electrode parts are formed by opening an interlayer dielectric film at parts corresponding to metal wiring and forming land shaped electrode pads in the opening parts. In this invention, the planar forms of the electrode pads are smaller than the opening parts of the interlayer dielectric film. Thus, the planarization of the peripheral surfaces around the electrode parts is improved. Accordingly, integrated circuit devices (IC) or semiconductor chips can be connected with high reliability.

Abstract translation: 在液晶显示装置的玻璃基板上，形成有IC电路的金属电极（凸块）从上部连接的电极部。 通过在对应于金属布线的部分打开层间电介质膜并在开口部分形成焊盘形电极焊盘来形成电极部分。 在本发明中，电极焊盘的平面形状小于层间绝缘膜的开口部分。 因此，提高了电极部周围的周边表面的平坦化。 因此，可以以高可靠性连接集成电路器件（IC）或半导体芯片。

公开(公告)号：US07005750B2

公开(公告)日：2006-02-28

申请号：US10902003

申请日：2004-07-30

Applicant: Sheng-Tsung Liu

Inventor： Sheng-Tsung Liu

IPC: H01L23/48

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2924/00

Abstract: A substrate with reinforced contact pad structure includes a metal wiring layer and a solder mask formed over its surface. The metal wiring layer includes at least a NSMD (Non-Solder Mask Defined) type contact pad, a trace and an extension. The extension connects the contact pad and the trace, and has an upper surface which is covered by the solder mask so as to enhance the connecting strength between the trace and the contact pad and to improve the position stability of the NSMD type contact pad on the substrate. In an embodiment, the contact pad is circular for bonding a bump or a solder ball. The first extension is fan-shaped. The extension also has a sidewall exposed out of the solder mask.

Abstract translation: 具有加强接触焊盘结构的基板包括在其表面上形成的金属布线层和焊接掩模。 金属布线层至少包括NSMD（非焊接掩模定义）型接触焊盘，迹线和延伸部。 该延伸部连接接触焊盘和迹线，并且具有被焊接掩模覆盖的上表面，以便增强迹线和接触焊盘之间的连接强度，并且提高NSMD型接触焊盘的位置稳定性 基质。 在一个实施例中，接触垫是圆形的，用于接合凸块或焊球。 第一个扩展是扇形。 该延伸部还具有暴露在焊接掩模之外的侧壁。

公开(公告)号：US06995026B2

公开(公告)日：2006-02-07

申请号：US10775736

申请日：2004-02-10

Applicant: Stephen Moxham ,  William Stephenson

Inventor： Stephen Moxham ,  William Stephenson

IPC: G01R31/26 ,  H01L21/66

CPC classification number: H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/113 ,  H05K1/116 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The apparatus can further include a first connection structure carried by the support member. The first connection structure can have a first bond site configured to receive a flowable conductive material, and can further have at least two first elongated members connected and extending outwardly from the first bond site. Each first elongated member can be configured to receive at least a portion of the flowable conductive material from the first bond site, with none of the first elongated members being electrically coupled to the microelectronic substrate. The assembly can further include a second connection structure that is electrically coupled to the microelectronic substrate and that can include second elongated members extending away from a second bond site. The number of second elongated members can be equal to the number of first elongated members.

Abstract translation: 一种用于支撑微电子衬底的方法和装置。 该装置可以包括微电子衬底和承载微电子衬底的支撑构件。 该装置还可以包括由支撑构件承载的第一连接结构。 第一连接结构可以具有构造成接收可流动的导电材料的第一接合位置，并且还可以具有连接并从第一接合位置向外延伸的至少两个第一细长构件。 每个第一细长构件可以被构造成从第一接合位置接收可流动的导电材料的至少一部分，而第一细长构件没有一个电耦合到微电子衬底。 组件还可以包括电耦合到微电子衬底的第二连接结构，并且可以包括远离第二接合位置延伸的第二细长构件。 第二细长构件的数量可以等于第一细长构件的数量。

公开(公告)号：US20050211750A1

公开(公告)日：2005-09-29

申请号：US10812625

申请日：2004-03-29

Applicant: Tom Pearson ,  Dudi Amir ,  Terrance Dishongh

Inventor： Tom Pearson ,  Dudi Amir ,  Terrance Dishongh

IPC: H01L21/48 ,  H01L23/50 ,  H05K1/02 ,  H05K1/16 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0263 ,  H05K1/162 ,  H05K3/3452 ,  H05K2201/09236 ,  H05K2201/094 ,  H05K2201/099 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00

Abstract: Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating solder balls of power or ground connections close enough to one another so that, upon reflow to the circuit board the solder balls combine, creating a larger solder connection. Signal solder balls, however, remain separated. The power or ground solder balls on a particular bond pad are separated from one another by portions of a removable solder mask that keep the solder balls spherical in shape during solder ball attachment to the electronic package. However, it is removed prior to reflow to the circuit board, thus creating a larger, longer solder connection between the electronic package and circuit board.

Abstract translation: 在电子封装的基板和长度大于宽度的电路板之间产生焊接连接。 焊接连接是通过将功率或接地连接的焊球定位得彼此靠近而形成的，使得当回流到电路板时，焊球组合，产生更大的焊接连接。 然而，信号焊球保持分离。 特定接合焊盘上的电源或接地焊球通过可拆卸焊接掩模的一部分彼此分开，以在焊球附着到电子封装期间使焊球保持球形。 然而，它在回流到电路板之前被去除，从而在电子封装和电路板之间产生更大的更长的焊接连接。

公开(公告)号：US06936769B1

公开(公告)日：2005-08-30

申请号：US10960721

申请日：2004-10-08

Applicant: Takashi Noguchi ,  Masahiro Machida ,  Makoto Terui ,  Yuichi Deushi

Inventor： Takashi Noguchi ,  Masahiro Machida ,  Makoto Terui ,  Yuichi Deushi

IPC: H05K3/28 ,  H01L23/12 ,  H01L23/28 ,  H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L23/467 ,  H01L23/498 ,  H01L23/50 ,  H02G3/08 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K5/00

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L23/49827 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05569 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H05K1/114 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/0959 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: An infrared emissive first insulating portion, which radiates heat transferred from a WCSP corresponding to an electronic part to a first conductive portion as infrared radiation with high efficiency, is formed on the first conductive portion lying in a through hole provided in a printed wiring board with the WCSP mounted thereon.

Abstract translation: 在设置在印刷电路板中的通孔中的第一导电部分上形成有将从电子部件对应的WCSP传递到第一导电部分的红外发射第一绝缘部分作为高效率的红外线辐射， 安装在其上的WCSP。