摘要:
An under-bump metallization (UBM) structure in a semiconductor device includes a copper layer, a nickel layer, and a Cu—Ni—Sn intermetallic compound (IMC) layer between the copper layer and the nickel layer.
摘要:
The embodiments of bump and bump-on-trace (BOT) structures provide bumps with recess regions for reflowed solder to fill. The recess regions are placed in areas of the bumps where reflow solder is most likely to protrude. The recess regions reduce the risk of bump to trace shorting. As a result, yield can be improved.
摘要:
A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.
摘要:
A lower leg massage device includes a rotatable shaft having two actuating pins, two actuating devices solidly secured on the shaft, and two rotatable actuating devices rotatably attached onto the shaft and each having two opposite seats for selectively engaging with the actuator pins of the shaft. Four massage members are attached onto and to be vibrated by the actuating devices. The actuator pins may selectively engage with the one of the seats to rotate the rotatable actuating devices in one direction, and may engage with the other seat to rotate the rotatable actuating devices in the other direction, and to allow the massage members to be arranged either opposite to or parallel to each other.
摘要:
A nozzle for inflatable objects being made of a plastic material, including a nozzle body and a sealing element composed of a vertical sleeve body and an one-way membrane, in which the nozzle body is incorporated with an annular nozzle seat, a conical wall is extended upward from the annular nozzle seat, an annular horizontal wall is extended from the top of the conical wall, a vertical cylindrical body is extended from the annular horizontal wall, an air passage is formed in the vertical cylindrical body, a plug which can be inserted to the air passage to seal the air passage, the sealing element is tightly fitted to the lower cylindrical body, and an one-way membrane is secured to the inner wall of the sealing element to swing freely therein and to close the air passage tightly.
摘要:
A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a lengthwise direction. The metal trace includes a portion having an edge, wherein the edge is not parallel to the lengthwise direction of the metal trace. The second package component includes a metal pillar, wherein the second package component is disposed over the first package component. A solder region bonds the metal pillar to the metal trace, wherein the solder region contacts a top surface and the edge of the portion of the metal trace.
摘要:
An under-bump metallization (UBM) structure in a semiconductor device includes a copper layer, a nickel layer, and a Cu—Ni—Sn intermetallic compound (IMC) layer between the copper layer and the nickel layer.
摘要:
This invention discloses a cooking pot for both steaming and boiling, which including a deep pot body forming a first holding space therein, a chimney container which has an end thereof disposed in the first holding space of pot body and another end thereof having a opening and a second holding space therein, and a steam container which is placed on the opening of the chimney container and facing the second holding space. Once the pot body is heated, water in the second holding space of the chimney container boils and produces steam air to cook food in the steam container.
摘要:
A chair includes a seat rotatably attached to a base with a pivot axle and coupled to the base with an actuator, to adjust the seat relative to the base. A seat back is rotatably attached to the seat and coupled to the seat with another actuator, to adjust the seat back relative to the seat. A foot support is rotatably attached to the seat and coupled to the seat with a further actuator, to adjust the foot support relative to the seat. The seat is adjustable relative to the base, the seat back is adjustable relative to the seat, and the foot support is adjustable relative to the seat with different actuators. The foot support may include a foot pedal slidably coupled to a plate with another actuator.
摘要:
A method using piezoelectric effect is provided for measuring an angle between a reference plane and a plane to be measured. The method can be used to measure the inclination of a plane or for leveling purpose. The method employs an apparatus wherein the main characteristics of the apparatus are simple in structure with no limitation in the measurement range and fewer limitations to the environment. The method may also have the following advantages compact, quick and accurate measurement, easy for multiaxial measurement.