摘要:
An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position.
摘要:
In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal (4) of an electronic component (1) and an electrode terminal (5) of a substrate (2) contains an alloy (8) and a metal (9) having a lower modulus of elasticity than the alloy (8). The junction has a cross section structure in which the alloy (8) is surrounded by the metal (9) having the lower modulus of elasticity.
摘要:
An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position.
摘要:
In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal (4) of an electronic component (1) and an electrode terminal (5) of a substrate (2) contains an alloy (8) and a metal (9) having a lower modulus of elasticity than the alloy (8). The junction has a cross section structure in which the alloy (8) is surrounded by the metal (9) having the lower modulus of elasticity.
摘要:
An electronic component mounted structure is constituted by connecting together via a conductive adhesive 2 the electrode terminals 1a of a first electronic component such as a semiconductor element 1 and the electrode terminals 6a (here, projecting electrodes formed thereon) of a second electronic component such as a circuit substrate 6, and filling a molding resin 4 into a gap between the semiconductor element 1 and the circuit substrate 6. The molding resin 4 is composed of a low elasticity layer 3 and a high elasticity layer having higher elasticity than the low elasticity layer, and the low elasticity layer 3 lies adjacent to the whole of the outer surface of the conductive adhesive 2.