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1.发明申请公开(公告)号：US20090246474A1
公开(公告)日：2009-10-01
申请号：US12407369
申请日：2009-03-19
申请人： Daisuke Sakurai , Kazuya Usirokawa , Shozo Ochi
发明人： Daisuke Sakurai , Kazuya Usirokawa , Shozo Ochi
CPC分类号： H05K3/305 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/13076 , H01L2224/13144 , H01L2224/13147 , H01L2224/1329 , H01L2224/133 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13364 , H01L2224/1339 , H01L2224/13444 , H01L2224/16225 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/32505 , H01L2224/73204 , H01L2224/8185 , H01L2224/8192 , H01L2224/83104 , H01L2224/83192 , H01L2224/8385 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H05K3/321 , H05K3/4007 , H05K2201/0133 , H05K2201/0179 , H05K2201/0187 , H05K2201/0209 , H05K2201/0367 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , Y10T428/24612 , Y10T428/24942 , H01L2924/00 , H01L2924/3512 , H01L2924/0665 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/05442 , H01L2924/05432
摘要： An electronic component mounted structure is constituted by connecting together via a conductive adhesive 2 the electrode terminals 1a of a first electronic component such as a semiconductor element 1 and the electrode terminals 6a (here, projecting electrodes formed thereon) of a second electronic component such as a circuit substrate 6, and filling a molding resin 4 into a gap between the semiconductor element 1 and the circuit substrate 6. The molding resin 4 is composed of a low elasticity layer 3 and a high elasticity layer having higher elasticity than the low elasticity layer, and the low elasticity layer 3 lies adjacent to the whole of the outer surface of the conductive adhesive 2.
摘要翻译： 电子部件安装结构通过导电粘合剂2将第一电子部件（例如半导体元件1）的电极端子1a和形成在其上的电极端子6a（这里形成在其上的突出电极）连接在一起而构成，第二电子部件例如 电路基板6，并且将模制树脂4填充到半导体元件1和电路基板6之间的间隙中。模制树脂4由低弹性层3和具有比低弹性层高的弹性的高弹性层构成 ，低弹性层3位于导电性粘合剂2的整个外表面的附近。
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2.发明申请公开(公告)号：US20130170165A1
公开(公告)日：2013-07-04
申请号：US13821521
申请日：2011-09-22
申请人： Daisuke Sakurai , Kazuya Usirokawa
发明人： Daisuke Sakurai , Kazuya Usirokawa
CPC分类号： H05K7/06 , H01L21/4853 , H01L21/563 , H01L23/36 , H01L23/3677 , H01L23/49838 , H01L23/544 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2223/5442 , H01L2223/54426 , H01L2224/023 , H01L2224/02372 , H01L2224/02377 , H01L2224/02379 , H01L2224/0401 , H01L2224/05569 , H01L2224/05624 , H01L2224/11442 , H01L2224/11464 , H01L2224/1182 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13155 , H01L2224/136 , H01L2224/1403 , H01L2224/14131 , H01L2224/14136 , H01L2224/14179 , H01L2224/14515 , H01L2224/16225 , H01L2224/16227 , H01L2224/17051 , H01L2224/73104 , H01L2224/73204 , H01L2224/81007 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81411 , H01L2224/81444 , H01L2224/81815 , H01L2224/831 , H01L2224/83862 , H01L2224/92125 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , H01L2924/381 , H01L2924/3841 , H05K1/02 , H01L2924/01014 , H01L2924/01015 , H01L2924/01079 , H01L2924/01047 , H01L2924/01083 , H01L2224/05552
摘要： An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position.
摘要翻译： 本发明的电子部件安装体包括安装在电路板上的电子部件。 电子部件包括多个部件侧电极端子，电路基板包括用于元件侧电极端子的多个电路板侧电极端子。 电子部件安装体还包括：分别形成在电子部件的部件侧电极端子上的多个突出电极，电连接电子部件和电路基板; 以及形成在所述电子部件上并且在所述元件侧电极端子中的规定位置与所述元件侧电极端子电连接的虚拟电极。 在预定位置上的元件侧电极端子上的突出电极与组件侧电极端子上的与预定位置不同的位置的突出电极高。
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公开(公告)号：US09373595B2
公开(公告)日：2016-06-21
申请号：US14342935
申请日：2012-08-08
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/00 , B23K35/24 , B23K35/26 , B23K35/00 , B23K35/02
CPC分类号： H01L24/10 , B23K35/001 , B23K35/0222 , B23K35/24 , B23K35/262 , B23K2101/40 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05541 , H01L2224/05557 , H01L2224/11 , H01L2224/1144 , H01L2224/11464 , H01L2224/1182 , H01L2224/13 , H01L2224/13082 , H01L2224/13144 , H01L2224/13155 , H01L2224/13553 , H01L2224/13562 , H01L2224/13582 , H01L2224/13611 , H01L2224/13655 , H01L2224/16225 , H01L2224/16227 , H01L2224/16501 , H01L2224/81075 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8121 , H01L2224/81805 , H01L2224/81825 , H01L2924/181 , H01L2924/3511 , H01L2924/381 , H01L2924/206 , H01L2924/00014 , H01L2924/01015 , H01L2924/00012 , H01L2924/0105 , H01L2924/01029 , H01L2924/00
摘要： In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal (4) of an electronic component (1) and an electrode terminal (5) of a substrate (2) contains an alloy (8) and a metal (9) having a lower modulus of elasticity than the alloy (8). The junction has a cross section structure in which the alloy (8) is surrounded by the metal (9) having the lower modulus of elasticity.
摘要翻译： 在所提供的安装结构中，诸如具有脆弱膜的半导体芯片的电子部件安装在具有较高连接可靠性的诸如电路板的基板上。 连接电子部件（1）的电极端子（4）和基板（2）的电极端子（5）的接合部包含合金（8）和具有低于 合金（8）。 接头具有横截面结构，其中合金（8）被具有较低弹性模量的金属（9）包围。
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4.发明授权公开(公告)号：US08921708B2
公开(公告)日：2014-12-30
申请号：US13821521
申请日：2011-09-22
申请人： Daisuke Sakurai , Kazuya Usirokawa
发明人： Daisuke Sakurai , Kazuya Usirokawa
IPC分类号： H05K1/11 , H05K7/06 , H01L21/56 , H01L23/498 , H01L23/00 , H01L23/36 , H01L21/48 , H01L23/544 , H05K1/02 , H01L23/367
CPC分类号： H05K7/06 , H01L21/4853 , H01L21/563 , H01L23/36 , H01L23/3677 , H01L23/49838 , H01L23/544 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2223/5442 , H01L2223/54426 , H01L2224/023 , H01L2224/02372 , H01L2224/02377 , H01L2224/02379 , H01L2224/0401 , H01L2224/05569 , H01L2224/05624 , H01L2224/11442 , H01L2224/11464 , H01L2224/1182 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13155 , H01L2224/136 , H01L2224/1403 , H01L2224/14131 , H01L2224/14136 , H01L2224/14179 , H01L2224/14515 , H01L2224/16225 , H01L2224/16227 , H01L2224/17051 , H01L2224/73104 , H01L2224/73204 , H01L2224/81007 , H01L2224/8113 , H01L2224/81132 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81411 , H01L2224/81444 , H01L2224/81815 , H01L2224/831 , H01L2224/83862 , H01L2224/92125 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , H01L2924/381 , H01L2924/3841 , H05K1/02 , H01L2924/01014 , H01L2924/01015 , H01L2924/01079 , H01L2924/01047 , H01L2924/01083 , H01L2224/05552
摘要： An electronic-component mounted body of the present invention includes an electronic component mounted on a circuit board. The electronic component includes multiple component-side electrode terminals, and the circuit board includes multiple circuit-board side electrode terminals for the component-side electrode terminals. The electronic-component mounted body further includes: multiple protruded electrodes formed respectively on the component-side electrode terminals of the electronic component to electrically connect the electronic component and the circuit board; and a dummy electrode formed on the electronic component and electrically connected to the component-side electrode terminal in a predetermined position out of the component-side electrode terminals. The protruded electrode on the component-side electrode terminal in the predetermined position is higher than the protruded electrode on the component-side electrode terminal in a different position from the predetermined position.
摘要翻译： 本发明的电子部件安装体包括安装在电路板上的电子部件。 电子部件包括多个部件侧电极端子，电路基板包括用于元件侧电极端子的多个电路板侧电极端子。 电子部件安装体还包括：分别形成在电子部件的部件侧电极端子上的多个突出电极，电连接电子部件和电路基板; 以及形成在所述电子部件上并且在所述元件侧电极端子中的规定位置与所述元件侧电极端子电连接的虚拟电极。 在预定位置上的元件侧电极端子上的突出电极与组件侧电极端子上的与预定位置不同的位置的突出电极高。
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公开(公告)号：US20140217595A1
公开(公告)日：2014-08-07
申请号：US14342935
申请日：2012-08-08
IPC分类号： H01L23/00
CPC分类号： H01L24/10 , B23K35/001 , B23K35/0222 , B23K35/24 , B23K35/262 , B23K2101/40 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05541 , H01L2224/05557 , H01L2224/11 , H01L2224/1144 , H01L2224/11464 , H01L2224/1182 , H01L2224/13 , H01L2224/13082 , H01L2224/13144 , H01L2224/13155 , H01L2224/13553 , H01L2224/13562 , H01L2224/13582 , H01L2224/13611 , H01L2224/13655 , H01L2224/16225 , H01L2224/16227 , H01L2224/16501 , H01L2224/81075 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8121 , H01L2224/81805 , H01L2224/81825 , H01L2924/181 , H01L2924/3511 , H01L2924/381 , H01L2924/206 , H01L2924/00014 , H01L2924/01015 , H01L2924/00012 , H01L2924/0105 , H01L2924/01029 , H01L2924/00
摘要： In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal (4) of an electronic component (1) and an electrode terminal (5) of a substrate (2) contains an alloy (8) and a metal (9) having a lower modulus of elasticity than the alloy (8). The junction has a cross section structure in which the alloy (8) is surrounded by the metal (9) having the lower modulus of elasticity.
摘要翻译： 在所提供的安装结构中，诸如具有脆弱膜的半导体芯片的电子部件安装在具有较高连接可靠性的诸如电路板的基板上。 连接电子部件（1）的电极端子（4）和基板（2）的电极端子（5）的接合部包含合金（8）和具有低于 合金（8）。 接头具有横截面结构，其中合金（8）被具有较低弹性模量的金属（9）包围。
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公开(公告)号：US07775446B2
公开(公告)日：2010-08-17
申请号：US12160541
申请日：2007-02-26
申请人： Shozo Ochi , Osamu Uchida , Shigeaki Sakatani , Daisuke Sakurai , Masato Mori , Hiroshi Sakurai , Hidenobu Nishikawa
发明人： Shozo Ochi , Osamu Uchida , Shigeaki Sakatani , Daisuke Sakurai , Masato Mori , Hiroshi Sakurai , Hidenobu Nishikawa
CPC分类号： H01Q1/22 , G06K19/07732 , G06K19/07749 , H01Q7/06 , H05K1/0218 , H05K1/144 , H05K1/148 , H05K1/16 , H05K2201/043 , H05K2201/086 , Y10T29/4913
摘要： Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrode formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.
摘要翻译： 卡类型信息装置包括具有安装在布线板的第一面上的电子部件的布线图案和天线连接电极的布线板，天线板天线阵列与天线端子电极形成在天线板的第一面上，磁性材料放置 在布线板和天线板之间，用于将天线连接电极耦合到天线端子电极的柔性布线板和用于容纳布线板，天线板，磁性材料和柔性布线板的壳体。 接线板和天线板由同一个绝缘母板制成。
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公开(公告)号：US20090173795A1
公开(公告)日：2009-07-09
申请号：US12160541
申请日：2007-02-26
申请人： Shozo Ochi , Osamu Uchida , Shigeaki Sakatani , Daisuke Sakurai , Masato Mori , Hiroshi Sakurai , Hidenobu Nishikawa
发明人： Shozo Ochi , Osamu Uchida , Shigeaki Sakatani , Daisuke Sakurai , Masato Mori , Hiroshi Sakurai , Hidenobu Nishikawa
IPC分类号： G06K19/077 , H01Q1/38 , H01Q7/00 , H05K3/00
CPC分类号： H01Q1/22 , G06K19/07732 , G06K19/07749 , H01Q7/06 , H05K1/0218 , H05K1/144 , H05K1/148 , H05K1/16 , H05K2201/043 , H05K2201/086 , Y10T29/4913
摘要： Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.
摘要翻译： 卡类型信息装置包括具有安装在布线板的第一面上的电子部件和天线连接电极的布线图案的布线板，天线板天线阵列与天线端子电极形成在天线板的第一面上，磁性材料放置 在布线板和天线板之间，用于将天线连接电极耦合到天线端子电极的柔性布线板和用于容纳布线板，天线板，磁性材料和柔性布线板的壳体。 接线板和天线板由同一个绝缘母板制成。
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8.发明申请SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AND METHOD FOR TRANSFERRING SOLDER 有权焊接转运基地，生产焊接转运基地的方法和转移焊接方法公开(公告)号：US20140010991A1
公开(公告)日：2014-01-09
申请号：US14005874
申请日：2012-01-25
申请人： Daisuke Sakurai
发明人： Daisuke Sakurai
CPC分类号： B23K35/0244 , B22F7/004 , B23K1/0016 , B23K1/20 , B23K3/0623 , B23K35/26 , B23K35/262 , B23K35/362 , B23K35/40 , B23K2101/42 , C22C1/02 , C22C13/00 , C22C13/02 , C22C28/00 , H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/111 , H01L2224/11332 , H01L2224/1182 , H01L2224/11849 , H01L2224/13022 , H01L2224/13144 , H01L2224/13155 , H01L2224/13562 , H01L2224/1357 , H01L2224/13578 , H01L2224/13609 , H01L2224/13611 , H01L2224/94 , H01L2924/00013 , H01L2924/01029 , H01L2924/15788 , H05K3/3436 , H05K3/3478 , H05K3/3484 , H05K2203/0425 , Y10T428/24322 , H01L2924/01028 , H01L2924/01047 , H01L2924/01083 , H01L2924/01049 , H01L2924/0103 , H01L2924/00014 , H01L2224/11 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused.
摘要翻译： 一种焊料转移基板，包括：基底层; 布置在基层上的粘合剂层; 以及布置在所述粘合剂层上的多个焊料粉末，其中在作为多孔构件的所述基底层中，至少允许剥离液体通过的多个孔由其侧面形成， 层不布置在其上布置有粘合剂层的一侧。 特别地，粘合剂层具有渗透的剥离液体膨胀的特性。
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9.发明授权Conductive bump, method for producing the same, and electronic component mounted structure 有权导电凸块，其制造方法和电子部件安装结构公开(公告)号：US08575751B2
公开(公告)日：2013-11-05
申请号：US12522239
申请日：2008-03-04
申请人： Daisuke Sakurai , Yoshihiko Yagi
发明人： Daisuke Sakurai , Yoshihiko Yagi
CPC分类号： H01L24/12 , B33Y80/00 , G03F7/0037 , G03F7/0047 , H01L24/11 , H01L24/16 , H01L24/742 , H01L24/90 , H01L2224/05568 , H01L2224/05573 , H01L2224/11552 , H01L2224/11554 , H01L2224/11901 , H01L2224/13012 , H01L2224/13076 , H01L2224/13078 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13109 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13166 , H01L2224/13169 , H01L2224/13171 , H01L2224/13184 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/16 , H01L2224/83192 , H01L2224/90 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , Y10T29/49213 , H01L2924/00014 , H01L2924/0105 , H01L2924/01083 , H01L2224/13099 , H01L2924/00
摘要： A conductive bump formed on an electrode surface of an electronic component. This conductive bump is composed of a plurality of photosensitive resin layers having different conductive filler contents. Consequently, this conductive bump is able to realize conflicting functions, namely, improvement in adhesion strength with the electrode and reduction of contact resistance.
摘要翻译： 形成在电子部件的电极表面上的导电凸块。 该导电凸块由具有不同导电填料含量的多个感光性树脂层构成。 因此，该导电凸块能够实现冲突的功能，即提高与电极的粘合强度和降低接触电阻。
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10.发明申请MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATING METHOD, AND SOLDER TRANSFER SUBSTRATE 有权焊接传输基板的制造方法，焊接预处理方法和焊接传输基板公开(公告)号：US20130181041A1
公开(公告)日：2013-07-18
申请号：US13822708
申请日：2011-08-25
申请人： Daisuke Sakurai
发明人： Daisuke Sakurai
CPC分类号： B23K35/0244 , B23K1/0016 , B23K1/20 , B23K1/203 , B23K1/206 , B23K3/0607 , B23K3/0623 , B23K2101/42 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/111 , H01L2224/11332 , H01L2224/1182 , H01L2224/11822 , H01L2224/11849 , H01L2224/119 , H01L2224/13022 , H01L2224/131 , H01L2224/13144 , H01L2224/1357 , H01L2224/13609 , H01L2224/13611 , H01L2224/94 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H05K3/3478 , H05K3/3484 , H05K2201/0209 , H05K2203/0338 , H05K2203/0425 , H05K2203/043 , Y10T428/24372 , H01L2924/01028 , H01L2924/00012 , H01L2224/11 , H01L2924/01047 , H01L2924/00014 , H01L2924/01083 , H01L2924/01049 , H01L2924/0103
摘要： An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included.
摘要翻译： 一种在基板的表面上形成粘合剂层的粘合剂层形成步骤; 焊料层形成步骤，通过在其间填充多个焊料粉末而在所述粘合剂层上形成焊料层; 并且包括向已经形成在粘合剂层上的焊料粉末的中间空间之间供给填料的填料供给步骤。
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