公开(公告)号：US20090246474A1

公开(公告)日：2009-10-01

申请号：US12407369

申请日：2009-03-19

申请人： Daisuke Sakurai ,  Kazuya Usirokawa ,  Shozo Ochi

发明人： Daisuke Sakurai ,  Kazuya Usirokawa ,  Shozo Ochi

IPC分类号： B32B7/02 ,  C23C14/22 ,  B32B3/00

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13076 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13364 ,  H01L2224/1339 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/32505 ,  H01L2224/73204 ,  H01L2224/8185 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0133 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T428/24612 ,  Y10T428/24942 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/05442 ,  H01L2924/05432

摘要： An electronic component mounted structure is constituted by connecting together via a conductive adhesive 2 the electrode terminals 1a of a first electronic component such as a semiconductor element 1 and the electrode terminals 6a (here, projecting electrodes formed thereon) of a second electronic component such as a circuit substrate 6, and filling a molding resin 4 into a gap between the semiconductor element 1 and the circuit substrate 6. The molding resin 4 is composed of a low elasticity layer 3 and a high elasticity layer having higher elasticity than the low elasticity layer, and the low elasticity layer 3 lies adjacent to the whole of the outer surface of the conductive adhesive 2.

摘要翻译： 电子部件安装结构通过导电粘合剂2将第一电子部件（例如半导体元件1）的电极端子1a和形成在其上的电极端子6a（这里形成在其上的突出电极）连接在一起而构成，第二电子部件例如 电路基板6，并且将模制树脂4填充到半导体元件1和电路基板6之间的间隙中。模制树脂4由低弹性层3和具有比低弹性层高的弹性的高弹性层构成 ，低弹性层3位于导电性粘合剂2的整个外表面的附近。

公开(公告)号：US07775446B2

公开(公告)日：2010-08-17

申请号：US12160541

申请日：2007-02-26

申请人： Shozo Ochi ,  Osamu Uchida ,  Shigeaki Sakatani ,  Daisuke Sakurai ,  Masato Mori ,  Hiroshi Sakurai ,  Hidenobu Nishikawa

发明人： Shozo Ochi ,  Osamu Uchida ,  Shigeaki Sakatani ,  Daisuke Sakurai ,  Masato Mori ,  Hiroshi Sakurai ,  Hidenobu Nishikawa

IPC分类号： G06K19/06 ,  H01Q1/00 ,  H01Q1/36

CPC分类号： H01Q1/22 ,  G06K19/07732 ,  G06K19/07749 ,  H01Q7/06 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/148 ,  H05K1/16 ,  H05K2201/043 ,  H05K2201/086 ,  Y10T29/4913

摘要： Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrode formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.

摘要翻译： 卡类型信息装置包括具有安装在布线板的第一面上的电子部件的布线图案和天线连接电极的布线板，天线板天线阵列与天线端子电极形成在天线板的第一面上，磁性材料放置 在布线板和天线板之间，用于将天线连接电极耦合到天线端子电极的柔性布线板和用于容纳布线板，天线板，磁性材料和柔性布线板的壳体。 接线板和天线板由同一个绝缘母板制成。

公开(公告)号：US20090173795A1

公开(公告)日：2009-07-09

申请号：US12160541

申请日：2007-02-26

申请人： Shozo Ochi ,  Osamu Uchida ,  Shigeaki Sakatani ,  Daisuke Sakurai ,  Masato Mori ,  Hiroshi Sakurai ,  Hidenobu Nishikawa

发明人： Shozo Ochi ,  Osamu Uchida ,  Shigeaki Sakatani ,  Daisuke Sakurai ,  Masato Mori ,  Hiroshi Sakurai ,  Hidenobu Nishikawa

IPC分类号： G06K19/077 ,  H01Q1/38 ,  H01Q7/00 ,  H05K3/00

CPC分类号： H01Q1/22 ,  G06K19/07732 ,  G06K19/07749 ,  H01Q7/06 ,  H05K1/0218 ,  H05K1/144 ,  H05K1/148 ,  H05K1/16 ,  H05K2201/043 ,  H05K2201/086 ,  Y10T29/4913

摘要： Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.

摘要翻译： 卡类型信息装置包括具有安装在布线板的第一面上的电子部件和天线连接电极的布线图案的布线板，天线板天线阵列与天线端子电极形成在天线板的第一面上，磁性材料放置 在布线板和天线板之间，用于将天线连接电极耦合到天线端子电极的柔性布线板和用于容纳布线板，天线板，磁性材料和柔性布线板的壳体。 接线板和天线板由同一个绝缘母板制成。

公开(公告)号：US20100052996A1

公开(公告)日：2010-03-04

申请号：US11993734

申请日：2006-07-10

申请人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

发明人： Shozo Ochi ,  Norihito Tsukahara ,  Kazuhiro Ikurumi

IPC分类号： H01Q7/06 ,  H01Q1/24

CPC分类号： H05K1/16 ,  G06K19/07732 ,  G06K19/07767 ,  H01Q1/2275 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/056 ,  H05K2201/10674

摘要： A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

摘要翻译： 具有内置天线的存储介质包括其上放置有半导体元件的电路板，夹持半导体元件和电路板的第一和第二磁性层以及设置在第一和第二磁性层上的第一和第二天线线圈。 第一和第二天线线圈并联连接在柔性片上。 第一和第二天线线圈分别在第一和第二磁性层的侧面折叠并电连接到半导体元件。

公开(公告)号：US06459046B1

公开(公告)日：2002-10-01

申请号：US09919319

申请日：2001-07-31

申请人： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

发明人： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

IPC分类号： H05K103

CPC分类号： H05K3/4069 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/12028 ,  Y10T428/12528

摘要： A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

公开(公告)号：US08025237B2

公开(公告)日：2011-09-27

申请号：US12161185

申请日：2006-11-08

申请人： Shozo Ochi ,  Norihito Tsukahara ,  Yutaka Nakamura ,  Hirohisa Tanaka

发明人： Shozo Ochi ,  Norihito Tsukahara ,  Yutaka Nakamura ,  Hirohisa Tanaka

IPC分类号： G06K19/06

CPC分类号： H01Q1/36 ,  G06K19/07732 ,  G06K19/07749 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/15192 ,  H01L2924/3025 ,  H01Q1/2275 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q7/06 ,  H01Q9/27 ,  H01Q21/0025 ,  H05K1/16 ,  H05K2201/086 ,  H01L2224/0401

摘要： An antenna built-in module which incorporates an antenna, is thin and excellent in antenna characteristics, a card type information device and a method for manufacturing the same are provided. A wiring board (110) which has a wiring pattern (120) and in which an electronic component is mounted on at least one surface thereof, a magnetic substance (160) embedded in the other surface of the wiring board (110), an antenna pattern (170) provided on the magnetic substance (160), the wiring pattern (120) of the wiring board (110) and the antenna terminal electrode of the antenna pattern (170) are connected by a conductive via (200).

摘要翻译： 一种内置天线的天线内置模块，其天线特性薄型化，卡型信息装置及其制造方法。 一种布线板（110），其具有布线图案（120），并且其电子部件安装在其至少一个表面上，嵌入在所述布线板（110）的另一个表面中的磁性物质（160），天线 设置在磁性物质（160）上的图案（170），布线板（110）的布线图案（120）和天线图案（170）的天线端子电极通过导电通孔（200）连接。

公开(公告)号：US06753483B2

公开(公告)日：2004-06-22

申请号：US09879385

申请日：2001-06-12

申请人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

发明人： Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Tousaku Nishiyama ,  Shozo Ochi

IPC分类号： H01R1204

CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： The present invention provides a printed circuit board, which includes a dielectric substrate having via holes formed in the thickness direction, and a conductor including a conductive filler is filled in the via holes. The dielectric substrate has patterned wiring layers on both surfaces, and the wiring layers are connected electrically with each other by the conductor. The dielectric substrate is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

摘要翻译： 本发明提供了一种印刷电路板，其包括具有沿厚度方向形成的通孔的电介质基板，并且包含导电填料的导体填充在通孔中。 电介质基板在两表面上具有图案化的布线层，并且布线层通过导体彼此电连接。 电介质基板由玻璃布或浸渍有与微粒混合的热固性环氧树脂的玻璃无纺布制成，并且导体中的导电填料的平均粒径大于微粒的平均粒径。 因此，印刷电路板整体上具有改善的耐湿性，并且还具有优异的连接可靠性和修复电阻。 此外，印刷电路板的电介质基板具有改善的机械强度，例如弯曲刚度。 本发明还提供一种制造这种印刷电路板的方法。

公开(公告)号：US09041221B2

公开(公告)日：2015-05-26

申请号：US13993714

申请日：2011-09-12

申请人： Shozo Ochi ,  Kazuya Ushirokawa ,  Keiichi Kusumoto ,  Takashi Yamada ,  Ken Yasue

发明人： Shozo Ochi ,  Kazuya Ushirokawa ,  Keiichi Kusumoto ,  Takashi Yamada ,  Ken Yasue

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L23/498

CPC分类号： H01L23/5386 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/05 ,  H01L24/14 ,  H01L24/16 ,  H01L24/73 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/1403 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/00

摘要： An implementing structure intermediate body including: a first chip having a first connection terminal; a second chip having a second connection terminal in a face that faces the first chip; and a film wiring substrate having a third connection terminal in one face, which is arranged between the first chip and the second chip, is loaded on a chip loading substrate having a fifth connection terminal so that another one face of the first chip is confronted thereby. In the film wiring substrate, there is a portion that is located outside any of the first chip and the second chip, at the tip part, is provided a fourth connection terminal connected to the third connection terminal by wiring, one part of the first connection terminal is connected with the second connection terminal, the third connection terminal is connected with another one part of the first connection terminal, and the fifth connection terminal is connected to the fourth connection terminal.

摘要翻译： 一种实现结构中间体，包括：具有第一连接端子的第一芯片; 第二芯片，其具有面向所述第一芯片的面中的第二连接端子; 并且具有设置在第一芯片和第二芯片之间的一个面中的具有第三连接端子的膜布线基板被装载在具有第五连接端子的芯片装载基板上，使得第一芯片的另一个面由此面对 。 在薄膜配线基板中，存在位于第一芯片和第二芯片的外侧的部分，在前端部设置有通过布线与第三连接端子连接的第四连接端子，一部分第一连接 端子与第二连接端子连接，第三连接端子与第一连接端子的另一部分连接，第五连接端子连接到第四连接端子。

公开(公告)号：US20090040734A1

公开(公告)日：2009-02-12

申请号：US12280456

申请日：2007-03-28

申请人： Shozo Ochi ,  Hidenobu Nishikawa ,  Hiroshi Sakurai

发明人： Shozo Ochi ,  Hidenobu Nishikawa ,  Hiroshi Sakurai

IPC分类号： H01Q7/00 ,  H05K1/03

CPC分类号： G06K19/0723 ,  G06K19/07732 ,  G06K19/07749 ,  H01Q1/2208 ,  H05K1/0306 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/117 ,  H05K1/144 ,  H05K1/16 ,  H05K2201/086 ,  H05K2201/09309

摘要： The semiconductor memory module incorporating antenna includes a wiring board (11) having a connection terminal (17) connected with a control semiconductor element (16) and arranged at a position exposed to the surface of an outer case (15), and a terminal electrode (18) for antenna connection connected with the control semiconductor element (16) and arranged in the outer case (15); a semiconductor storage element (12) mounted on one side of the wiring board (11); and a loop-like antenna (13) and an antenna terminal electrode (20) formed on the other side of the wiring board (11) along the outer peripheral thereof, the wiring board (11) includes at least one magnetic body layer (14) and the terminal electrode (18) for antenna connection is connected with the antenna terminal electrode (20).

摘要翻译： 具有天线的半导体存储器模块包括具有连接端子（17）的布线板（11），该连接端子（17）与控制半导体元件（16）连接并布置在暴露于外壳（15）的表面的位置处，以及端子电极 （18），用于与控制半导体元件（16）连接并布置在外壳（15）中的天线连接; 安装在所述布线板（11）一侧的半导体存储元件（12）。 以及沿其外周形成在布线板（11）的另一侧的环状天线（13）和天线端子电极（20），布线基板（11）包括至少一个磁性体层（14） ）和用于天线连接的端子电极（18）与天线端子电极（20）连接。

公开(公告)号：US20090032285A1

公开(公告)日：2009-02-05

申请号：US11814698

申请日：2005-01-27

申请人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

发明人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

IPC分类号： H05K3/46 ,  H05K1/14 ,  H05K1/00

CPC分类号： H05K1/024 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10T428/24843

摘要： A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

摘要翻译： 一种制造多层电路板的方法包括以下步骤：通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力，并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构，其中预定厚度的预浸料片材用于完成 使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。