公开(公告)号：US20110233755A1

公开(公告)日：2011-09-29

申请号：US13072012

申请日：2011-03-25

申请人： Dong-Han Kim ,  Sung-Woo Park ,  Jin-Woo Park ,  So-Young Lim ,  Jung-Hwan Kim ,  Kwang-Jin Bae ,  Pa-Lan Lee

发明人： Dong-Han Kim ,  Sung-Woo Park ,  Jin-Woo Park ,  So-Young Lim ,  Jung-Hwan Kim ,  Kwang-Jin Bae ,  Pa-Lan Lee

IPC分类号： H01L23/48

CPC分类号： H01L25/105 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/05171 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/73277 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor housing package may be provided. The semiconductor housing package may include a mold layer, a housing chip, a redistribution structure, and a housing node. The mold layer may surround and partially expose the housing chip. The redistribution structure may be electrically connected to the housing chip and may be disposed on the mold layer. The housing node may be in contact with the redistribution structures. The semiconductor housing package may be disposed on a semiconductor base package and may constitute a semiconductor package structure along with the semiconductor base package. The semiconductor package structure may be disposed on a processor-based system.

摘要翻译： 可以提供半导体外壳封装。 半导体外壳封装可以包括模具层，壳体芯片，再分布结构和壳体节点。 模具层可围绕并部分地暴露外壳芯片。 再分布结构可以电连接到壳体芯片并且可以设置在模具层上。 壳体节点可以与再分布结构接触。 半导体外壳封装可以设置在半导体基底封装上，并且可以与半导体基底封装构成半导体封装结构。 半导体封装结构可以设置在基于处理器的系统上。

公开(公告)号：US20110092087A1

公开(公告)日：2011-04-21

申请号：US12858576

申请日：2010-08-18

申请人： Min-Su JUNG ,  Kwang-Jin BAE ,  Jung-Nam MOON ,  Hong-Moon CHUN

发明人： Min-Su JUNG ,  Kwang-Jin BAE ,  Jung-Nam MOON ,  Hong-Moon CHUN

IPC分类号： H01R13/62 ,  H01R24/00

CPC分类号： H01R27/02 ,  H01R12/7005

摘要： Provided is a memory card mounting device for a portable terminal, the memory card mounting device including a first socket installed in the terminal in a state where an opening through which a memory card is inserted is positioned on a side surface of the terminal and a second socket installed in a form stacked on the first socket, in which an opening of the second socket through which a memory card is inserted is positioned in parallel to the opening of the first socket on the side surface of the terminal, or the second socket is positioned on a rear surface of the terminal such that the memory card is mounted in the second socket on the rear surface of the terminal. The opening through which the memory card is inserted can be positioned in various areas such as a side surface or a rear surface of the terminal.

摘要翻译： 本发明提供了一种用于便携式终端的存储卡安装装置，该存储卡安装装置包括安装在端子中的第一插座，其中插入存储卡的开口位于端子的侧表面上，而第二插座 插座安装成堆叠在第一插座上的形式，其中存储卡插入的第二插座的开口平行于端子侧表面上的第一插座的开口定位，或者第二插座是 位于终端的后表面上，使得存储卡安装在终端的后表面上的第二插槽中。 插入存储卡的开口可以位于端子的侧表面或后表面的各个区域中。

公开(公告)号：US20080119061A1

公开(公告)日：2008-05-22

申请号：US11758175

申请日：2007-06-05

申请人： Ji-hwan HWANG ,  Dong-han KIM ,  Chul-woo KIM ,  Sang-heui LEE ,  Kwang-jin BAE

发明人： Ji-hwan HWANG ,  Dong-han KIM ,  Chul-woo KIM ,  Sang-heui LEE ,  Kwang-jin BAE

IPC分类号： H01L23/48 ,  H05K1/00

CPC分类号： H01L23/49572 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/189 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/10674 ,  H05K2201/10681 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor chip is disclosed and includes a plurality of bond pads disposed on a semiconductor chip, and a plurality of chip bumps of different heights disposed on a corresponding bond pad.

摘要翻译： 公开了一种半导体芯片，并且包括设置在半导体芯片上的多个接合焊盘以及设置在相应的焊盘上的不同高度的多个芯片凸块。

公开(公告)号：US20080026791A1

公开(公告)日：2008-01-31

申请号：US11802339

申请日：2007-05-22

申请人： Ki-bum Kim ,  Kwang-jin Bae

发明人： Ki-bum Kim ,  Kwang-jin Bae

IPC分类号： H04M1/00

CPC分类号： H04M1/0214 ,  G04G17/083 ,  G04G21/00 ,  G04G21/04 ,  G04R60/00

摘要： A watch-type portable terminal includes a first housing and wrist bands extending from both ends of the first housing. The watch-type portable terminal includes a second housing rotatably combined with the first housing in a direction to be folded down or away from the first housing while facing the first housing. Display devices are installed on at least one face of the second housing.

摘要翻译： 手表型便携式终端包括从第一壳体的两端延伸的第一壳体和腕带。 手表型便携式终端包括与第一壳体可旋转地组合的第二壳体，该第二壳体朝着第一壳体向下折叠或远离第一壳体的方向旋转。 显示装置安装在第二壳体的至少一个面上。

公开(公告)号：US08466554B2

公开(公告)日：2013-06-18

申请号：US13028836

申请日：2011-02-16

申请人： Ji-Yong Park ,  Hee-Seok Lee ,  Chul-Woo Kim ,  Sang-Gui Jo ,  Kwang-Jin Bae ,  Seung-Hwan Kim

发明人： Ji-Yong Park ,  Hee-Seok Lee ,  Chul-Woo Kim ,  Sang-Gui Jo ,  Kwang-Jin Bae ,  Seung-Hwan Kim

IPC分类号： H01L23/498 ,  H01L21/768 ,  H01L23/12 ,  H01L23/053

CPC分类号： H01L24/03 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/0557 ,  H01L2224/0603 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/1403 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2224/05552 ,  H01L2924/00

摘要： An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection. The electronic device further includes a first pad filling the first opening and having a greater width than the first opening. The first pad covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer.

摘要翻译： 电子设备包括形成在基板的第一表面上并彼此间隔开的第一和第二互连。 电子设备包括设置在基板上的第一绝缘材料层，包括第一和第二互连，并且包括暴露第一互连的预定区域的第一开口。 电子设备还包括填充第一开口并且具有比第一开口更大的宽度的第一垫。 第一焊盘覆盖与第一互连的一端相邻的第二互连的至少一部分，并且第一焊盘通过第一绝缘材料层与第二互连电绝缘。

公开(公告)号：US07486509B2

公开(公告)日：2009-02-03

申请号：US11320971

申请日：2005-12-30

申请人： Ki-Bum Kim ,  Eun Deok Bae ,  Dong Ok Kwak ,  Ki Taek Kim ,  Seong Woon Booh ,  Jin Woo Cho ,  Kwang Jin Bae

发明人： Ki-Bum Kim ,  Eun Deok Bae ,  Dong Ok Kwak ,  Ki Taek Kim ,  Seong Woon Booh ,  Jin Woo Cho ,  Kwang Jin Bae

IPC分类号： G06F1/16

CPC分类号： G06F1/187 ,  G11B33/08 ,  G11B33/124

摘要： A bracket for a disk drive, including: a base plate containing the disk drive; a side wall portion vertically protruded from an end portion of the base plate; and a displacement portion extended from the side wall portion and bending due to a vibration transmitted by making contact with the disk drive. Accordingly, a bracket according to the present invention has an improved buffering ability without installing a buffer. Also, the bracket can not only effectively protect a disk drive from an external impact but also be applied to an electric device such as a portable device. Also, a bracket according to another embodiment can prevent mutual interference between circuits provided on the bracket.

摘要翻译： 一种用于磁盘驱动器的支架，包括：包含磁盘驱动器的基板; 从所述基板的端部垂直突出的侧壁部; 以及从侧壁部分延伸的位移部分，并且由于通过与盘驱动器接触而传递的振动而弯曲。 因此，根据本发明的支架在没有安装缓冲器的情况下具有改进的缓冲能力。 此外，支架不仅可以有效地保护磁盘驱动器免受外部冲击，而且可以应用于诸如便携式设备的电气设备。 此外，根据另一实施例的支架可以防止在支架上设置的电路之间的相互干扰。

公开(公告)号：US20080119219A1

公开(公告)日：2008-05-22

申请号：US11875114

申请日：2007-10-19

申请人： Hong-Joon PARK ,  Kwang-Jin BAE

发明人： Hong-Joon PARK ,  Kwang-Jin BAE

IPC分类号： H04M1/00

CPC分类号： G06F1/187 ,  G06F1/1615 ,  G06F1/1656

摘要： A portable terminal is provided. The terminal includes a hard disk, a housing having an opening formed thereon, and a motor protruding out of the hard disk while being received in the opening. Even when the space for receiving the hard disk is the same, the distance between the body of the hard disk and the inner peripheral surface of the housing of the terminal is sufficient to prevent external impact from directly acting on the hard disk. In addition, even if the distance between the body of the hard disk and the inner peripheral surface of the housing of the terminal remains the same, no extra space is unnecessarily occupied inside the housing because the motor of the hard disk is received in the opening. This has the merit of achieving compactness of the terminal.

摘要翻译： 提供便携式终端。 端子包括硬盘，具有形成在其上的开口的壳体，以及从容纳在开口中的硬盘突出的电动机。 即使当接收硬盘的空间相同时，硬盘的主体与终端的壳体的内周表面之间的距离足以防止外部冲击直接作用在硬盘上。 此外，即使硬盘的主体与终端的壳体的内周面之间的距离保持相同，由于硬盘的电动机被接收在开口部中，所以不会在壳体内不必要地占用额外的空间 。 这具有实现终端紧凑性的优点。

公开(公告)号：US06470175B1

公开(公告)日：2002-10-22

申请号：US09222392

申请日：1998-12-29

申请人： Sung-Sun Park ,  Kwang-Jin Bae

发明人： Sung-Sun Park ,  Kwang-Jin Bae

IPC分类号： H04B138

CPC分类号： H04M1/0216

摘要： A flip-up type portable phone and a hinge mechanism for opening and closing a flip cover of such a flip-up type portable phone. A speaker is mounted in the interior of the flip cover, so that the space for occupying the speaker is eliminated from a phone body, thereby enabling the phone body to be compact. The hinge mechanism includes a pair of hinge assemblies adapted to open and close a flip cover and arranged at opposite sides of a liquid crystal display module disposed at the upper portion of the phone body, so that the flip cover can be opened by an upward pivotal movement thereof carried out about hinge shafts arranged at opposite sides of the LCD module. Accordingly, a microphone unit can be arranged at the lower end of the phone body. Moreover, the microphone unit can be arranged at an optional position on the lower end of the phone body. In accordance with the above arrangement, the LCD unit is always exposed.

摘要翻译： 用于打开和关闭这种翻盖式便携式电话的翻盖的翻盖型便携式电话和铰链机构。 扬声器安装在翻盖的内部，使得用于占据扬声器的空间从电话机体中消除，从而使得电话机体能够紧凑。 铰链机构包括一对铰链组件，其适于打开和关闭翻盖并且布置在设置在电话主体上部的液晶显示模块的相对侧，使得翻盖可以通过向上的枢转 关于布置在LCD模块的相对侧的铰链轴的运动。 因此，麦克风单元可以布置在电话机体的下端。 此外，麦克风单元可以布置在电话机体的下端的可选位置。 根据上述布置，LCD单元总是被曝光。

公开(公告)号：US08339561B2

公开(公告)日：2012-12-25

申请号：US12353317

申请日：2009-01-14

申请人： Ji-Hwan Hwang ,  Dong-Han Kim ,  Chul-Woo Kim ,  Chung-Ye Chung ,  Kwang-Jin Bae

发明人： Ji-Hwan Hwang ,  Dong-Han Kim ,  Chul-Woo Kim ,  Chung-Ye Chung ,  Kwang-Jin Bae

IPC分类号： G02F1/1345

CPC分类号： H05K1/0277 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/50 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/10128 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

摘要： A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip.

摘要翻译： 布线基板包括基膜，多个第一布线和多个第二布线。 基膜具有芯片安装区域，用于在其上安装半导体芯片。 第一布线沿芯片安装区域内的第一方向延伸到芯片安装区域的外部，并且包括沿与第一方向不同的第二方向延伸的第一连接端部。 第一连接端部可以形成在芯片安装区域的内部并且被配置为电连接到半导体芯片。 所述第二配线从所述芯片安装区域的内部朝向所述芯片安装区域的外侧沿所述第一方向延伸，并且包括沿与所述第一连接端部延伸的所述第二方向相反的方向延伸的第二连接端部， 连接端部可以形成在芯片安装区域内部，并且被配置为电连接到半导体芯片。

公开(公告)号：US20110247871A1

公开(公告)日：2011-10-13

申请号：US13032100

申请日：2011-02-22

申请人： Soo-Jeoung Park ,  Chul-Woo Kim ,  Kyoung-Sei Choi ,  Kwang-Jin Bae

发明人： Soo-Jeoung Park ,  Chul-Woo Kim ,  Kyoung-Sei Choi ,  Kwang-Jin Bae

IPC分类号： H05K1/11

CPC分类号： H05K3/46 ,  H05K3/4602 ,  H05K3/462 ,  H05K2201/096 ,  Y10T29/49155

摘要： A multi-layer printed circuit board (PCB) and a method for fabricating the same are provided. The multi-layer printed circuit board may include a first film and a first insulation layer. The first film may include a first via therein and the first film may further include a first conductive pattern on an upper surface thereof and the first conductive layer may be electrically connected to the first via. The first insulation layer may be on the upper surface of the first film and the first insulation layer may include a second via therein and a second conductive pattern on an upper surface thereof and the second conductive pattern may be electrically connected to the second via. The second via may be electrically connected to the first conductive pattern.

摘要翻译： 提供了一种多层印刷电路板（PCB）及其制造方法。 多层印刷电路板可以包括第一膜和第一绝缘层。 第一膜可以包括其中的第一通孔，并且第一膜还可以包括在其上表面上的第一导电图案，并且第一导电层可以电连接到第一通孔。 第一绝缘层可以在第一膜的上表面上，并且第一绝缘层可以包括其中的第二通孔和在其上表面上的第二导电图案，并且第二导电图案可以电连接到第二通孔。 第二通孔可以电连接到第一导电图案。