公开(公告)号：US08575735B2

公开(公告)日：2013-11-05

申请号：US13034973

申请日：2011-02-25

申请人： Young-Sang Cho ,  Chang-Sig Kang ,  Dae-Woo Son ,  Yun-Seok Choi ,  Kyong-Soon Cho ,  Sang-Heul Lee

发明人： Young-Sang Cho ,  Chang-Sig Kang ,  Dae-Woo Son ,  Yun-Seok Choi ,  Kyong-Soon Cho ,  Sang-Heul Lee

IPC分类号： H01L23/495

CPC分类号： H01L24/50 ,  H01L23/4985 ,  H01L24/06 ,  H01L2224/0401 ,  H01L2224/0405 ,  H01L2224/05553 ,  H01L2224/06155 ,  H01L2224/14155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

摘要： A semiconductor chip for a tape automated bonding (TAB) package is disclosed. The semiconductor chip comprises a connection surface including a set of input pads connected to internal circuitry of the chip and for conveying external signals to the internal circuitry, the set of input pads comprising all of the input pads on the chip. The connection surface includes a set of output pads connected to internal circuitry of the chip and for conveying internal chip signals to outside the chip, the set of output pads comprising all of the output pads on the chip.

摘要翻译： 公开了一种用于带式自动接合（TAB）封装的半导体芯片。 半导体芯片包括连接表面，其包括连接到芯片的内部电路的一组输入焊盘，并且用于将外部信号传送到内部电路，该组输入焊盘包括芯片上的所有输入焊盘。 连接表面包括连接到芯片的内部电路的一组输出焊盘，并将内部芯片信号传送到芯片外部，该组输出焊盘包括芯片上的所有输出焊盘。

公开(公告)号：US08487437B2

公开(公告)日：2013-07-16

申请号：US12885233

申请日：2010-09-17

申请人： Peter Elenius ,  Deok Hoon Kim ,  Young Sang Cho

发明人： Peter Elenius ,  Deok Hoon Kim ,  Young Sang Cho

IPC分类号： H01L23/48

CPC分类号： H01L23/10 ,  H01L23/3128 ,  H01L23/564 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/13 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13147 ,  H01L2224/14155 ,  H01L2224/16237 ,  H01L2224/16503 ,  H01L2224/29011 ,  H01L2224/29014 ,  H01L2224/29035 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32 ,  H01L2224/32227 ,  H01L2224/32503 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81447 ,  H01L2224/8181 ,  H01L2224/8182 ,  H01L2224/83 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83447 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15321 ,  H01L2924/15788 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/73103 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic device package includes a substrate assembly, an electronic device disposed to face the substrate assembly, and a sealing ring or rings including a sealing layer and a bonding layer that is disposed between the substrate assembly and the electronic device, wherein the sealing ring(s) has a closed loop shape surrounding a sealing region of the electronic device, and the bonding layer is formed through a reaction of the sealing layer and sealing layer pad with a low-melting-point material layer whose melting point is lower than that of the sealing layer and sealing ring pad. The bonding layer is formed of an intermetallic compound of the sealing layer, sealing ring pad and low-melting-point material that melts at a temperature greater than the melting temperature of the low-melting-point material. The device package also includes electrical connections in the form of joints between the substrate assembly and electronic device.

摘要翻译： 电子器件封装包括衬底组件，设置为面对衬底组件的电子器件，以及密封环或环，其包括设置在衬底组件和电子器件之间的密封层和接合层，其中密封环 s）具有围绕电子器件的密封区域的闭环形状，并且通过密封层和密封层焊盘与熔点低于熔点的低熔点材料层的反应形成接合层 密封层和密封环垫。 接合层由密封层，密封环垫和低熔点材料的金属间化合物形成，其熔点高于低熔点材料的熔融温度。 器件封装还包括在衬底组件和电子器件之间的接合形式的电连接。

公开(公告)号：US08434279B2

公开(公告)日：2013-05-07

申请号：US13144083

申请日：2009-07-23

申请人： Jeom Han Kim ,  Young Sang Cho ,  Eun Ho Jeong ,  Kyoung Hun Lee

发明人： Jeom Han Kim ,  Young Sang Cho ,  Eun Ho Jeong ,  Kyoung Hun Lee

IPC分类号： E04C5/08

CPC分类号： E04C3/293 ,  E04C3/291 ,  E04C3/294 ,  Y10T29/49634

摘要： A steel composite beam is manufactured by T-shaped steel, inverse T-shaped steels installed at opposite ends of the T-shaped steel, and vertical stiffeners installed on the inverse T-shaped steels. A method for manufacturing a composite beam using T-shaped steel and a method of constructing a structure using the same are capable of using less steel and minimizing dead weight of the composite beam compared to a steel composite beam having the same cross section and depth, and designing a cross section of the composite beam in an efficient and economical manner due to the pre-stress caused by tendons, providing easy connection with column members on the basis of length, providing efficient construction, easy management, and convenient construction for ceilings and finishing equipment due to light dead weight.

摘要翻译： 钢复合梁由T型钢制成，T型钢的T型钢安装在T型钢的两端，垂直加强件安装在T型钢的逆向上。 使用T型钢制造复合梁的方法以及使用该组合梁的结构的方法与具有相同截面和深度的钢复合梁相比，能够使用更少的钢和最小化复合梁的自重， 并且由于由腱引起的预应力，以有效和经济的方式设计复合梁的横截面，提供了基于长度的柱构件的容易连接，提供有效的结构，易于管理和方便的天花板和 整理设备由于重量轻。

公开(公告)号：US20120085383A1

公开(公告)日：2012-04-12

申请号：US13159663

申请日：2011-06-14

申请人： Young-Sang Cho ,  So-Young Lim ,  Tae-Hong Min ,  Ki-Won Choi

发明人： Young-Sang Cho ,  So-Young Lim ,  Tae-Hong Min ,  Ki-Won Choi

IPC分类号： H01L31/05

CPC分类号： H01L31/0512 ,  H01L31/0201 ,  H01L31/048 ,  H01L31/0504 ,  H01L31/0508 ,  Y02E10/50

摘要： A solar cell module having a reduced thickness using a flip-chip approach includes a transparent substrate, a transparent electrode interconnection disposed on the transparent substrate, and a plurality of solar cells disposed on the transparent electrode interconnection, each solar cell having at least one protrusion formed on one surface of the solar cell, the protrusion being bonded to the transparent electrode interconnection.

摘要翻译： 使用倒装芯片方法具有减小的厚度的太阳能电池模块包括透明基板，布置在透明基板上的透明电极互连以及设置在透明电极互连上的多个太阳能电池，每个太阳能电池具有至少一个突起 形成在太阳能电池的一个表面上，该突起与透明电极互连结合。

公开(公告)号：US20100122220A1

公开(公告)日：2010-05-13

申请号：US12460978

申请日：2009-07-27

申请人： John Patrick Ainsworth ,  Young Sang Cho ,  Geoffrey James Hueter ,  Steven Charles Quandt ,  Helen Ann Schultes

发明人： John Patrick Ainsworth ,  Young Sang Cho ,  Geoffrey James Hueter ,  Steven Charles Quandt ,  Helen Ann Schultes

IPC分类号： G06F3/048 ,  G06N5/02

CPC分类号： G06F16/957

摘要： A method of dynamically generating a user presentation includes selecting and retrieving at least one of a plurality of rules stored in one or more databases in response to a request from an application program, executing the rule to retrieve data from the one or more databases, and generating presentation data based on the data. The presentation data may be for use in the user presentation of the application program.

摘要翻译： 动态生成用户呈现的方法包括响应于来自应用程序的请求选择和检索存储在一个或多个数据库中的多个规则中的至少一个，执行规则以从一个或多个数据库检索数据，以及 根据数据生成演示数据。 呈现数据可以用于应用程序的用户呈现。

公开(公告)号：US20090291228A1

公开(公告)日：2009-11-26

申请号：US12359687

申请日：2009-01-26

申请人： Young-sang CHO ,  Mi-jeong SONG ,  Hong-seok LEE

发明人： Young-sang CHO ,  Mi-jeong SONG ,  Hong-seok LEE

IPC分类号： B05D3/12 ,  B01J19/00 ,  B05D3/00 ,  B05D3/06

CPC分类号： C30B29/68

摘要： A method for forming colloidal photonic crystals comprises; surrounding an outer circumference of a cylinder with a flexible substrate, spacing the cylinder a predetermined distance from a panel coated with a colloidal solution, and rotating the cylinder to form colloidal photonic crystals on the flexible panel.

摘要翻译： 形成胶体光子晶体的方法包括： 围绕具有柔性基板的圆筒的外周，将圆筒与涂有胶体溶液的面板隔开预定距离，并旋转圆筒以在柔性面板上形成胶体光子晶体。

公开(公告)号：US20090273076A1

公开(公告)日：2009-11-05

申请号：US12385731

申请日：2009-04-17

申请人： Kyong-sei CHOI ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

发明人： Kyong-sei CHOI ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

IPC分类号： H01L23/498 ,  H01L23/36

CPC分类号： H01L23/49838 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/189 ,  H05K2201/09109 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2203/1581 ,  H01L2924/00

摘要： Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

摘要翻译： 公开了一种片上胶片（COF）型半导体封装以及使用其的器件。 COF型半导体封装可以包括包括顶表面和底表面的绝缘衬底，绝缘衬底的顶表面上的半导体器件，绝缘衬底的底表面上的散热部件，以及绝缘衬底的至少一个空间 绝缘基板的底表面和散热部件的顶表面。

公开(公告)号：US07589421B2

公开(公告)日：2009-09-15

申请号：US11488057

申请日：2006-07-18

申请人： Young-Sang Cho ,  Dong-Han Kim

发明人： Young-Sang Cho ,  Dong-Han Kim

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L23/4985 ,  H01L24/06 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00

摘要： A semiconductor chip, a tape package of the chip and a tape wiring substrate of the chip may be configured so as to effectively radiate heat generated from the chip externally through certain wiring patterns connected to certain pads. In an example, the chip may include a plurality of input pads along at least one edge of an active surface. The input pads may include power pads and ground pads. The chip may include a plurality of output pads along edges of the active surface, outside of the input pads. The power pads and the ground pads may be located at a central area of the at least one edge.

摘要翻译： 半导体芯片，芯片的带封装和芯片的带布线基板可以被配置为通过连接到某些焊盘的某些布线图案有效地辐射从芯片产生的热。 在一个示例中，芯片可以沿着有源表面的至少一个边缘包括多个输入焊盘。 输入焊盘可以包括电源焊盘和接地焊盘。 芯片可以包括沿着有源表面的边缘的多个输出焊盘，在输入焊盘的外部。 电源焊盘和接地焊盘可以位于至少一个边缘的中心区域。

公开(公告)号：US07350295B2

公开(公告)日：2008-04-01

申请号：US11401915

申请日：2006-04-12

申请人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

发明人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： G02B6/43 ,  G02B6/3608 ,  G02B6/4201 ,  G02B6/4214 ,  G02B6/428 ,  H05K1/0274 ,  H05K3/4611 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T156/1064

摘要： A method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method includes pre-routing a portion of an adhesive meeting the optical waveguide to remove the portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad.

摘要翻译： 一种制造多层PCB的方法，其中将光波导部件插入到PCB中，使得预浸胶粘合剂不阻挡光波导的光信号入口。 该方法包括预先路由满足光波导的粘合剂的一部分以去除该部分，处理粘合剂防止漏水层，以防止粘合剂阻挡光波导的光信号入口，布置光波导，粘合剂 和覆铜层压板上的粘合剂防止层，并将光波导，预浸料和粘合剂防止层彼此组合成单一结构。 粘合防止层选自预浸料，单面覆铜层压板，热固化树脂，散热器和未包覆层。

公开(公告)号：US07197202B2

公开(公告)日：2007-03-27

申请号：US10610818

申请日：2003-07-02

申请人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

发明人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  H05K1/0274

摘要： Disclosed is an optical printed circuit board (PCB) for long-distance signal transmission, which is combined with fiber blocks and pipe blocks embedded in opto-via holes to form a multi-layered optical PCB, and transmits an optical signal using a fiber ribbon when an optical signal transmission distance between layers constituting the multi-layered optical PCB is longer than a length of an optical waveguide element used in conjunction with a silicon substrate. The optical PCB comprises a base substrate including an insulating material, a copper foil, and an opto-via hole, and an optical signal transmission member attached to the base substrate to horizontally transmit an optical signal. An optical signal connection member is horizontally connected to the optical signal transmission member to transmit the optical signal across a desired distance. Therefore, an optical PCB of the present invention is advantageous in that an optical waveguide, a pipe block, and a fiber block are horizontally and optionally arranged and attached to each other, thereby transmitting an optical signal across a longer distance than a length of a silicone substrate.

摘要翻译： 公开了一种用于长距离信号传输的光学印刷电路板（PCB），其与嵌入光通孔中的光纤块和管块组合以形成多层光学PCB，并且使用光纤带传输光信号 当构成多层光学PCB的层之间的光信号传输距离长于与硅衬底结合使用的光波导元件的长度时。 该光学PCB包括一个包括一个绝缘材料，一个铜箔和一个光通孔的基底基板，以及一个光信号传输部件，安装在基板上以水平传输一个光信号。 光信号连接构件水平地连接到光信号传输构件，以在期望的距离上传输光信号。 因此，本发明的光学PCB的优点在于，光波导，管道块和光纤块水平地并且可选地布置和附接到彼此，从而将光信号跨过比 硅胶基材。