公开(公告)号：US11862173B2

公开(公告)日：2024-01-02

申请号：US17332725

申请日：2021-05-27

Applicant: Apple Inc.

Inventor： Timothy J. Millet ,  Manu Gulati ,  Michael F. Culbert

IPC: G10L15/28 ,  G10L15/22 ,  G10L25/48 ,  G06F3/16 ,  G06F1/3228 ,  G06F1/3287 ,  G06F1/32 ,  G10L15/08

CPC classification number: G10L15/28 ,  G06F1/32 ,  G06F1/3228 ,  G06F1/3287 ,  G06F3/165 ,  G10L15/22 ,  G10L25/48 ,  G10L2015/088 ,  Y02D10/00

Abstract: In an embodiment, an integrated circuit may include one or more CPUs, a memory controller, and a circuit configured to remain powered on when the rest of the SOC is powered down. The circuit may be configured to receive audio samples from a microphone, and match those audio samples against a predetermined pattern to detect a possible command from a user of the device that includes the SOC. In response to detecting the predetermined pattern, the circuit may cause the memory controller to power up so that audio samples may be stored in the memory to which the memory controller is coupled. The circuit may also cause the CPUs to be powered on and initialized, and the operating system (OS) may boot. During the time that the CPUs are initializing and the OS is booting, the circuit and the memory may be capturing the audio samples.

公开(公告)号：US10431224B1

公开(公告)日：2019-10-01

申请号：US16397057

申请日：2019-04-29

Applicant: Apple Inc. ,  Diane Culbert

Inventor： Timothy J. Millet ,  Manu Gulati ,  Michael F. Culbert

IPC: G10L15/22 ,  G10L15/28 ,  G06F1/3287 ,  G06F1/3228 ,  G06F3/16 ,  G06F1/32 ,  G10L15/08 ,  G10L25/48

Abstract: In an embodiment, an integrated circuit may include one or more CPUs, a memory controller, and a circuit configured to remain powered on when the rest of the SOC is powered down. The circuit may be configured to receive audio samples from a microphone, and match those audio samples against a predetermined pattern to detect a possible command from a user of the device that includes the SOC. In response to detecting the predetermined pattern, the circuit may cause the memory controller to power up so that audio samples may be stored in the memory to which the memory controller is coupled. The circuit may also cause the CPUs to be powered on and initialized, and the operating system (OS) may boot. During the time that the CPUs are initializing and the OS is booting, the circuit and the memory may be capturing the audio samples.

公开(公告)号：US10241705B2

公开(公告)日：2019-03-26

申请号：US15352693

申请日：2016-11-16

Applicant: Apple Inc.

Inventor： James Wang ,  Zongjian Chen ,  James B. Keller ,  Timothy J. Millet

IPC: G06F3/06 ,  G06F12/0802 ,  G06F12/123 ,  G06F12/0831 ,  G06F12/0864 ,  G06F12/0877 ,  G06F12/0846 ,  G06F12/0853

Abstract: In one embodiment, a memory that is delineated into transparent and non-transparent portions. The transparent portion may be controlled by a control unit coupled to the memory, along with a corresponding tag memory. The non-transparent portion may be software controlled by directly accessing the non-transparent portion via an input address. In an embodiment, the memory may include a decoder configured to decode the address and select a location in either the transparent or non-transparent portion. Each request may include a non-transparent attribute identifying the request as either transparent or non-transparent. In an embodiment, the size of the transparent portion may be programmable. Based on the non-transparent attribute indicating transparent, the decoder may selectively mask bits of the address based on the size to ensure that the decoder only selects a location in the transparent portion.

公开(公告)号：US09928838B2

公开(公告)日：2018-03-27

申请号：US15482142

申请日：2017-04-07

Applicant: Apple Inc.

Inventor： Manu Gulati ,  Gilbert H. Herbeck ,  Alexei E. Kosut ,  Girault W. Jones ,  Timothy J. Millet

IPC: G10L15/28 ,  G10L19/00 ,  G10L15/22 ,  G10L15/08

CPC classification number: G10L15/28 ,  G10L15/08 ,  G10L15/22 ,  G10L2015/088 ,  G10L2015/223

Abstract: In an embodiment, a system on a chip (SOC) may include one or more central processing units (CPUs), a memory controller, and a circuit configured to remain powered on when the rest of the SOC is powered down. The circuit may be configured to receive audio samples and match those audio samples against a predetermined pattern. The circuit may operate according to a first clock during the time that the rest of the SOC is powered down. In response to detecting the predetermined pattern in the samples, the circuit may cause the memory controller and processors to power up. During the power up process, a second clock having one or more better characteristics than the first clock may become available. The circuit may switch to the second clock while preserving the samples, or losing at most one sample, or no more than a threshold number of samples.

公开(公告)号：US09854246B2

公开(公告)日：2017-12-26

申请号：US14503200

申请日：2014-09-30

Applicant: Apple Inc.

Inventor： Alexandros Tourapis ,  David Singer ,  Guy Cote ,  Timothy J. Millet

IPC: H04N19/154 ,  H04N19/103 ,  H04N19/124 ,  H04N19/176 ,  H04N19/196 ,  H04N19/40

CPC classification number: H04N19/154 ,  H04N19/103 ,  H04N19/124 ,  H04N19/176 ,  H04N19/196 ,  H04N19/40

Abstract: Embodiments of the present invention may provide a video coder. The video coder may include an encoder to perform coding operations on a video signal in a first format to generate coded video data, and a decoder to decode the coded video data. The video coder may also include an inverse format converter to convert the decoded video data to second format that is different than the first format and an estimator to generate a distortion metric using the decoded video data in the second format and the video signal in the second format. The encoder may adjust the coding operations based on the distortion metric.

公开(公告)号：US09811142B2

公开(公告)日：2017-11-07

申请号：US14499807

申请日：2014-09-29

Applicant: Apple Inc.

Inventor： Cyril de la Cropte de Chanterac ,  Manu Gulati ,  Erik P. Machnicki ,  Keith Cox ,  Timothy J. Millet

IPC: G06F1/32

CPC classification number: G06F1/3234 ,  G06F1/3203 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/172

Abstract: Embodiments of a method that allow the adjustment of performance settings of a computing system are disclosed. One or more functional units may include multiple monitor circuits, each of which may be configured to monitor a given operational parameter of a corresponding functional unit. Upon detection of an event related to a monitored operational parameter, a monitor circuit may generate an interrupt. In response to the interrupt a processor may adjust one or more performance settings of the computing system.

公开(公告)号：US20170177256A1

公开(公告)日：2017-06-22

申请号：US15447328

申请日：2017-03-02

Applicant: Apple Inc.

Inventor： Brijesh Tripathi ,  Shane J. Keil ,  Manu Gulati ,  Jung Wook Cho ,  Erik P. Machnicki ,  Gilbert H. Herbeck ,  Timothy J. Millet ,  Joshua P. de Cesare ,  Anand Dalal

IPC: G06F3/06 ,  G06F9/44 ,  G06F13/16 ,  G06F13/42 ,  G11C11/406 ,  G06F13/40

CPC classification number: G06F12/0223 ,  G06F1/3206 ,  G06F1/3287 ,  G06F1/3293 ,  G06F3/0625 ,  G06F3/0632 ,  G06F3/0634 ,  G06F3/0673 ,  G06F9/4406 ,  G06F12/0646 ,  G06F13/1668 ,  G06F13/4068 ,  G06F13/4265 ,  G06F2212/1032 ,  G11C11/40615 ,  Y02D10/122 ,  Y02D10/151 ,  Y02D10/171 ,  Y02D50/20

Abstract: In an embodiment, a system on a chip (SOC) includes a component that remains powered when the remainder of the SOC is powered off. The component may include a sensor capture unit to capture data from various device sensors, and may filter the captured sensor data. Responsive to the filtering, the component may wake up the remainder of the SOC to permit the processing. The component may store programmable configuration data, matching the state at the time the SOC was most recently powered down, for the other components of the SOC, in order to reprogram them after wakeup. In some embodiments, the component may be configured to wake up the memory controller within the SOC and the path to the memory controller, in order to write the data to memory. The remainder of the SOC may remain powered down.

公开(公告)号：US20170141095A1

公开(公告)日：2017-05-18

申请号：US15420594

申请日：2017-01-31

Applicant: Apple Inc.

Inventor： John Bruno ,  Jun Zhai ,  Timothy J. Millet

IPC: H01L25/18 ,  H01L23/367 ,  H01L23/13 ,  H01L23/538

CPC classification number: H01L25/18 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/13124 ,  H01L2224/134 ,  H01L2224/13411 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1427 ,  H01L2924/1432 ,  H01L2924/1436 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/09036 ,  H05K2201/10416 ,  H05K2201/10734 ,  H01L2924/014

Abstract: A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.

公开(公告)号：US09595514B2

公开(公告)日：2017-03-14

申请号：US15087200

申请日：2016-03-31

Applicant: Apple Inc.

Inventor： John Bruno ,  Jun Zhai ,  Timothy J. Millet

IPC: H01L25/18 ,  H01L23/13 ,  H05K1/02 ,  H05K1/14 ,  H01L25/16 ,  H01L23/367 ,  H01L23/538 ,  H05K1/18

CPC classification number: H01L25/18 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/13124 ,  H01L2224/134 ,  H01L2224/13411 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1427 ,  H01L2924/1432 ,  H01L2924/1436 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/09036 ,  H05K2201/10416 ,  H05K2201/10734 ,  H01L2924/014

Abstract: A semiconductor package includes a processor die (e.g., an SoC) and one or more memory die (e.g., DRAM) coupled to a ball grid array (BGA) substrate. The processor die and the memory die are coupled to opposite sides of the BGA substrate using terminals (e.g., solder balls). The package may be coupled to a printed circuit board (PCB) using one or more terminals positioned around the perimeter of the processor die. The PCB may include a recess with at least part of the processor die being positioned in the recess. Positioning at least part of the processor die in the recess reduces the overall height of the semiconductor package assembly. A voltage regulator may also be coupled to the BGA substrate on the same side as the processor die with at least part of the voltage regulator being positioned in the recess a few millimeters from the processor die.

Abstract translation: 半导体封装包括耦合到球栅阵列（BGA）衬底的处理器管芯（例如，SoC）和一个或多个存储器管芯（例如，DRAM）。 使用端子（例如，焊球）将处理器管芯和存储器管芯耦合到BGA衬底的相对侧。 可以使用位于处理器管芯的周边周围的一个或多个端子将封装耦合到印刷电路板（PCB）。 PCB可以包括凹部，其中处理器管芯的至少一部分位于凹部中。 将处理器管芯的至少一部分定位在凹部中减小了半导体封装组件的整体高度。 电压调节器还可以与处理器管芯相同侧的BGA衬底耦合，其中至少一部分电压调节器位于距离处理器管芯几毫米的凹槽中。

公开(公告)号：US20160219220A1

公开(公告)日：2016-07-28

申请号：US15089784

申请日：2016-04-04

Applicant: Apple Inc.

Inventor： D. Amnon Silverstein ,  Shun Wai Go ,  Suk Hwan Lim ,  Timothy J. Millet ,  Ting Chen ,  Bin Ni

IPC: H04N5/232 ,  H04N1/21 ,  H04N9/87 ,  H04N7/01

CPC classification number: H04N5/23245 ,  H04N1/212 ,  H04N5/23216 ,  H04N5/23232 ,  H04N5/23293 ,  H04N7/0122 ,  H04N9/87

Abstract: In an embodiment, an electronic device may be configured to capture still frames during video capture, but may capture the still frames in the 4×3 aspect ratio and at higher resolution than the 16×9 aspect ratio video frames. The device may interleave high resolution, 4×3 frames and lower resolution 16×9 frames in the video sequence, and may capture the nearest higher resolution, 4×3 frame when the user indicates the capture of a still frame. Alternatively, the device may display 16×9 frames in the video sequence, and then expand to 4×3 frames when a shutter button is pressed. The device may capture the still frame and return to the 16×9 video frames responsive to a release of the shutter button.