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38 条记录 (耗时 0.032 秒)

    Electrochemical printhead
    1.
    发明授权
    Electrochemical printhead 失效
    电化学打印头

    公开(公告)号：US4371273A

    公开(公告)日：1983-02-01

    申请号：US225688

    申请日：1981-01-16

    申请人： Arthur H. Kendall ,  Joseph W. Mitchell ,  Carlos J. Sambucetti

    发明人： Arthur H. Kendall ,  Joseph W. Mitchell ,  Carlos J. Sambucetti

    IPC分类号： B41J2/425 ,  B41J2/395 ,  B41J3/12 ,  B41J3/20

    CPC分类号： B41J2/395 ,  Y10T29/49117

    摘要： An electrochromic printhead and a method of construction thereof in which the printhead is fabricated from an array of spaced, precisely positioned, small glass tubes. The array of glass tubes defines an array of cylindrical apertures extending through the printhead to form a printing pattern at a printing surface. Each cylindrical aperture has a conductor therein as an active electrode, which defines one dot of an array or matrix of dots possibly formed by the electrochromic printer. An additional conductor is provided as a reference electrode, such that a voltage may be applied between selected active electrodes and the reference electrode to define a particular printing pattern. Electrode wear is substantially eliminated by applying a coating of rutenium oxide crystals on each active electrode at the printing surface. In one disclosed embodiment, each active electrode is formed by a conductive coating applied along the interior surface of each cylindrical aperture. In a further disclosed embodiment, each active electrode comprises a cylindrical wire positioned within each cylindrical aperture. In yet another embodiment, each active electrode is formed by a conductive filler placed within each cylindrical aperture.

    摘要翻译： 一种电致变色打印头及其构造方法，其中打印头由间隔开的精确定位的小玻璃管阵列制成。 玻璃管阵列限定了延伸穿过打印头的圆柱形孔阵列，以在打印表面上形成印刷图案。 每个圆柱形孔在其中具有作为有效电极的导体，其限定可能由电致变色打印机形成的阵列或阵列的一个点。 提供附加导体作为参考电极，使得可以在选定的有源电极和参考电极之间施加电压以限定特定的印刷图案。 通过在印刷表面的每个有源电极上施加氧化钌晶体的涂层，基本上消除了电极的磨损。 在一个公开的实施例中，每个有源电极由沿着每个圆柱形孔的内表面施加的导电涂层形成。 在进一步公开的实施例中，每个有源电极包括位于每个圆柱形孔内的圆柱形线。 在另一个实施例中，每个有源电极由放置在每个圆柱形孔内的导电填料形成。

    Electrolytic printing process with wear resistant electrode
    2.
    发明授权
    Electrolytic printing process with wear resistant electrode 失效
    电解印刷工艺采用耐磨电极

    公开(公告)号：US4415905A

    公开(公告)日：1983-11-15

    申请号：US465236

    申请日：1983-02-10

    申请人： Joseph W. Mitchell ,  Merrill W. Shafer ,  Carlos J. Sambucetti

    发明人： Joseph W. Mitchell ,  Merrill W. Shafer ,  Carlos J. Sambucetti

    IPC分类号： B41J2/385 ,  B41J2/425 ,  G01D15/06 ,  C25B11/10 ,  C25B11/08

    CPC分类号： G01D15/06 ,  B41J2/3855 ,  B41J2/425

    摘要： The present invention provides a process for electrolytic printing using an improved electrode. The electrode has a region which is an oxide of a metal from the group of ruthenium, iridium, platinum or an alloy thereof. The oxide region is at the extremity of the electrode which during the printing is in close proximity to the printing medium. This oxide region provides an increase in wear resistance of about two orders of magnitude over non-oxidized electrodes. Method for fabricating the described electrode is also set forth.

    摘要翻译： 本发明提供一种使用改进电极的电解印刷方法。 电极具有作为来自钌，铱，铂或其合金的金属的氧化物的区域。 氧化物区域位于电极的末端，在印刷过程中与印刷介质相近。 该氧化物区域在非氧化电极上的耐磨性提高了约两个数量级。 还阐述了制造所述电极的方法。

    Reduced electromigration and stressed induced migration of copper wires by surface coating
    3.
    发明授权
    Reduced electromigration and stressed induced migration of copper wires by surface coating 有权
    通过表面涂层减少电迁移和应力诱导的铜线迁移

    公开(公告)号：US07468320B2

    公开(公告)日：2008-12-23

    申请号：US11183773

    申请日：2005-07-19

    申请人： Chao-Kun Hu ,  Robert Rosenberg ,  Judith M. Rubino ,  Carlos J. Sambucetti ,  Anthony K. Stamper

    发明人： Chao-Kun Hu ,  Robert Rosenberg ,  Judith M. Rubino ,  Carlos J. Sambucetti ,  Anthony K. Stamper

    IPC分类号： H01L21/44

    CPC分类号： H01L21/76843 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76864 ,  H01L23/53228 ,  H01L23/53238 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The idea of the invention is to coat the free surface of patterned Cu conducting lines in on-chip interconnections (BEOL) wiring by a 1-20 nm thick metal layer prior to deposition of the interlevel dielectric. This coating is sufficiently thin so as to obviate the need for additional planarization by polishing, while providing protection against oxidation and surface, or interface, diffusion of Cu which has been identified by the inventors as the leading contributor to metal line failure by electromigration and thermal stress voiding. Also, the metal layer increases the adhesion strength between the Cu and dielectric so as to further increase lifetime and facilitate process yield. The free surface is a direct result of the CMP (chemical mechanical polishing) in a damascene process or in a dry etching process by which Cu wiring is patterned. It is proposed that the metal capping layer be deposited by a selective process onto the Cu to minimize further processing. We have used electroless metal coatings, such as CoWP, CoSnP and Pd, to illustrate significant reliability benefits, although chemical vapor deposition (CVD) of metals or metal forming compounds can be employed.

    摘要翻译： 本发明的想法是在沉积层间电介质之前，通过1-20nm厚的金属层将芯片上互连（BEOL）布线中的图案化Cu导线的自由表面涂覆。 该涂层足够薄，以便消除对通过抛光进行附加平面化的需要，同时提供了防止氧化和表面或Cu的扩散的保护，这已经被本发明人鉴定为导致金属线路故障的主要贡献者通过电迁移和热 压力消除。 此外，金属层增加了Cu和电介质之间的粘合强度，从而进一步增加寿命并且有助于工艺产量。 自由表面是在镶嵌工艺中的CMP（化学机械抛光）或通过图形化Cu布线的干蚀刻工艺的直接结果。 提出通过选择性方法将金属覆盖层沉积到Cu上以最小化进一步的加工。 尽管可以使用金属或金属形成化合物的化学气相沉积（CVD），但我们已经使用了无电金属涂层，例如CoWP，CoSnP和Pd来说明显着的可靠性优点。

    Electroless metal adhesion to organic dielectric material with phase separated morphology
    6.
    发明授权
    Electroless metal adhesion to organic dielectric material with phase separated morphology 失效
    无机金属与相分离形态的有机介电材料粘合

    公开(公告)号：US5310580A

    公开(公告)日：1994-05-10

    申请号：US874665

    申请日：1992-04-27

    申请人： Eugene J. O'Sullivan ,  Terrence R. O'Toole ,  Judith M. Roldan ,  Lubomyr T. Romankiw ,  Carlos J. Sambucetti ,  Ravi Saraf

    发明人： Eugene J. O'Sullivan ,  Terrence R. O'Toole ,  Judith M. Roldan ,  Lubomyr T. Romankiw ,  Carlos J. Sambucetti ,  Ravi Saraf

    IPC分类号： B05D1/34 ,  C23C18/20 ,  H05K3/18 ,  H05K3/38 ,  B05D2/06

    CPC分类号： H05K3/387 ,  B05D1/34 ,  C23C18/20 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/24 ,  C23C18/30 ,  H05K2201/0154 ,  H05K2201/0212 ,  H05K2203/0759 ,  H05K2203/0773 ,  H05K2203/0793 ,  H05K3/181 ,  H05K3/381

    摘要： Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases. Upon curing the precursors there is surface roughening as a result of phase separation. Upon exposure to alkaline solution there is etching of one of the polymer phases at a faster rate and simultaneous opening of the seeding colloid. The rough surface is overcoated with a photoresist, exposed and developed. Subsequent electroless metal deposition results in improved metal to dielectric layer adhesion. The method is applicable to selective deposition of electroless copper onto a polyimide layer.

    摘要翻译： 沉积在具有相分离形态的有机电介质层上的化学金属的改善的粘附通过自发形成形态和形貌上粗糙的表面来实现。 在一个实施方案中，可以将不同顺序的两相分离的相同聚合物的极性溶剂和两种聚合物前体的三元溶液在基材上成膜并加热形成不同阶数的两相以自发产生粗糙表面。 在暴露于碱性溶液时，以比另一相更快的速率蚀刻一相。 在粗糙表面上的金属的接种和无电沉积导致金属对电介质层的附着力提高。 在第二个实施方案中，将极性溶剂，接种剂，可以在两相中分离的相同聚合物的两种聚合物前体的四元溶液浇铸在基材上的薄膜中，并加热形成三相。 固化前体由于相分离而导致表面粗糙化。 暴露在碱性溶液中时，以更快的速率蚀刻聚合物相之一并同时打开接种胶体。 粗糙表面用光致抗蚀剂涂覆，曝光和显影。 随后的无电金属沉积导致金属与电介质层粘附性的改善。 该方法适用于将化学镀铜选择性沉积到聚酰亚胺层上。

    Depositing a conductive metal onto a substrate
    7.
    发明授权
    Depositing a conductive metal onto a substrate 失效
    将导电金属沉积到基底上

    公开(公告)号：US5509557A

    公开(公告)日：1996-04-23

    申请号：US184930

    申请日：1994-01-24

    申请人： Lisa J. Jimarez ,  William H. Lawrence ,  Voya R. Markovich ,  Robert J. Owen ,  Carlos J. Sambucetti

    发明人： Lisa J. Jimarez ,  William H. Lawrence ,  Voya R. Markovich ,  Robert J. Owen ,  Carlos J. Sambucetti

    IPC分类号： C23C18/28 ,  C23C18/22 ,  C23C18/31 ,  H05K3/18 ,  H05K3/38 ,  B05D3/04 ,  C23F1/00

    CPC分类号： H05K3/38 ,  C23C18/22 ,  H05K3/381 ,  H05K2203/1105 ,  H05K2203/1152 ,  H05K3/181

    摘要： A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters:R.sub.a =0.05-0.08 mil,R.sub.max =0.20-0.55 mil,S.sub.m =1.00-3.00 mil,R.sub.p =0.20-0.35 mil, andsurface area=0.90-1.20 square milswherein R.sub.a is the average roughness and the arithmetic mean of the departures from horizontal mean line profile;R.sub.max is the maximum peak-to-valley height;S.sub.m is the mean spacing between high spots at the mean line;R.sub.p is the maximum profile height from the mean line; andsurface area is the area under the surface profile from each measurement using a Talysurf S-120 profilometer;The sheet is laminated to the dielectric substrate surface by pressing the roughened surface of the metal sheet against the surface of the substrate and then removed from the substrate. The substrate surface is seeded to render it active for electroless plating thereon; and then a metal from an electroless plating bath is plated thereon.In another method, the dielectric substrate is seeded to render it active for electroless plating thereon. A metal is then plated thereon from an electroless plating bath. The plated metal is subjected to temperature of at least about 100 .degree. C. for a time sufficient to increase the adhesion of the metal to the substrate.

    摘要翻译： 提供了一种在电介质基片上沉积导电金属的方法。 该方法包括获得具有以下参数的粗糙表面的金属片：Ra = 0.05-0.08密耳，Rmax = 0.20-0.55密耳，Sm = 1.00-3.00密耳，Rp = 0.20-0.35密耳，表面积= 0.90 -1.20平方米，其中Ra是平均粗糙度和离开水平平均线轮廓的算术平均值; Rmax是最大峰谷高度; Sm是平均线高点之间的平均间距; Rp是距平均线的最大轮廓高度; 表面积是使用Talysurf S-120轮廓仪进行每次测量的表面轮廓下面积; 通过将金属片的粗糙表面压在衬底的表面上，然后从衬底上去除，将片层压到电介质衬底表面上。 将基材表面接种以使其活性以在其上进行无电镀; 然后将来自化学镀浴的金属镀在其上。 在另一种方法中，将电介质基底接种以使其在其上进行无电镀。 然后将金属从化学镀浴镀在其上。 将电镀金属经受至少约100℃的温度足以增加金属与基底的粘合力的时间。