公开(公告)号：US20120286429A1

公开(公告)日：2012-11-15

申请号：US13469754

申请日：2012-05-11

申请人： Byung Joon Han ,  Il Kwon Shim ,  Won Kyoung Choi

发明人： Byung Joon Han ,  Il Kwon Shim ,  Won Kyoung Choi

IPC分类号： H01L23/498 ,  H01L21/78

CPC分类号： H01L21/6836 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/481 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68381 ,  H01L2223/5446 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81903 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/83851 ,  H01L2224/05552 ,  H01L2224/81805

摘要： A semiconductor device comprises a carrier including an adhesive disposed over the carrier. The semiconductor device further comprises a semiconductor wafer including a plurality of semiconductor die separated by a non-active region. A plurality of bumps is formed over the semiconductor die. The semiconductor wafer is mounted to the carrier with the adhesive disposed around the plurality of bumps. Irradiated energy is applied to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. The semiconductor wafer is singulated along the modified region by applying stress to the semiconductor wafer. The adhesive is removed from around the plurality of bumps after singulating the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die comprising through silicon vias. The modified region optionally includes a plurality of vertically stacked modified regions.

摘要翻译： 半导体器件包括载体，载体包括设置在载体上的粘合剂。 半导体器件还包括半导体晶片，其包括由非有源区分隔的多个半导体管芯。 在半导体管芯上形成多个凸点。 半导体晶片被安装到载体上，粘合剂设置在多个凸起周围。 照射能量被施加到非有源区域以在非活性区域内形成修饰区域。 半导体晶片沿着改质区域分割成半导体管芯。 通过向半导体晶片施加应力，沿着改质区域将半导体晶片分离。 在分离半导体晶片之后，从多个凸起周围除去粘合剂。 半导体晶片包括通过硅通孔的多个半导体管芯。 修改区域可选地包括多个垂直堆叠的改性区域。

公开(公告)号：US09559004B2

公开(公告)日：2017-01-31

申请号：US13469754

申请日：2012-05-11

申请人： Byung Joon Han ,  Il Kwon Shim ,  Won Kyoung Choi

发明人： Byung Joon Han ,  Il Kwon Shim ,  Won Kyoung Choi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/78 ,  H01L21/683 ,  H01L23/00

CPC分类号： H01L21/6836 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/481 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68381 ,  H01L2223/5446 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81903 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/83851 ,  H01L2224/05552 ,  H01L2224/81805

摘要： A semiconductor device comprises a carrier including an adhesive disposed over the carrier. The semiconductor device further comprises a semiconductor wafer including a plurality of semiconductor die separated by a non-active region. A plurality of bumps is formed over the semiconductor die. The semiconductor wafer is mounted to the carrier with the adhesive disposed around the plurality of bumps. Irradiated energy is applied to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. The semiconductor wafer is singulated along the modified region by applying stress to the semiconductor wafer. The adhesive is removed from around the plurality of bumps after singulating the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die comprising through silicon vias. The modified region optionally includes a plurality of vertically stacked modified regions.

摘要翻译： 半导体器件包括载体，载体包括设置在载体上的粘合剂。 半导体器件还包括半导体晶片，其包括由非有源区分隔的多个半导体管芯。 在半导体管芯上形成多个凸点。 半导体晶片被安装到载体上，粘合剂设置在多个凸起周围。 照射能量被施加到非有源区域以在非活性区域内形成修饰区域。 半导体晶片沿着改质区域分割成半导体管芯。 通过向半导体晶片施加应力，沿着改质区域将半导体晶片分离。 在分离半导体晶片之后，从多个凸起周围除去粘合剂。 半导体晶片包括通过硅通孔的多个半导体管芯。 修改区域可选地包括多个垂直堆叠的改性区域。

公开(公告)号：US20130069252A1

公开(公告)日：2013-03-21

申请号：US13545887

申请日：2012-07-10

申请人： Byung Joon Han ,  Il Kwon Shim ,  Heap Hoe Kuan

发明人： Byung Joon Han ,  Il Kwon Shim ,  Heap Hoe Kuan

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L31/0203 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14698 ,  H01L31/02005 ,  H01L31/1876 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/96 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K1/185 ,  H05K3/4038 ,  H05K2203/1461 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device has a first semiconductor die including an active region formed on a surface of the first semiconductor die. The active region of the first semiconductor die can include a sensor. An encapsulant is deposited over the first semiconductor die. A conductive layer is formed over the encapsulant and first semiconductor die. An insulating layer can be formed over the first semiconductor die. An opening is formed in the insulating layer over the active region. A transmissive layer is formed over the first semiconductor die including the active region. The transmissive layer includes an optical dielectric material or an optical transparent or translucent material. The active region is responsive to an external stimulus passing through the transmissive layer. A plurality of bumps is formed through the encapsulant and electrically connected to the conductive layer. A second semiconductor die is disposed adjacent to the first semiconductor die.

摘要翻译： 半导体器件具有包括形成在第一半导体管芯的表面上的有源区的第一半导体管芯。 第一半导体管芯的有源区域可以包括传感器。 密封剂沉积在第一半导体管芯上。 在密封剂和第一半导体管芯之上形成导电层。 可以在第一半导体管芯上形成绝缘层。 在有源区域上的绝缘层中形成开口。 在包括有源区的第一半导体管芯之上形成透射层。 透射层包括光介电材料或光学透明或半透明材料。 有源区域响应穿过透射层的外部刺激。 通过密封剂形成多个凸块并与导电层电连接。 第二半导体管芯被设置成与第一半导体管芯相邻。

公开(公告)号：US08050047B2

公开(公告)日：2011-11-01

申请号：US12136002

申请日：2008-06-09

申请人： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna

发明人： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna

IPC分类号： H05K1/16 ,  H05K1/00 ,  H01L23/02

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

摘要翻译： 集成电路封装系统包括：提供具有折叠的柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的凹入封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。

公开(公告)号：US20090016033A1

公开(公告)日：2009-01-15

申请号：US12136007

申请日：2008-06-09

申请人： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna

发明人： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna

IPC分类号： H05K1/18

CPC分类号： H05K1/189 ,  H01L23/49816 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/141 ,  H05K1/147 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2203/1316 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099

摘要： An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

摘要翻译： 集成电路封装系统包括：提供柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的堆叠封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。

公开(公告)号：US20080157325A1

公开(公告)日：2008-07-03

申请号：US11670714

申请日：2007-02-02

申请人： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han

发明人： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L23/50 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer on a side opposite the base die.

摘要翻译： 一种集成电路封装系统，包括基底基板，在基底基板上安装基底裸片，将具有中介层电路器件的集成插入件安装在基底裸片上，并在一侧上形成具有密封腔的封装系统密封剂 与基座相对。

公开(公告)号：US07372141B2

公开(公告)日：2008-05-13

申请号：US11395529

申请日：2006-03-31

申请人： Marcos Karnezos ,  Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna ,  Seng Guan Chow

发明人： Marcos Karnezos ,  Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna ,  Seng Guan Chow

IPC分类号： H01L23/02 ,  H01L21/00 ,  H05K1/14

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85013 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One package is inverted in relation to the other, that is, the die attach sides of the package substrates face one another, and the “land” sides of the substrates face away from one another. Z-interconnection of the packages is by wire bonds connecting the first and second package substrates. The assembly is encapsulated in such a way that both the second package substrate (one side of the assembly) and a portion of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made. One or more additional components may be stacked over the land side of the first package substrate.

摘要翻译： 堆叠的封装组件包括第一和第二堆叠封装，每个封装具有至少一个管芯，该裸管固定到封装衬底的管芯附着侧并与其电连接。 一个封装相对于另一个封装反转，即，封装基板的管芯附接面彼此面对，并且基板的“焊盘”侧面彼此背离。 封装的Z-互连是通过连接第一和第二封装衬底的引线键合。 组件以这样的方式封装，使得第二封装衬底（组件的一侧）和第一封装衬底的一部分（在组件的相对侧）被暴露，使得第二级互连和互连 可以制造组件。 一个或多个附加部件可以堆叠在第一封装基板的接地侧上。

公开(公告)号：US20070187826A1

公开(公告)日：2007-08-16

申请号：US11307615

申请日：2006-02-14

申请人： Il Kwon Shim ,  Byung Joon Han ,  Seng Guan Chow

发明人： Il Kwon Shim ,  Byung Joon Han ,  Seng Guan Chow

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a lower package, the lower package having the ball grid array package and the substrate encapsulated by a molding compound and attaching a second integrated circuit package over the lower package.

摘要翻译： 本发明提供了一种用于3D封装堆叠系统的系统，包括提供衬底，将反向位置的球栅阵列封装连接到衬底，形成下封装，下封装具有球栅阵列封装和衬底 通过模制化合物封装并且将下一个封装上的第二集成电路封装。

公开(公告)号：US06861288B2

公开(公告)日：2005-03-01

申请号：US10676736

申请日：2003-09-30

申请人： Il Kwon Shim ,  Kambhampati Ramakrishna ,  Seng Guan Chow ,  Byung Joon Han

发明人： Il Kwon Shim ,  Kambhampati Ramakrishna ,  Seng Guan Chow ,  Byung Joon Han

IPC分类号： H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method for fabricating a stacked semiconductor package includes providing a substrate and mounting a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is then mounted on the interposer.

摘要翻译： 一种用于制造堆叠半导体封装的方法，包括提供衬底并将第一半导体器件安装在衬底上。 插入器被支撑在与衬底相对的第一半导体器件的上方。 插入器电连接到基板。 然后将第二半导体器件安装在插入器上。

公开(公告)号：US06489667B1

公开(公告)日：2002-12-03

申请号：US09422115

申请日：1999-10-20

申请人： Il Kwon Shim ,  Chang Kyu Park ,  Byung Joon Han ,  Vincent DiCaprio ,  Paul Hoffman

发明人： Il Kwon Shim ,  Chang Kyu Park ,  Byung Joon Han ,  Vincent DiCaprio ,  Paul Hoffman

IPC分类号： H01L23495

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48739 ,  H01L2224/73215 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48744

摘要： Semiconductor devices and methods of manufacturing such devices are disclosed. In one embodiment of this invention, a semiconductor chip is bonded to a first surface of a substrate. The substrate extends beyond the edge of the chip. Signal input/output pads on the chip are juxtaposed with an opening in the substrate. A molded support is formed on the portion of the first surface of the substrate that extends beyond between the sidewall of the edge of the chip. The support prevents bending of the substrate, and allows solder balls to be formed on the entire area of a second surface of the substrate opposite the first surface of the substrate. A heat dissipating plate is mounted on a surface of the chip opposite the substrate. The heat dissipating plate is attached to the support.

摘要翻译： 公开了半导体器件及其制造方法。 在本发明的一个实施例中，半导体芯片被接合到基板的第一表面。 衬底延伸超过芯片的边缘。 芯片上的信号输入/输出焊盘与衬底中的开口并置。 在衬底的第一表面的延伸超过芯片边缘的侧壁的部分之间形成模制支撑件。 支撑件防止基板的弯曲，并且允许在与基板的第一表面相对的基板的第二表面的整个区域上形成焊球。 散热板安装在与基板相对的芯片的表面上。 散热板附着在支架上。