公开(公告)号：US08264846B2

公开(公告)日：2012-09-11

申请号：US11611063

申请日：2006-12-14

申请人： Christopher C. Jones ,  David Bach ,  Timothe Litt ,  Larry Binder ,  Kaladhar Radhakrishnan ,  Cengiz A. Palanduz

发明人： Christopher C. Jones ,  David Bach ,  Timothe Litt ,  Larry Binder ,  Kaladhar Radhakrishnan ,  Cengiz A. Palanduz

IPC分类号： H05K7/00

CPC分类号： H05K1/0231 ,  H01L25/0655 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/145 ,  H05K1/183 ,  H05K2201/10515 ,  H05K2201/10712 ,  H05K2201/10734

摘要： A ceramic package substrate has a recess. This allows a device in that recess to be close to a die attached to the substrate's top side, for better performance. The device may be an array capacitor, an in-silicon voltage regulator, or another device or devices.

摘要翻译： 陶瓷封装基板具有凹部。 这使得该凹部中的器件靠近附接到衬底顶侧的管芯，以获得更好的性能。 该器件可以是阵列电容器，硅内电压调节器或其它器件。

公开(公告)号：US20080142961A1

公开(公告)日：2008-06-19

申请号：US11611063

申请日：2006-12-14

申请人： Christopher C. Jones ,  David Bach ,  Timothe Litt ,  Larry Binder ,  Kaladhar Radhakrishnan ,  Cengiz A. Palanduz

发明人： Christopher C. Jones ,  David Bach ,  Timothe Litt ,  Larry Binder ,  Kaladhar Radhakrishnan ,  Cengiz A. Palanduz

IPC分类号： H01L23/34

CPC分类号： H05K1/0231 ,  H01L25/0655 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/145 ,  H05K1/183 ,  H05K2201/10515 ,  H05K2201/10712 ,  H05K2201/10734

摘要： A ceramic package substrate has a recess. This allows a device in that recess to be close to a die attached to the substrate's top side, for better performance. The device may be an array capacitor, an in-silicon voltage regulator, or another device or devices.

摘要翻译： 陶瓷封装基板具有凹部。 这使得该凹部中的器件靠近附接到衬底顶侧的管芯，以获得更好的性能。 该器件可以是阵列电容器，硅内电压调节器或其它器件。

公开(公告)号：US20080157274A1

公开(公告)日：2008-07-03

申请号：US11648301

申请日：2006-12-29

申请人： Sriram Dattaguru ,  Larry Binder ,  Cengiz A. Palanduz ,  Chris Jones ,  Dave Bach ,  Kaladhar Radhakrishnan ,  Timothe Litt

发明人： Sriram Dattaguru ,  Larry Binder ,  Cengiz A. Palanduz ,  Chris Jones ,  Dave Bach ,  Kaladhar Radhakrishnan ,  Timothe Litt

IPC分类号： H01L29/00

CPC分类号： H01L23/49827 ,  H01L23/13 ,  H01L23/50 ,  H01L23/642 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15787 ,  H05K1/0231 ,  H05K1/0262 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2924/00 ,  H01L2224/0401

摘要： In some embodiments, an individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor is presented. In this regard, an apparatus is introduced having a table-shaped ceramic interposer containing conductive traces, a silicon voltage regulator coupled with contacts on a first surface of the ceramic interposer, and an array capacitor coupled with contacts on a second surface of the ceramic interposer. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，呈现包含陶瓷插入件，硅电压调节器和阵列电容器的单独子组件。 在这方面，引入了具有包含导电迹线的台式陶瓷插入器的装置，与陶瓷插入器的第一表面上的触点耦合的硅电压调节器，以及与陶瓷插入器的第二表面上的触点耦合的阵列电容器 。 还公开并要求保护其他实施例。

公开(公告)号：US20080157343A1

公开(公告)日：2008-07-03

申请号：US11648220

申请日：2006-12-29

申请人： Sriram Dattaguru ,  Larry Binder ,  Cengiz A. Palanduz ,  Chris Jones ,  Dave Bach ,  Kaladhar Radhakrishnan ,  Timothe Litt

发明人： Sriram Dattaguru ,  Larry Binder ,  Cengiz A. Palanduz ,  Chris Jones ,  Dave Bach ,  Kaladhar Radhakrishnan ,  Timothe Litt

IPC分类号： H01L23/13

CPC分类号： H05K1/0262 ,  H01L23/642 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19106 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2224/0401

摘要： In some embodiments, a ceramic interposer with silicon voltage regulator and array capacitor combination for integrated circuit packages is presented. In this regard, an apparatus is introduced having a bowl-shaped ceramic interposer containing conductive traces, one or more silicon voltage regulator(s) coupled with contacts on a first surface of the ceramic interposer, and one or more array capacitor(s) coupled with contacts on a second surface of the ceramic interposer. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，提供了具有用于集成电路封装的硅电压调节器和阵列电容器组合的陶瓷插入器。 在这方面，引入了一种装置，其具有包含导电迹线的碗形陶瓷插入器，与陶瓷插入件的第一表面上的触点耦合的一个或多个硅电压调节器，以及一个或多个耦合的阵列电容器 在陶瓷插入件的第二表面上具有触点。 还公开并要求保护其他实施例。

公开(公告)号：US07675160B2

公开(公告)日：2010-03-09

申请号：US11648301

申请日：2006-12-29

申请人： Sriram Dattaguru ,  Larry Binder ,  Cengiz A. Palanduz ,  Chris Jones ,  Dave Bach ,  Kaladhar Radhakrishnan ,  Timothe Litt

发明人： Sriram Dattaguru ,  Larry Binder ,  Cengiz A. Palanduz ,  Chris Jones ,  Dave Bach ,  Kaladhar Radhakrishnan ,  Timothe Litt

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/13 ,  H01L23/50 ,  H01L23/642 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15787 ,  H05K1/0231 ,  H05K1/0262 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2924/00 ,  H01L2224/0401

摘要： In some embodiments, an individual sub-assembly containing a ceramic interposer, silicon voltage regulator, and array capacitor is presented. In this regard, an apparatus is introduced having a table-shaped ceramic interposer containing conductive traces, a silicon voltage regulator coupled with contacts on a first surface of the ceramic interposer, and an array capacitor coupled with contacts on a second surface of the ceramic interposer. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，呈现包含陶瓷插入件，硅电压调节器和阵列电容器的单独子组件。 在这方面，引入了具有包含导电迹线的台式陶瓷插入器的装置，与陶瓷插入器的第一表面上的触点耦合的硅电压调节器，以及与陶瓷插入器的第二表面上的触点耦合的阵列电容器 。 还公开并要求保护其他实施例。

公开(公告)号：US07372126B2

公开(公告)日：2008-05-13

申请号：US11096235

申请日：2005-03-31

申请人： John S. Guzek ,  Cengiz A. Palanduz ,  Victor Prokofiev

发明人： John S. Guzek ,  Cengiz A. Palanduz ,  Victor Prokofiev

IPC分类号： H01L29/00

CPC分类号： H01L23/49822 ,  H01G4/236 ,  H01G4/33 ,  H01L21/4857 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/15312 ,  H05K1/162 ,  H05K2201/09309 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09718 ,  Y10T29/435 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.

摘要翻译： 薄膜电容器组件包括通过深和浅通孔访问的两个板。 薄膜电容器组件能够与间隔件和插入件耦合。 薄膜电容器组件也能够与多个薄膜电容器组件堆叠。 薄膜电容器组件也是计算系统的一部分。

公开(公告)号：US07099139B2

公开(公告)日：2006-08-29

申请号：US10803789

申请日：2004-03-17

申请人： Cengiz A. Palanduz ,  Larry E. Mosley

发明人： Cengiz A. Palanduz ,  Larry E. Mosley

IPC分类号： H01G4/228

CPC分类号： H05K1/162 ,  H01L23/49822 ,  H01L23/642 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09309 ,  H01L2224/05599

摘要： A base structure is formed from a green material having first and second opposing sides and having a plurality of via openings therein. The green material is then sintered so that the green material becomes a sintered ceramic material and the base structure becomes a sintered ceramic base structure having the via openings. A conductive via is formed in each via opening of the sintered ceramic base structure. First and second capacitor structures are formed on the sintered ceramic base structure, each on a respective side of the sintered ceramic base structure. The power and ground planes of the capacitor structure are connected to the vias. As such, a capacitor structure can be formed and connected to the vias without the need to drill via openings in brittle substrates such as silicon substrates. Capacitor structures on opposing sides provide more capacitance without manufacturing complexities associated with the manufacture of one capacitor structure having a large number of power and ground planes.

摘要翻译： 基部结构由具有第一和第二相对侧并且其中具有多个通孔的绿色材料形成。 然后将生坯材料烧结，使得生坯成为烧结陶瓷材料，并且基体结构变成具有通路孔的烧结陶瓷基体结构。 导电通孔形成在烧结陶瓷基体结构的每个通孔中。 第一和第二电容器结构形成在烧结陶瓷基体结构上，每个在烧结陶瓷基体结构的相应侧上。 电容器结构的电源和接地平面连接到通孔。 因此，可以形成电容器结构并连接到通孔，而不需要在诸如硅衬底的脆性衬底中钻通孔。 相对侧的电容器结构提供更多的电容，而不需要制造与具有大量电源和接地层的一个电容器结构相关联的复杂性。

公开(公告)号：US07095108B2

公开(公告)日：2006-08-22

申请号：US10838956

申请日：2004-05-05

申请人： Cengiz A. Palanduz

发明人： Cengiz A. Palanduz

IPC分类号： H01L23/12

CPC分类号： H01L24/81 ,  H01L21/4807 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A chip package is made with the ring or dish interposer and an embedded array capacitor. A computing system is also disclosed that includes the ring or dish interposer and the embedded array capacitor.

摘要翻译： 芯片封装是用环形或碟形插入器和嵌入式阵列电容器制成的。 还公开了一种计算系统，其包括环或碟插入件和嵌入式阵列电容器。

公开(公告)号：US08499426B2

公开(公告)日：2013-08-06

申请号：US12168352

申请日：2008-07-07

申请人： Cengiz A. Palanduz

发明人： Cengiz A. Palanduz

IPC分类号： H01G7/00

CPC分类号： H05K1/162 ,  H01G4/1209 ,  H01G4/20 ,  H01G4/33 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0326 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49155 ,  H01L2924/00

摘要： An apparatus including a first electrode; a second electrode; a first and second ceramic material disposed between the first electrode and the second electrode, the second ceramic material having a greater electrical conductivity than the first ceramic material. A method including forming a first ceramic material film and a different second ceramic material film on a first electrode; and forming a second electrode on the second ceramic material film to form a capacitor structure having the first ceramic material film and the second ceramic material film disposed between the first electrode and the second electrode, wherein the first ceramic material has a conductivity selected to dampen undesired oscillations in electrical device operation to which the capacitor structure may be exposed. An apparatus including a first electrode; a second electrode; and a composite dielectric including a plurality of dielectric films including a different Curie temperature.

摘要翻译： 一种装置，包括：第一电极; 第二电极; 设置在所述第一电极和所述第二电极之间的第一和第二陶瓷材料，所述第二陶瓷材料具有比所述第一陶瓷材料更大的导电性。 一种包括在第一电极上形成第一陶瓷材料膜和不同的第二陶瓷材料膜的方法; 以及在所述第二陶瓷材料膜上形成第二电极以形成具有所述第一陶瓷材料膜并且所述第二陶瓷材料膜设置在所述第一电极和所述第二电极之间的电容器结构，其中所述第一陶瓷材料具有选择的电导率， 可能会暴露电容器结构的电气设备操作中的振荡。 一种装置，包括：第一电极; 第二电极; 以及包括具有不同居里温度的多个介电膜的复合电介质。

公开(公告)号：US07656644B2

公开(公告)日：2010-02-02

申请号：US11972579

申请日：2008-01-10

申请人： Cengiz A. Palanduz ,  Dustin P. Wood

发明人： Cengiz A. Palanduz ,  Dustin P. Wood

IPC分类号： H01G4/228

CPC分类号： H05K1/162 ,  H01G4/1209 ,  H01G4/20 ,  H01G4/33 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K1/097 ,  H05K3/4629 ,  H05K3/4641 ,  H05K2201/0175 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2201/09309 ,  H05K2201/0969 ,  H05K2201/10015 ,  H05K2201/10545 ,  Y10T29/435

摘要： A method including depositing a suspension of a colloid having an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of a substrate; and thermally treating the plurality of nano-particles to form a thin film. A system including a computing device having a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate having at least one capacitor structure formed on a surface, the capacitor structure having a first electrode, a second electrode, and a ceramic material disposed between the first electrode and the second electrode, wherein the ceramic material has columnar grains.

摘要翻译： 一种方法，包括在衬底上沉积具有一定量的陶瓷材料的纳米颗粒的胶体的悬浮液; 并对悬浮液进行热处理以形成薄膜。 一种方法，包括将陶瓷材料的多个纳米颗粒沉积在衬底的表面上的预定位置; 并对多个纳米颗粒进行热处理以形成薄膜。 一种包括具有微处理器的计算设备的系统，所述微处理器通过衬底耦合到印刷电路板，所述衬底具有形成在表面上的至少一个电容器结构，所述电容器结构具有第一电极，第二电极和陶瓷 设置在第一电极和第二电极之间的材料，其中陶瓷材料具有柱状晶粒。