公开(公告)号：US10163744B2

公开(公告)日：2018-12-25

申请号：US13226767

申请日：2011-09-07

申请人： OhHan Kim ,  WonJun Ko ,  DaeSik Choi

发明人： OhHan Kim ,  WonJun Ko ,  DaeSik Choi

IPC分类号： H01L23/14 ,  H01L23/00 ,  H01L25/065 ,  H01L23/495 ,  H01L21/56 ,  H01L23/552 ,  H01L23/31 ,  H01L25/10 ,  H01L23/13 ,  H01L23/367 ,  H01L23/36 ,  H01L23/498

摘要： A semiconductor device has a substrate including a recess and a peripheral portion with through conductive vias. A first semiconductor die is mounted over the substrate and within the recess. A planar heat spreader is mounted over the substrate and over the first semiconductor die. The planar heat spreader has openings around a center portion of the planar heat spreader and aligned over the peripheral portion of the substrate. A second semiconductor die is mounted over the center portion of the planar heat spreader. A third semiconductor die is mounted over the second semiconductor die. First and second pluralities of bond wires extend from the second and third semiconductor die, respectively, through the openings in the planar heat spreader to electrically connect to the through conductive vias. An encapsulant is deposited over the substrate and around the planar heat spreader.

公开(公告)号：US09401289B2

公开(公告)日：2016-07-26

申请号：US13488029

申请日：2012-06-04

申请人： MinJung Kim ,  KyungHoon Lee ,  JoungIn Yang ,  WonIl Kwon ,  DaeSik Choi

发明人： MinJung Kim ,  KyungHoon Lee ,  JoungIn Yang ,  WonIl Kwon ,  DaeSik Choi

IPC分类号： H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L21/683

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3171 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device has a semiconductor wafer with an interconnect structure formed over a first surface of the wafer. A trench is formed in a non-active area of the semiconductor wafer from the first surface partially through the semiconductor wafer. A protective coating is formed over the first surface and into the trench. A lamination tape is applied over the protective coating. A portion of a second surface of the semiconductor wafer is removed by backgrinding or wafer thinning to expose the protecting coating in the trench. A die attach film is applied over the second surface of the semiconductor wafer. A cut or modified region is formed in the die attach film under the trench using a laser. The semiconductor wafer is expanded to separate the cut or modified region of the die attach film and singulate the semiconductor wafer.

摘要翻译： 半导体器件具有形成在晶片的第一表面上的互连结构的半导体晶片。 在半导体晶片的非有源区域中，部分地通过半导体晶片从第一表面形成沟槽。 在第一表面和沟槽中形成保护涂层。 在保护涂层上涂覆层压胶带。 半导体晶片的第二表面的一部分通过背面研磨或晶片变薄去除以暴露沟槽中的保护涂层。 将芯片附着膜施加在半导体晶片的第二表面上。 使用激光在沟槽下的管芯附着膜中形成切割或改性区域。 半导体晶片被扩展以分离芯片附着膜的切割或改性区域并使半导体晶片分离。

公开(公告)号：US09082887B1

公开(公告)日：2015-07-14

申请号：US13966259

申请日：2013-08-13

申请人： DaeSik Choi ,  Taewoo Lee ,  KyuWon Lee ,  SungWon Cho

发明人： DaeSik Choi ,  Taewoo Lee ,  KyuWon Lee ,  SungWon Cho

IPC分类号： H01L23/50 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L24/94 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/50 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81805 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05147

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a semiconductor wafer having a chip pad; attaching a wafer frame to the semiconductor wafer, the wafer frame having a horizontal cover integral to a protruding connector with the protruding connector on the chip pad; forming an underfill around the protruding connector and between the horizontal cover and the semiconductor wafer; removing the horizontal cover exposing the underfill and the protruding connector; and singulating an integrated circuit package from the semiconductor wafer.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有芯片焊盘的半导体晶片; 将晶片框架附接到半导体晶片，晶片框架具有与突出连接器成一体的水平盖，突出连接器在芯片垫上; 在所述突出连接器周围和所述水平盖和所述半导体晶片之间形成底部填充物; 移除露出底部填充物和突出连接器的水平盖; 以及从半导体晶片分离集成电路封装。

公开(公告)号：US09059108B2

公开(公告)日：2015-06-16

申请号：US13407554

申请日：2012-02-28

申请人： DaeSik Choi ,  JoonYoung Choi ,  YongHyuk Jeong

发明人： DaeSik Choi ,  JoonYoung Choi ,  YongHyuk Jeong

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a base integrated circuit over the base substrate; attaching a lead to the base integrated circuit and the base substrate, the lead having a lead attachment portion over the base integrated circuit; and forming a base encapsulation over the lead, the base encapsulation having a cavity exposing the lead attachment portion.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 在基底基板上安装基底集成电路; 将引线附接到基底集成电路和基底基板，所述引线在所述基底集成电路上方具有引线附接部分; 以及在所述引线上形成基底封装，所述基底封装具有暴露所述引线附着部分的空腔。

公开(公告)号：US08685797B2

公开(公告)日：2014-04-01

申请号：US13597086

申请日：2012-08-28

申请人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

发明人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除 由升高的部分分离而产生的表面。

公开(公告)号：US20130334714A1

公开(公告)日：2013-12-19

申请号：US13526877

申请日：2012-06-19

申请人： YiSu Park ,  KyungHoon Lee ,  JoungIn Yang ,  SangMi Park ,  DaeSik Choi

发明人： YiSu Park ,  KyungHoon Lee ,  JoungIn Yang ,  SangMi Park ,  DaeSik Choi

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3135 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A method of manufacture of an integrated circuit packaging system includes providing a substrate; connecting an integrated circuit die; forming a molding having a temperature-dependent characteristic directly on the top surface of the substrate; and forming a coupling encapsulation having a coupled characteristic different from the temperature-dependent characteristic directly on the molding forms an encapsulation boundary between the coupling encapsulation and the molding.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 连接集成电路管芯; 在衬底的顶表面上直接形成具有温度依赖特性的模制品; 并且形成具有与温度相关特性不同的耦合特性的耦合封装，直接在模塑件上形成耦合封装和模制件之间的封装边界。

公开(公告)号：US08574964B2

公开(公告)日：2013-11-05

申请号：US12760428

申请日：2010-04-14

申请人： SungWon Cho ,  TaeWoo Lee ,  DaeSik Choi ,  KyuWon Lee

发明人： SungWon Cho ,  TaeWoo Lee ,  DaeSik Choi ,  KyuWon Lee

IPC分类号： H01L21/00 ,  H01L21/3205 ,  H01L21/4763 ,  H01L21/44

CPC分类号： H01L23/48 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05568 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/165 ,  H01L2224/29 ,  H01L2224/29099 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/83889 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05552 ,  H01L2224/81805

摘要： A semiconductor device has a flipchip type semiconductor die with contact pads and substrate with contact pads. A flux material is deposited over the contact pads of the semiconductor die and contact pads of the substrate. A solder tape formed as a continuous body of solder material with a plurality of recesses is disposed between the contact pads of the semiconductor die and substrate. The solder tape is brought to a liquidus state to separate a portion of the solder tape outside a footprint of the contact pads of the semiconductor die and substrate under surface tension and coalesce the solder material as an electrical interconnect substantially within the footprint of the contact pads of the semiconductor die and substrate. The contact pads on the semiconductor die and substrate can be formed with an extension or recess to increase surface area of the contact pads.

摘要翻译： 半导体器件具有带有接触焊盘和具有接触焊盘的衬底的倒装芯片型半导体管芯。 焊剂材料沉积在半导体管芯的接触焊盘和衬底的接触焊盘上。 形成为具有多个凹部的焊料材料的连续体的焊料带设置在半导体管芯和衬底的接触焊盘之间。 焊带被带到液相线状态，以将表面张力下的半导体管芯和衬底的接触焊盘的一部分焊接区分隔开，并将焊料材料作为基本上在接触焊盘的覆盖区内的电互连 的半导体管芯和衬底。 半导体管芯和衬底上的接触焊盘可以形成有延伸部或凹部，以增加接触焊盘的表面积。

公开(公告)号：US20130221543A1

公开(公告)日：2013-08-29

申请号：US13407554

申请日：2012-02-28

申请人： DaeSik Choi ,  JoonYoung Choi ,  YongHyuk Jeong

发明人： DaeSik Choi ,  JoonYoung Choi ,  YongHyuk Jeong

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a base integrated circuit over the base substrate; attaching a lead to the base integrated circuit and the base substrate, the lead having a lead attachment portion over the base integrated circuit; and forming a base encapsulation over the lead, the base encapsulation having a cavity exposing the lead attachment portion.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 在基底基板上安装基底集成电路; 将引线附接到基底集成电路和基底基板，所述引线在所述基底集成电路上方具有引线附接部分; 以及在所述引线上形成基底封装，所述基底封装具有暴露所述引线附着部分的空腔。

公开(公告)号：US20130154085A1

公开(公告)日：2013-06-20

申请号：US13325530

申请日：2011-12-14

申请人： DaeSik Choi ,  SangMi Park ,  MinJung Kim ,  MinWook Yu

发明人： DaeSik Choi ,  SangMi Park ,  MinJung Kim ,  MinWook Yu

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/36 ,  H01L21/50 ,  H01L23/10 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在基板上安装集成电路; 在基板上安装盖基座，盖基座具有基座凹口和孔内的集成电路; 并且将热块安装在盖底部上，热块具有部分在基底凹陷内的非水平侧段。

公开(公告)号：US08466567B2

公开(公告)日：2013-06-18

申请号：US12884134

申请日：2010-09-16

申请人： DaeSik Choi ,  SangMi Park ,  Oh Han Kim

发明人： DaeSik Choi ,  SangMi Park ,  Oh Han Kim

IPC分类号： H01L23/28

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/11003 ,  H01L2224/1133 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48155 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/83005 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a connection carrier having base device pads and base interconnect pads on a carrier top side of the connection carrier; connecting a base integrated circuit to the base device pads and mounted over the carrier top side; mounting base vertical interconnects directly on the base interconnect pads; attaching a base package substrate to the base integrated circuit and directly on the base vertical interconnects; forming a base encapsulation on the base package substrate, the base device pads, and the base interconnect pads; and removing a portion of the connection carrier with the base device pads and the base interconnect pads partially exposed opposite the base package substrate.

摘要翻译： 一种制造集成电路封装系统的方法，包括：在连接载体的载体顶侧上形成具有基底器件焊盘和基底互连焊盘的连接载体; 将基座集成电路连接到基座装置焊盘并安装在载体顶侧上; 将底座垂直互连直接安装在基底互连焊盘上; 将基底封装衬底附接到基底集成电路并直接在基底垂直互连上; 在基底封装衬底，基底器件焊盘和基底互连焊盘上形成基底封装; 以及使用与基底封装衬底相对部分地露出的基底器件焊盘和基底互连焊盘去除连接载体的一部分。