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公开(公告)号：US20070080455A1
公开(公告)日：2007-04-12
申请号：US11163235
申请日：2005-10-11
申请人： Donna Zupanski-Nielsen , William Landers , Ian Melville , Roger Quon , Timothy Daubenspeck , Kamalesh Srivastava , Mary Cullinan-Scholl , Lawrence Clevenger , Christopher Muzzy
发明人： Donna Zupanski-Nielsen , William Landers , Ian Melville , Roger Quon , Timothy Daubenspeck , Kamalesh Srivastava , Mary Cullinan-Scholl , Lawrence Clevenger , Christopher Muzzy
CPC分类号： H01L24/13 , H01L21/76831 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05647 , H01L2224/11334 , H01L2224/1148 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/00
摘要： A semiconductor having an insulating layer, a contact pad, a via, and a sacrificial dielectric cap is provided. The contact pad is embedded in the insulating layer, where the contact pad has a top metal layer of copper. The via creates an opening over the top metal layer. The sacrificial dielectric cap is over at least the top metal layer.
摘要翻译： 提供具有绝缘层，接触焊盘，通孔和牺牲电介质盖的半导体。 接触垫嵌入在绝缘层中，其中接触垫具有铜的顶部金属层。 通孔在顶部金属层上形成一个开口。 牺牲绝缘帽至少在顶部金属层之上。
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公开(公告)号：US20070007665A1
公开(公告)日：2007-01-11
申请号：US11160669
申请日：2005-07-05
申请人： Lawrence Clevenger , Mukta Farooq , Louis Hsu , William Landers , Donna Zupanski-Nielsen , Carl Radens , Chih-Chao Yang
发明人： Lawrence Clevenger , Mukta Farooq , Louis Hsu , William Landers , Donna Zupanski-Nielsen , Carl Radens , Chih-Chao Yang
IPC分类号： H01L23/48
CPC分类号： H05K3/3436 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/12 , H01L24/17 , H01L24/49 , H01L24/73 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06102 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/1403 , H01L2224/49109 , H01L2224/81801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H05K2201/094 , H05K2201/09736 , H05K2201/09845 , Y02P70/613 , H01L2224/29099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.
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公开(公告)号：US20070290345A1
公开(公告)日：2007-12-20
申请号：US11847776
申请日：2007-08-30
申请人： Lawrence Clevenger , Mukta Farooq , Louis Hsu , William Landers , Donna Zupanski-Nielsen , Carl Radens , Chih-Chao Yang
发明人： Lawrence Clevenger , Mukta Farooq , Louis Hsu , William Landers , Donna Zupanski-Nielsen , Carl Radens , Chih-Chao Yang
IPC分类号： H01L23/488 , H01L21/34
CPC分类号： H05K3/3436 , H01L23/13 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/12 , H01L24/17 , H01L24/49 , H01L24/73 , H01L24/81 , H01L2224/0401 , H01L2224/0603 , H01L2224/06102 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/1403 , H01L2224/49109 , H01L2224/81801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H05K2201/094 , H05K2201/09736 , H05K2201/09845 , Y02P70/613 , H01L2224/29099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.
摘要翻译： 一种电结构和方法，包括电和机械地连接到第二衬底的第一衬底。 第一基板包括第一导电焊盘和第二导电焊盘。 第二基板包括第三导电焊盘，第四导电焊盘和第一导电部件。 第四导电焊盘包括与第一导电构件的高度不同的高度。 导电构件电连接和机械地连接到第四导电垫。 第一焊球将第一导电焊盘连接到第三导电焊盘。 第一焊球包括第一直径。 第二焊球将第二导电焊盘连接到第一导电构件。 第二焊球包括第二直径。 第一直径大于所述第二直径。
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4.发明申请公开(公告)号：US20070222073A1
公开(公告)日：2007-09-27
申请号：US11308396
申请日：2006-03-21
申请人： Mukta Farooq , Jasvir Jaspal , William Landers , Thomas Lombardi , Hai Longworth , H. Pogge , Roger Quon
发明人： Mukta Farooq , Jasvir Jaspal , William Landers , Thomas Lombardi , Hai Longworth , H. Pogge , Roger Quon
CPC分类号： H01L24/05 , H01L23/291 , H01L23/293 , H01L23/3192 , H01L24/03 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2224/13111 , H01L2924/0001 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/00014
摘要： A system and method comprises depositing a dielectric layer on a substrate and depositing a metal layer on the dielectric layer. The system and method further includes depositing a high temperature diffusion barrier metal cap on the metal layer. The system and method further includes depositing a second dielectric layer on the high temperature diffusion barrier metal cap and the first dielectric layer, and etching a via into the second dielectric layer, such that the high temperature diffusion barrier metal cap is exposed. The system and method further includes depositing an under bump metallurgy in the via, and forming a C4 ball on the under bump metallurgy layer.
摘要翻译： 一种系统和方法包括在基底上沉积电介质层并在介电层上沉积金属层。 该系统和方法还包括在金属层上沉积高温扩散阻挡金属帽。 该系统和方法还包括在高温扩散阻挡金属帽和第一电介质层上沉积第二电介质层，并将通孔蚀刻到第二电介质层中，使得暴露高温扩散阻挡金属帽。 该系统和方法还包括在通孔中沉积凸块下的冶金，并在凸块下金属层上形成C4球。
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公开(公告)号：US20220125868A1
公开(公告)日：2022-04-28
申请号：US17452029
申请日：2021-10-22
申请人： William Landers
发明人： William Landers
IPC分类号： A61K36/185 , A23L33/00 , A23L33/105 , A23L3/54 , A23L2/52 , A23F5/02 , A61K9/00 , A61K36/74 , A61K36/752
摘要： The present disclosure provides new beverages and methods of making said beverages from hemp juice, coffee fruit, and oranges. The present disclosure also provides new beverages and methods of making said beverages from hemp juice and coffee fruit juice. The disclosure further relates to the production of a non-water-soluble and water-soluble coffee fruit, hemp juice, and orange powders.
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公开(公告)号：US20050242414A1
公开(公告)日：2005-11-03
申请号：US10709320
申请日：2004-04-28
申请人： Matthew Angyal , Edward Barth , Sanjit Das , Charles Davis , Habib Hichri , William Landers , Jia Lee
发明人： Matthew Angyal , Edward Barth , Sanjit Das , Charles Davis , Habib Hichri , William Landers , Jia Lee
IPC分类号： H01L23/58
CPC分类号： H01L23/53295 , C23C16/401 , H01L21/02126 , H01L21/022 , H01L21/02216 , H01L21/02274 , H01L21/02362 , H01L21/31633 , H01L21/76829 , H01L21/76835 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： An interlevel dielectric layer (ILD) comprises a low-k dielectric layer; and a low-k dielectric film, deposited under compressive stress, atop the dielectric layer. The dielectric layer comprises a low-k material, such as an organosilicon glass (OSG) or a SiCOH material. The dielectric film has a thickness, which is 2%-10% of the thickness of the dielectric layer, has a similar chemical composition to the dielectric layer, but has a different morphology than the dielectric layer. The dielectric film is deposited under compressive stress, in situ, at or near the end of the dielectric layer deposition by altering a process that was used to deposit the low-k dielectric layer.
摘要翻译： 层间电介质层（ILD）包括低k电介质层; 以及在压电应力下沉积在电介质层顶上的低k电介质膜。 电介质层包括低k材料，例如有机硅玻璃（OSG）或SiCOH材料。 电介质膜的厚度为电介质层厚度的2％-10％，与电介质层具有相似的化学成分，但具有与电介质层不同的形态。 通过改变用于沉积低k电介质层的工艺，在介电层沉积的结束处或在其附近的压应力下沉积电介质膜。
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公开(公告)号：US20240269209A1
公开(公告)日：2024-08-15
申请号：US18615843
申请日：2024-03-25
申请人： William Landers
发明人： William Landers
IPC分类号： A61K36/185 , A23F5/02 , A23L2/52 , A23L3/54 , A23L33/00 , A23L33/105 , A61K9/00 , A61K36/74 , A61K36/752
CPC分类号： A61K36/185 , A23F5/02 , A23L2/52 , A23L3/54 , A23L33/105 , A23L33/40 , A61K9/0095 , A61K36/74 , A61K36/752 , A23V2002/00
摘要： The present disclosure provides new beverages and methods of making said beverages from hemp juice, coffee fruit, and oranges. The present disclosure also provides new beverages and methods of making said beverages from hemp juice and coffee fruit juice. The disclosure further relates to the production of a non-water-soluble and water-soluble coffee fruit, hemp juice, and orange powders
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公开(公告)号：US20230267460A1
公开(公告)日：2023-08-24
申请号：US18106627
申请日：2023-02-07
申请人： John Scannell , William Landers
发明人： John Scannell , William Landers
CPC分类号： G06Q20/389 , G06Q20/3276 , G06K7/1417
摘要： Embodiments provide a system where a user can obtain a fractional portion of a blockchain unit. The fractional portion can be obtained as part of a separate arrangement. A computer ledger tracks the fractional interests of multiple users. An aggregator computer communicates with a blockchain computer to record ownership of one or more whole units in a pool. In one embodiment, a concierge system is provided that supports a social equity economy.
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公开(公告)号：US20080073790A1
公开(公告)日：2008-03-27
申请号：US11866741
申请日：2007-10-03
IPC分类号： H01L23/48
CPC分类号： H01L24/05 , H01L23/3192 , H01L23/53223 , H01L24/03 , H01L2224/04042 , H01L2224/0501 , H01L2224/05022 , H01L2224/05082 , H01L2224/05124 , H01L2224/05155 , H01L2224/05644 , H01L2224/45124 , H01L2224/48744 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/48
摘要： A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting the bond pads to the Ni/Au pad metallization.
摘要翻译： 提供了一种通过能够防止在Ni / Au焊盘冶金的无电沉积期间可能的化学侵蚀的材料来密封引线接合焊盘的暴露表面的方法。 具体地说，本发明提供了一种TiN / Ti或TiN / Al帽作为覆盖引线接合焊盘露出表面的保护涂层的方法。 TiN / Ti或TiN / Al帽不受用于形成Ni / Au金属化的碱性化学物质的影响，但它提供了将接合焊盘连接到Ni / Au焊盘金属化的足够的电通路。
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公开(公告)号：US20050074959A1
公开(公告)日：2005-04-07
申请号：US10676172
申请日：2003-10-01
IPC分类号： H01L21/44 , H01L23/31 , H01L23/485 , H01L23/532
CPC分类号： H01L24/05 , H01L23/3192 , H01L23/53223 , H01L24/03 , H01L2224/04042 , H01L2224/0501 , H01L2224/05022 , H01L2224/05082 , H01L2224/05124 , H01L2224/05155 , H01L2224/05644 , H01L2224/45124 , H01L2224/48744 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/48
摘要： A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting-the bond pads to the Ni/Au pad metallization.
摘要翻译： 提供了一种通过能够防止在Ni / Au焊盘冶金的无电沉积期间可能的化学侵蚀的材料来密封引线接合焊盘的暴露表面的方法。 具体地说，本发明提供了一种TiN / Ti或TiN / Al帽作为覆盖引线接合焊盘露出表面的保护涂层的方法。 TiN / Ti或TiN / Al帽不受用于形成Ni / Au金属化的碱性化学物质的影响，但它提供了将接合焊盘连接到Ni / Au焊盘金属化的足够的电路。
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