公开(公告)号：US20170098631A1

公开(公告)日：2017-04-06

申请号：US15275752

申请日：2016-09-26

申请人： FUJITSU LIMITED

发明人： Ryo Kikuchi ,  Nobuhiro IMAIZUMI ,  Hiroshi Onuki

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0214 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/0225 ,  H01L2224/02255 ,  H01L2224/0226 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/0239 ,  H01L2224/03001 ,  H01L2224/036 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05005 ,  H01L2224/05014 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/0519 ,  H01L2224/05195 ,  H01L2224/05287 ,  H01L2224/0529 ,  H01L2224/05395 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/12105 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13014 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/03 ,  H01L2224/11 ,  H01L21/304 ,  H01L21/76898 ,  H01L2224/81 ,  H01L2924/0665 ,  H01L2924/00

摘要： An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface;a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity;a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface.

公开(公告)号：US20130187293A1

公开(公告)日：2013-07-25

申请号：US13671970

申请日：2012-11-08

申请人： FUJITSU LIMITED

发明人： Taiji SAKAI ,  Nobuhiro IMAIZUMI

IPC分类号： H01L21/762 ,  G21K5/02 ,  H01L23/488

CPC分类号： H01L21/76254 ,  B23K20/026 ,  B23K20/24 ,  B23K20/26 ,  B23K2101/42 ,  G21K5/02 ,  H01L21/2686 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/67144 ,  H01L23/488 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/118 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/757 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/8101 ,  H01L2224/81013 ,  H01L2224/81014 ,  H01L2224/8102 ,  H01L2224/81031 ,  H01L2224/81047 ,  H01L2224/81054 ,  H01L2224/81075 ,  H01L2224/8109 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8122 ,  H01L2224/818 ,  H01L2224/8183 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/20105 ,  H01L2924/20108 ,  H01L2924/2021 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

摘要： According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.

摘要翻译： 根据本发明，提供了一种制造电子器件的方法，其包括将第一电子部件的第一电极的顶表面暴露于有机酸，用紫外线照射暴露于有机酸的第一电极的顶表面 并且通过对所述第一电极和所述第二电极进行加热和加压而将所述第一电极和第二电子部件的第二电极接合。

公开(公告)号：US20140342504A1

公开(公告)日：2014-11-20

申请号：US14452754

申请日：2014-08-06

申请人： FUJITSU LIMITED

发明人： Taiji SAKAI ,  Nobuhiro IMAIZUMI

IPC分类号： H01L23/00 ,  G21K5/02 ,  H01L21/3213 ,  H01L21/268 ,  H01L21/67

CPC分类号： H01L21/76254 ,  B23K20/026 ,  B23K20/24 ,  B23K20/26 ,  B23K2101/42 ,  G21K5/02 ,  H01L21/2686 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/67144 ,  H01L23/488 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/11462 ,  H01L2224/118 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/11845 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/75102 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/757 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/8101 ,  H01L2224/81013 ,  H01L2224/81014 ,  H01L2224/8102 ,  H01L2224/81031 ,  H01L2224/81047 ,  H01L2224/81054 ,  H01L2224/81075 ,  H01L2224/8109 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8122 ,  H01L2224/818 ,  H01L2224/8183 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/20105 ,  H01L2924/20108 ,  H01L2924/2021 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83

摘要： According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.

摘要翻译： 根据本发明，提供了一种制造电子器件的方法，其包括将第一电子部件的第一电极的顶表面暴露于有机酸，用紫外线照射暴露于有机酸的第一电极的顶表面 并且通过对所述第一电极和所述第二电极进行加热和加压而将所述第一电极和第二电子部件的第二电极接合。

公开(公告)号：US20130164956A1

公开(公告)日：2013-06-27

申请号：US13664761

申请日：2012-10-31

申请人： Fujitsu Limited

发明人： Seiki SAKUYAMA ,  Toshiya AKAMATSU ,  Nobuhiro IMAIZUMI ,  Keisuke UENISHI ,  Kenichi YASAKA ,  Toru SAKAI

IPC分类号： H01R12/51

CPC分类号： H01L24/16 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05639 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/16505 ,  H01L2924/00014 ,  H05K3/3436 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2224/05552

摘要： A surface of a connection terminal of an electronic component is covered with a protection layer made of a AgSn alloy. The electronic component is soldered to a connection terminal of a circuit board.