公开(公告)号：US20130302020A1

公开(公告)日：2013-11-14

申请号：US13467124

申请日：2012-05-09

申请人： Hun-Hung LU ,  Yu-Wen Liu

发明人： Hun-Hung LU ,  Yu-Wen Liu

IPC分类号： F24H1/18

CPC分类号： F24H9/1818 ,  F24H1/121 ,  F24H9/0015 ,  F24H2250/02 ,  H05B3/12 ,  H05B3/262 ,  H05B3/44 ,  H05B2203/003 ,  H05B2203/014

摘要： A heating device for an electric water heater, especially a heating device that can effectively recover waste heat, the device includes a secondary water box provided on one of the top and the bottom sides of a flat type main water box, the secondary water box is communicated with the main water box to guide water of the secondary water box into the main water box; the main and the secondary water boxes are provided therebetween with a laminate electric heating board of which the top and the bottom sides are clung respectively to the secondary water box and the main water box, an effect of preheating the water in the secondary water box is obtained to thereby effectively use the waste heat for saving energy source, and heating efficiency can be increased.

摘要翻译： 一种用于电热水器的加热装置，特别是能够有效回收废热的加热装置，该装置包括设置在平板式主水箱的顶侧和底侧之一的二次水箱，次水箱为 与主水箱通信，将二次水箱的水引导到主水箱; 主水箱和二次水箱之间设置有层压电加热板，其顶侧和底侧分别紧固在二次水箱和主水箱上，预热二次水箱中的水的效果为 从而有效地利用废热来节约能源，并且可以提高加热效率。

公开(公告)号：US09239592B1

公开(公告)日：2016-01-19

申请号：US14470952

申请日：2014-08-28

申请人： Yu-Wen Liu ,  Chin-Kuo Huang ,  Long-Cheng Chang ,  Hsien-Tang Liao ,  Yi-Ju Liao

发明人： Yu-Wen Liu ,  Chin-Kuo Huang ,  Long-Cheng Chang ,  Hsien-Tang Liao ,  Yi-Ju Liao

IPC分类号： G06F1/16

CPC分类号： G06F1/1632 ,  G06F1/1681

摘要： A docking station including fixing base and at least one latching module is provided. The latching module includes a latching element, a first restoring element, a stopping element, a second restoring element and a pushing element. The first restoring element is connected to the latching element and the fixing base and drives the latching element to latch a tablet device. The stopping element is coupled to the latching element and has a recess. The second restoring element is connected to the stopping element and the fixing base and drives the stopping element to stop the latching element. The pushing element is adapted to be pushed and inserted into the recess to drive the stopping element to move away from the latching element, and the tablet device is adapted to be released from the latching element by pushing the latching element after the stopping element moves away from the latching element.

摘要翻译： 提供了包括固定底座和至少一个闩锁模块的对接站。 闩锁模块包括闩锁元件，第一恢复元件，止动元件，第二恢复元件和推动元件。 第一恢复元件连接到锁定元件和固定底座并驱动闩锁元件以锁定平板装置。 止动元件联接到闩锁元件并且具有凹部。 第二恢复元件连接到止动元件和固定基座，并驱动止动元件以停止闩锁元件。 推动元件适于被推入并插入到凹部中以驱动止动元件远离闩锁元件移动，并且平板装置适于在止动元件移开之后通过推动闩锁元件而从闩锁元件释放 从锁定元件。

公开(公告)号：US08405211B2

公开(公告)日：2013-03-26

申请号：US12726449

申请日：2010-03-18

申请人： Hao-Yi Tsai ,  Hsien-Wei Chen ,  Yu-Wen Liu ,  Ying-Ju Chen ,  Hsiu-Ping Wei

发明人： Hao-Yi Tsai ,  Hsien-Wei Chen ,  Yu-Wen Liu ,  Ying-Ju Chen ,  Hsiu-Ping Wei

IPC分类号： H01L23/485

CPC分类号： H01L24/05 ,  H01L21/768 ,  H01L21/76877 ,  H01L23/48 ,  H01L23/481 ,  H01L24/03 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05012 ,  H01L2224/0509 ,  H01L2224/05092 ,  H01L2224/05094 ,  H01L2224/05095 ,  H01L2224/05096 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05552 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012

摘要： An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.

公开(公告)号：US20090194889A1

公开(公告)日：2009-08-06

申请号：US12026312

申请日：2008-02-05

申请人： Shin-Puu Jeng ,  Yu-Wen Liu ,  Hao-Yi Tsai ,  Hsien-Wei Chen

发明人： Shin-Puu Jeng ,  Yu-Wen Liu ,  Hao-Yi Tsai ,  Hsien-Wei Chen

IPC分类号： H01L23/485

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05093 ,  H01L2224/05096 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05552 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/37001 ,  H01L2924/00012 ,  H01L2924/00

摘要： A bonding pad structure is provided that includes two conductive layers and a connective layer interposing the two conductive layers. The connective layer includes a contiguous, conductive structure. In an embodiment, the contiguous conductive structure is a solid layer of conductive material. In other embodiments, the contiguous conductive structure is a conductive network including, for example, a matrix configuration or a plurality of conductive stripes. At least one dielectric spacer may interpose the conductive network. In an embodiment, the conductive density of the connective layer is between approximately 20% and 100%.

摘要翻译： 提供了一种焊盘结构，其包括两个导电层和插入两个导电层的连接层。 连接层包括连续的导电结构。 在一个实施例中，邻接的导电结构是导电材料的固体层。 在其它实施例中，连续导电结构是包括例如矩阵配置或多个导电条纹的导电网络。 至少一个电介质间隔物可以插入导电网络。 在一个实施例中，连接层的导电密度在大约20％和100％之间。

公开(公告)号：US20090140393A1

公开(公告)日：2009-06-04

申请号：US12054082

申请日：2008-03-24

申请人： Hsien-Wei Chen ,  Hao-Yi Tsai ,  Shin-Puu Jeng ,  Yu-Wen Liu

发明人： Hsien-Wei Chen ,  Hao-Yi Tsai ,  Shin-Puu Jeng ,  Yu-Wen Liu

IPC分类号： H01L23/58

CPC分类号： H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor wafer having a multi-layer wiring structure is disclosed. The wafer comprises a plurality of chip die areas arranged on the wafer in an array and scribe line areas between the chip die areas. The scribe lines of a semiconductor wafer having USG top-level wiring layers above ELK wiring layers have at least one metal film structures substantially covering corner regions where two scribe lines intersect to inhibit delamination at the USG/ELK interface during wafer dicing operation.

摘要翻译： 公开了具有多层布线结构的半导体晶片。 晶片包括排列在晶片上的多个芯片管芯区域和在芯片管芯区域之间的划线区域。 具有在ELK布线层之上的USG顶层布线层的半导体晶片的划线具有至少一个金属膜结构，其基本上覆盖两个划线相交的拐角区域，以在晶片切割操作期间在USG / ELK界面处抑制分层。

公开(公告)号：US09859235B2

公开(公告)日：2018-01-02

申请号：US12619503

申请日：2009-11-16

申请人： Yu-Wen Liu ,  Hao-Yi Tsai ,  Hsien-Wei Chen ,  Shin-Puu Jeng ,  Ying-Ju Chen ,  Shang-Yun Hou ,  Pei-Haw Tsao ,  Chen-Hua Yu

发明人： Yu-Wen Liu ,  Hao-Yi Tsai ,  Hsien-Wei Chen ,  Shin-Puu Jeng ,  Ying-Ju Chen ,  Shang-Yun Hou ,  Pei-Haw Tsao ,  Chen-Hua Yu

IPC分类号： H01L23/488 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/05 ,  H01L23/3157 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0215 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05096 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05541 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05566 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13007 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/2064 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599

摘要： A system and method for forming an underbump metallization (UBM) is presented. A preferred embodiment includes a raised UBM which extends through a passivation layer so as to make contact with a contact pad while retaining enough of the passivation layer between the contact pad and the UBM to adequately handle the peeling and shear stress that results from CTE mismatch and subsequent thermal processing. The UBM contact is preferably formed in either an octagonal ring shape or an array of contacts.

公开(公告)号：US20160184638A1

公开(公告)日：2016-06-30

申请号：US14979496

申请日：2015-12-27

申请人： Yu-Wen Liu ,  Hsien-Tang Liao ,  Yi-Ju Liao ,  Chuang-Yueh Chen ,  I-Nan Liao ,  Nan-Ting Chen ,  Shih-Cheng Chou ,  Sheng-Hung Lee ,  Hao-Ying Chang

发明人： Yu-Wen Liu ,  Hsien-Tang Liao ,  Yi-Ju Liao ,  Chuang-Yueh Chen ,  I-Nan Liao ,  Nan-Ting Chen ,  Shih-Cheng Chou ,  Sheng-Hung Lee ,  Hao-Ying Chang

IPC分类号： A63B24/00 ,  A63B21/072 ,  A63B21/00

CPC分类号： A63B24/0062 ,  A63B21/00065 ,  A63B21/0628 ,  A63B21/0726

摘要： A fitness transmission apparatus including an information carrying assembly and an information reading assembly is provided. The information carrying assembly is disposed on a fitness equipment. The information carrying assembly is configured to record a weight information of the fitness equipment by using a plurality of information record combinations. The information reading assembly is disposed on the fitness equipment. The information reading assembly is configured to read the weight information in a predetermined manner based on types of the information record combinations. The information reading assembly is paired to the information carrying assembly in the predetermined manner to read the weight information. The information reading assembly transmits the read weight information to an electronic device. Furthermore, an information processing method is also provided.

摘要翻译： 提供了一种包括信息携带组件和信息阅读组件的健身传动装置。 信息携带组件设置在健身器材上。 信息携带组件被配置为通过使用多个信息记录组合来记录健身设备的权重信息。 信息读取组件设置在健身器材上。 信息读取组件被配置为基于信息记录组合的类型以预定方式读取权重信息。 信息读取组件以预定的方式与信息携带组件配对以读取权重信息。 信息读取组件将读取的权重信息发送到电子设备。 此外，还提供了一种信息处理方法。

公开(公告)号：US08981580B2

公开(公告)日：2015-03-17

申请号：US13463433

申请日：2012-05-03

申请人： Shin-Puu Jeng ,  Yu-Wen Liu ,  Hao-Yi Tsai ,  Hsien-Wei Chen

发明人： Shin-Puu Jeng ,  Yu-Wen Liu ,  Hao-Yi Tsai ,  Hsien-Wei Chen

IPC分类号： H01L23/48 ,  H01L23/00

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05093 ,  H01L2224/05096 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05552 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/37001 ,  H01L2924/00012 ,  H01L2924/00

摘要： A bonding pad structure is provided that includes two conductive layers and a connective layer interposing the two conductive layers. The connective layer includes a contiguous, conductive structure. In an embodiment, the contiguous conductive structure is a solid layer of conductive material. In other embodiments, the contiguous conductive structure is a conductive network including, for example, a matrix configuration or a plurality of conductive stripes. At least one dielectric spacer may interpose the conductive network. Conductive plugs may interconnect a bond pad and one of the conductive layers.

摘要翻译： 提供了一种焊盘结构，其包括两个导电层和插入两个导电层的连接层。 连接层包括连续的导电结构。 在一个实施例中，邻接的导电结构是导电材料的固体层。 在其它实施例中，连续导电结构是包括例如矩阵配置或多个导电条纹的导电网络。 至少一个电介质间隔物可以插入导电网络。 导电插头可以将接合焊盘和导电层中的一个互连。

公开(公告)号：US08810025B2

公开(公告)日：2014-08-19

申请号：US13050125

申请日：2011-03-17

申请人： Yu-Wen Liu ,  Ching-Jung Yang ,  Hsien-Wei Chen ,  Hsin-Yu Pan ,  Chao-Wen Shih

发明人： Yu-Wen Liu ,  Ching-Jung Yang ,  Hsien-Wei Chen ,  Hsin-Yu Pan ,  Chao-Wen Shih

IPC分类号： H01L23/14 ,  H01L23/12

CPC分类号： H01L23/49822 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/13116 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

摘要： The present disclosure provides a carrier substrate, a device including the carrier substrate, and a method of bonding the carrier substrate to a chip. An exemplary device includes a carrier substrate having a chip region and a periphery region, and a chip bonded to the chip region of the carrier substrate. The carrier substrate includes a reinforcement structure embedded within the periphery region.

摘要翻译： 本公开提供了载体基板，包括载体基板的装置以及将载体基板结合到芯片的方法。 示例性器件包括具有芯片区域和外围区域的载体衬底和结合到载体衬底的芯片区域的芯片。 载体衬底包括嵌入在周边区域内的加强结构。

公开(公告)号：US08450126B2

公开(公告)日：2013-05-28

申请号：US13197003

申请日：2011-08-03

申请人： Hsien-Wei Chen ,  Ying-Ju Chen ,  Yu-Wen Liu ,  Hao-Yi Tsai ,  Shin-Puu Jeng

发明人： Hsien-Wei Chen ,  Ying-Ju Chen ,  Yu-Wen Liu ,  Hao-Yi Tsai ,  Shin-Puu Jeng

IPC分类号： H01L21/66 ,  G01R31/26

CPC分类号： H01L22/34 ,  H01L24/05 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

摘要： A semiconductor test pad interconnect structure with integrated die-separation protective barriers. The interconnect structure includes a plurality of stacked metal layers each having an electrically conductive test pad separated from other test pads by a dielectric material layer. In one embodiment, at least one metallic via bar is embedded into the interconnect structure and electrically interconnects each of the test pads in the metal layers together. The via bar extends substantially along an entire first side defined by each test pad in some embodiments. In other embodiments, a pair of opposing via bars may be provided that are arranged on opposite sides of a die singulation saw cut line defined in a scribe band on a semiconductor wafer.

摘要翻译： 具有集成的模具隔离保护屏障的半导体测试焊盘互连结构。 互连结构包括多个堆叠的金属层，每个层具有通过介电材料层与其它测试焊盘分离的导电测试焊盘。 在一个实施例中，至少一个金属通孔条被嵌入到互连结构中，并将金属层中的每个测试焊盘电连接在一起。 在一些实施例中，通孔棒基本上沿着由每个测试垫限定的整个第一侧面延伸。 在其他实施例中，可以提供一对相对的通孔条，其布置在限定在半导体晶片上的划线带中的模切单切锯切线的相对侧上。