公开(公告)号：US20050118845A1

公开(公告)日：2005-06-02

申请号：US10496558

申请日：2002-11-21

申请人： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

发明人： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

IPC分类号： C09J7/00 ,  C09J9/02 ,  C09J121/00 ,  C09J183/04 ,  H01B5/16 ,  H01B13/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01R11/01 ,  H05K3/32 ,  H01R4/58

CPC分类号： H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2483/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.

摘要翻译： 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。

公开(公告)号：US06518204B2

公开(公告)日：2003-02-11

申请号：US10094231

申请日：2002-03-07

申请人： Kimio Yamakawa ,  Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Junji Nakanishi ,  Tomoko Kato ,  Minoru Isshiki ,  Katsutoshi Mine

发明人： Kimio Yamakawa ,  Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Junji Nakanishi ,  Tomoko Kato ,  Minoru Isshiki ,  Katsutoshi Mine

IPC分类号： H01L2131

CPC分类号： H01L23/3135 ,  C08F283/12 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  H01L23/293 ,  H01L2224/48091 ,  H01L2924/1301 ,  H01L2924/19041 ,  C08F230/08 ,  H01L2924/00014 ,  H01L2924/00

摘要： A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.

公开(公告)号：US5173765A

公开(公告)日：1992-12-22

申请号：US619842

申请日：1990-11-29

申请人： Kazumi Nakayoshi ,  Katsutoshi Mine

发明人： Kazumi Nakayoshi ,  Katsutoshi Mine

IPC分类号： C09J183/05 ,  C08L83/07 ,  C09J9/02 ,  C09J11/04 ,  C09J183/00 ,  C09J183/07 ,  H01B1/12 ,  H01L21/60 ,  H01L23/495 ,  H01R4/04

CPC分类号： H01L24/83 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05624 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85447 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/181 ,  Y10T428/31663

摘要： A conductive adhesive for bonding semiconductor pellets to tabs is made from a conductive addition reaction-curing silicone rubber composition which contains.ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure.gtoreq.10 mmHg at 200.degree. C. The conductive adhesive can contain a metal micropowder such as gold, silver, nickel or copper.

公开(公告)号：US5145931A

公开(公告)日：1992-09-08

申请号：US604843

申请日：1990-10-26

申请人： Kazumi Nakayoshi ,  Katsutoshi Mine

发明人： Kazumi Nakayoshi ,  Katsutoshi Mine

IPC分类号： H01L21/52 ,  C08G77/34 ,  C08L83/07 ,  C09J183/00 ,  C09J183/04 ,  C09J183/05 ,  C09J183/07

CPC分类号： C08G77/34 ,  C09J183/04 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15747

摘要： An adhesive for bonding a semiconductor pellet to an attachment site where the adhesive is an addition reaction-curing silicone rubber composition which contain .ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure .gtoreq.10 mmHg at 200.degree. C.

公开(公告)号：US07700678B2

公开(公告)日：2010-04-20

申请号：US10536669

申请日：2003-11-17

申请人： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

发明人： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

IPC分类号： C08K3/22 ,  C08G77/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08K9/04 ,  C09J183/04 ,  H05K3/321

摘要： A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

摘要翻译： 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。

公开(公告)号：US07056129B2

公开(公告)日：2006-06-06

申请号：US10496558

申请日：2002-11-21

申请人： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

发明人： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

IPC分类号： H01R9/09

CPC分类号： H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2483/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.

摘要翻译： 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。

公开(公告)号：US20050181213A1

公开(公告)日：2005-08-18

申请号：US10511659

申请日：2003-05-29

申请人： Hiroki Ishikawa ,  Katsutoshi Mine ,  Kimio Yamakawa ,  Kazumi Nakayoshi

发明人： Hiroki Ishikawa ,  Katsutoshi Mine ,  Kimio Yamakawa ,  Kazumi Nakayoshi

IPC分类号： C08K3/08 ,  C08K3/22 ,  C08L83/04 ,  C09K5/14 ,  H01L23/373 ,  B32B27/38 ,  B32B9/04 ,  C08L63/00

CPC分类号： C08K3/08 ,  C08G77/12 ,  C08G77/20 ,  C08K3/10 ,  C08K3/22 ,  C08K2003/2227 ,  C08L83/04 ,  C09K5/14 ,  H01L23/3736 ,  H01L23/3737 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/1301 ,  Y10T428/31511 ,  Y10T428/31663 ,  C08L2666/54 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

摘要： A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.

摘要翻译： 一种导热固化液体聚合物组合物，其包含（A）可固化液体聚合物，（B）由热可伸长形状记忆合金制成的填料，和（C）除（B）之外的导热填料。 一种半导体器件，其具有胶合或涂覆有导热可固化液体聚合物组合物的半导体元件。

公开(公告)号：US6017587A

公开(公告)日：2000-01-25

申请号：US112392

申请日：1998-07-09

申请人： Don Lee Kleyer ,  Michael Andrew Lutz ,  Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Bernard Vanwert

发明人： Don Lee Kleyer ,  Michael Andrew Lutz ,  Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Bernard Vanwert

IPC分类号： C08L83/05 ,  C08K3/08 ,  C08L83/04 ,  C08L83/07 ,  H01B1/22 ,  B05D3/02

CPC分类号： H01B1/22 ,  C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/44 ,  C08G77/60 ,  C08G77/70 ,  C08G77/80 ,  Y10T428/31663

摘要： The present invention relates to electrically conductive silicone compositions comprising an organopolysiloxane containing at least two alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, a platinum group metal containing catalyst, a conductive metal particulate, a precrosslinked elastomeric silicone particle, and a non-reactive volatile diluent. The electrically conductive silicone compositions of this invention are useful as electrically conductive adhesives and coatings for electrical and electronic devices. The cured electrically conductive silicone compositions of this invention have high electroconductivity and rubbery elasticity.

摘要翻译： 本发明涉及导电硅氧烷组合物，其包含每分子含有至少两个烯基的有机聚硅氧烷，每分子具有至少两个与硅键合的氢原子的有机氢聚硅氧烷，含铂族金属的催化剂，导电金属颗粒，预交联弹性体 硅氧烷颗粒和非反应性挥发性稀释剂。 本发明的导电硅氧烷组合物可用作电气和电子设备的导电粘合剂和涂层。 本发明固化的导电硅氧烷组合物具有高导电性和橡胶弹性。

公开(公告)号：US5982041A

公开(公告)日：1999-11-09

申请号：US835287

申请日：1997-04-09

申请人： Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa ,  Katsutoshi Mine

发明人： Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa ,  Katsutoshi Mine

IPC分类号： C08J3/24 ,  C09J183/00 ,  C09J183/04 ,  C09J183/06 ,  C09J183/07 ,  H01L21/52 ,  H01L21/58 ,  H01L23/48 ,  C09J4/00 ,  B32B9/04

CPC分类号： C08J3/243 ,  C09J183/04 ,  C09J183/06 ,  C08J2383/04 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/15747 ,  H01L2924/19105 ,  Y10T428/31663

摘要： A silicone die attach adhesive comprising a silicone composition that cures both through the free radical reaction of acrylic-functional organopolysiloxane as induced by exposure to high-energy radiation and through the hydrosilylation reaction between alkenyl-functional organopolysiloxane and silicon-bonded hydrogen-functional organopolysiloxane.Also, a fabrication method characterized bymounting a semiconductor chip on a substrate or in a package with the aforesaid silicone die attach adhesive sandwiched between the semiconductor chip and substrate or package,then inducing the free radical reaction of the acrylic functional groups by exposing the die attach adhesive to high-energy radiation, and thereaftercuring the die attach adhesive by the hydrosilylation reaction.A semiconductor device characterized in that it has been fabricated by the above-described method.

摘要翻译： 硅氧烷片附着粘合剂，其包含硅氧烷组合物，其通过暴露于高能量辐射诱导的丙烯酸官能的有机聚硅氧烷的自由基反应并通过烯基官能的有机聚硅氧烷和硅键合的氢官能的有机聚硅氧烷之间的氢化硅烷化反应固化。 另外，一种制造方法，其特征在于，将半导体芯片安装在基板上或封装中，并将上述硅树脂管芯粘合剂夹在半导体芯片和基板或封装之间，然后通过暴露模具而引起丙烯酸官能团的自由基反应 将粘合剂粘附到高能量辐射上，然后通过氢化硅烷化反应固化芯片附着粘合剂。 一种半导体器件，其特征在于，其通过上述方法制造。

公开(公告)号：US5932145A

公开(公告)日：1999-08-03

申请号：US960645

申请日：1997-10-30

申请人： Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa ,  Katsutoshi Mine

发明人： Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa ,  Katsutoshi Mine

IPC分类号： C08K3/08 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  C09J183/04 ,  H01B1/22 ,  H01B1/06

CPC分类号： C08L83/04 ,  C09J183/04 ,  C08G77/12 ,  C08G77/20

摘要： An addition reaction-curing conductive silicone composition comprises: an organopolysiloxane with alkenyl groups, an organopolysiloxane with silicon-bonded hydrogen atoms, a conductive microparticulate, a platinum catalyst, and a volatile solvent; and the composition cures to yield a conductive cured silicone product that has low resistance and resistivity values, a resistance value independent of temperature, and little variation in resistance and resistivity values over time.

摘要翻译： 加成反应固化导电硅氧烷组合物包括：具有烯基的有机聚硅氧烷，具有与硅键合的氢原子的有机聚硅氧烷，导电微粒，铂催化剂和挥发性溶剂; 并且组合物固化以产生具有低电阻和电阻率值的导电固化的硅氧烷产品，与温度无关的电阻值，以及随时间的电阻和电阻率值的变化小。