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公开(公告)号:US08466488B2
公开(公告)日:2013-06-18
申请号:US13466288
申请日:2012-05-08
IPC分类号: H01L29/72
CPC分类号: F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要: In accordance with certain embodiments, an unpackaged inorganic LED die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the unpackaged inorganic LED die or non-coplanarity of the contacts thereof.
摘要翻译: 根据某些实施例,未封装的无机LED管芯具有压敏激光粘合剂直接粘附到屈服基底上,尽管未封装的无机LED裸片的表面具有任何非平面性,也不与其接触的非共面性。
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公开(公告)号:US20090255575A1
公开(公告)日:2009-10-15
申请号:US12417569
申请日:2009-04-02
申请人: Michael Tischler
发明人: Michael Tischler
IPC分类号: H01L31/00
CPC分类号: H01L31/03042 , H01L31/0304 , H01L31/03044 , H01L31/0328 , H01L31/0687 , Y02E10/544
摘要: Lightweight solar cells include a multiple-bandgap material.
摘要翻译: 轻质太阳能电池包括多带隙材料。
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公开(公告)号:US20120180857A1
公开(公告)日:2012-07-19
申请号:US13352242
申请日:2012-01-17
申请人: Michael Tischler
发明人: Michael Tischler
IPC分类号: H01L31/02 , H01L31/0264 , H01L31/0232
CPC分类号: H01L31/055 , Y02E10/52
摘要: A conversion solar cell structure responds to a greater portion of the solar spectrum. The solar-cell structure has a solar cell and a conversion material disposed over the solar cell.
摘要翻译: 转换太阳能电池结构响应太阳光谱的更大部分。 太阳能电池结构具有设置在太阳能电池上的太阳能电池和转换材料。
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公开(公告)号:US20110316422A1
公开(公告)日:2011-12-29
申请号:US13183684
申请日:2011-07-15
CPC分类号: H05B33/089 , F21K9/20 , H05B33/08 , H05B33/0821 , H05K2201/09263 , H05K2201/10106 , H05K2201/10174 , Y10T29/49002
摘要: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
摘要翻译: 根据某些实施例,包括多个功率串的照明系统具有促进对沿着每个功率线连接的一个或多个发光元件的故障进行补偿的元件。
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公开(公告)号:US20090255577A1
公开(公告)日:2009-10-15
申请号:US12417581
申请日:2009-04-02
申请人: Michael Tischler
发明人: Michael Tischler
IPC分类号: H01L31/00
CPC分类号: H01L31/055 , Y02E10/52
摘要: A conversion solar cell structure responds to a greater portion of the solar spectrum. The solar-cell structure has a solar cell and a conversion material disposed over the solar cell.
摘要翻译: 转换太阳能电池结构响应太阳光谱的更大部分。 太阳能电池结构具有设置在太阳能电池上的太阳能电池和转换材料。
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公开(公告)号:US20090255576A1
公开(公告)日:2009-10-15
申请号:US12417574
申请日:2009-04-02
申请人: Michael Tischler
发明人: Michael Tischler
IPC分类号: H01L31/00
CPC分类号: H01L31/0328 , G02F1/15 , G02F2001/13324 , H01L31/03042 , H01L31/06 , Y02E10/544
摘要: A substantially transparent solar cell is combined with an electrochromic film.
摘要翻译: 将基本透明的太阳能电池与电致变色膜组合。
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公开(公告)号:US08384121B2
公开(公告)日:2013-02-26
申请号:US13171973
申请日:2011-06-29
CPC分类号: F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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8.FABRICATION OF PHOSPHOR DOTS AND APPLICATION OF PHOSPHOR DOTS TO ARRAYS OF LIGHTING ELEMENTS 有权
标题翻译: 磷光体的制造和磷光体应用于照明元件的阵列公开(公告)号:US20120094406A1
公开(公告)日:2012-04-19
申请号:US13273313
申请日:2011-10-14
IPC分类号: H01L33/50
CPC分类号: H01L33/505 , H01L33/507 , H01L2933/0041
摘要: In accordance with certain embodiments, arrays of phosphor dots are formed and associated with arrays of light-emitting elements to form lighting systems.
摘要翻译: 根据某些实施例,形成荧光点阵列并与发光元件阵列相关联以形成照明系统。
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公开(公告)号:US20100258181A1
公开(公告)日:2010-10-14
申请号:US12723601
申请日:2010-03-12
CPC分类号: H01L31/0735 , H01L31/1844 , Y02E10/544
摘要: Solar cell structures and methods of fabricating solar cell structures having increased efficiency are provided.
摘要翻译: 提供太阳能电池结构和制造提高效率的太阳能电池结构的方法。
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公开(公告)号:US20110315956A1
公开(公告)日:2011-12-29
申请号:US13171973
申请日:2011-06-29
CPC分类号: F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
摘要翻译: 根据某些实施例,尽管半导体管芯的表面具有任何非平面性或半导体管芯接触件的非共面性,半导体管芯也用压力激活的粘合剂直接粘附到屈服基底上。
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