公开(公告)号：US4675789A

公开(公告)日：1987-06-23

申请号：US811355

申请日：1985-12-20

申请人： Kiyoshi Kuwabara ,  Mikio Nishihara ,  Kazuhisa Tsunoi

发明人： Kiyoshi Kuwabara ,  Mikio Nishihara ,  Kazuhisa Tsunoi

IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K3/42 ,  H05K1/14

CPC分类号： H05K1/116 ,  H05K2201/09327 ,  H05K2201/09454 ,  H05K3/429

摘要： A high density multilayer printed circuit board comprising generally parallel signal layers, electric source layers, and ground layers, with insulating layers arranged between the signal layers and the electric source layers, between the electric source layers and the ground layers, and between the ground layers and the signal layers respectively. Conductor portions are formed in through holes which are opened in a direction transverse to the signal layers, electric source layers, and ground layers. The conductor portions are electrically connected to the signal layers and/or the electric source layers, and/or the ground layers, through the lands thereof, the connections of the lands being substantially equally distributed among the conductor portions.

摘要翻译： 一种高密度多层印刷电路板，包括大致平行的信号层，电源层和接地层，绝缘层布置在信号层和电源层之间，电源层和接地层之间，以及接地层之间 和信号层。 导体部分形成在与信号层，电源层和接地层横向的方向上开放的通孔中。 导体部分通过其平台与信号层和/或电源层和/或接地层电连接，焊盘的连接基本上均匀分布在导体部分之间。

公开(公告)号：US5181317A

公开(公告)日：1993-01-26

申请号：US766244

申请日：1991-09-27

申请人： Mikio Nishihara ,  Teruo Murase ,  Kiyotaka Seyama ,  Kiyoshi Kuwabara ,  Osamu Ohshima

发明人： Mikio Nishihara ,  Teruo Murase ,  Kiyotaka Seyama ,  Kiyoshi Kuwabara ,  Osamu Ohshima

IPC分类号： H05K7/06 ,  H01L21/48 ,  H05K1/11 ,  H05K3/22 ,  H05K3/40 ,  H05K3/46

CPC分类号： H01L21/485 ,  H01L21/4853 ,  H05K3/225 ,  H05K1/111 ,  H05K2201/10287 ,  H05K2201/10704 ,  H05K3/4015 ,  Y10T29/49144 ,  Y10T29/49716 ,  Y10T29/4981

摘要： A method of making an engineering change to a printed wiring board changes connection for a terminal of an electronic component which is mounted on the printed wiring board through a terminal pad. The terminal is electrically connected to a destination through the terminal pad and wiring within the printed wiring board. The present invention places an insulator, including an insulating material and a conductive layer formed thereon, between the terminal and the terminal pad. The electronic component is mounted on the printed wiring board and the terminal is electrically connected to the conductive layer. A discrete wire is placed between the conductive layer and the destination.

摘要翻译： 对印刷电路板进行工程变更的方法通过端子焊盘改变安装在印刷电路板上的电子部件的端子的连接。 端子通过端子焊盘电连接到目的地和印刷线路板内的布线。 本发明在端子和终端焊盘之间设置绝缘体，包括绝缘材料和形成在其上的导电层。 电子部件安装在印刷线路板上，并且端子电连接到导电层。 分立导线放置在导电层和目的地之间。

公开(公告)号：US4785141A

公开(公告)日：1988-11-15

申请号：US124418

申请日：1987-11-18

申请人： Mikio Nishihara ,  Kiyoshi Kuwabara

发明人： Mikio Nishihara ,  Kiyoshi Kuwabara

IPC分类号： H05K1/02 ,  H01L23/538 ,  H05K1/11 ,  H05K3/46

CPC分类号： H01L23/5383 ,  H05K1/112 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H05K1/115 ,  H05K2201/09227 ,  H05K2201/09627 ,  H05K2201/10522 ,  H05K2201/10689 ,  H05K3/4623

摘要： A wiring structure for a termination circuit in which a termination circuit is connected to an integrated circuit through a fixed wiring pattern provided in a leadout layer closest to the mounting surface.

摘要翻译： 一种用于终端电路的布线结构，其中终端电路通过设置在最靠近安装表面的引出层中的固定布线图案连接到集成电路。

公开(公告)号：US4692843A

公开(公告)日：1987-09-08

申请号：US929819

申请日：1986-11-13

申请人： Masaru Matsumoto ,  Mikio Nishihara ,  Kiyoshi Kuwabara

发明人： Masaru Matsumoto ,  Mikio Nishihara ,  Kiyoshi Kuwabara

IPC分类号： H05K3/46 ,  H05K1/14

CPC分类号： H05K3/462 ,  H05K1/0272 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/1025 ,  H05K2201/2036 ,  H05K3/4623 ,  H05K3/4647

摘要： A multilayer printed wiring board having an air gap between neighboring printed wiring boards of the multilayer printed wiring board by inserting plated spacers to both end faces of through-hole pads which are provided to each printed wiring board so that each through-hole pad opposes to another through-hole pad on the neighboring printed wiring board. The spacers opposed to each other are joined together by solder, and each spacer has an end surface having a size being smaller than a size of the end surface of each through-hole pad to provide a drop part at the joint part of the spacers, so that melted solder stays at the drop part not flowing toward the board through the side surface of the through-hole pad when the printed wiring boards are integrated to the multilayer printed wiring board under pressure and high temperature.

摘要翻译： 一种多层印刷线路板，其通过将设置在每个印刷线路板上的通孔焊盘的两个端面插入电镀间隔件，使得每个通孔焊盘与所述多层印刷线路板的相邻的印刷线路板之间具有气隙， 相邻印刷电路板上的另一个通孔焊盘。 彼此相对的间隔件通过焊料接合在一起，并且每个间隔件具有尺寸小于每个通孔焊盘的端面的尺寸的端面，以在间隔件的接合部分处提供液滴部分， 使得当印刷线路板在压力和高温下与多层印刷线路板集成在一起时，熔融的焊料停留在通过通孔焊盘的侧表面而不流向板的液滴部分。

公开(公告)号：US20100187651A1

公开(公告)日：2010-07-29

申请号：US12578382

申请日：2009-10-13

申请人： Yonggang JIN ,  Kiyoshi Kuwabara ,  Xavier Baraton

发明人： Yonggang JIN ,  Kiyoshi Kuwabara ,  Xavier Baraton

IPC分类号： H01L23/495 ,  H01L27/06 ,  H01L21/50

CPC分类号： H01L24/83 ,  H01L21/311 ,  H01L21/4821 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2518 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： Aspects of the invention are directed towards an integrated circuit package and method of forming the same, and more particularly to a redistributed chip packaging for an integrated circuit. The integrated circuit package includes an integrated circuit having a protective material on at least a portion of the integrated circuit. A lead frame is coupled to the integrated circuit and a conductive layer is also coupled to the interconnect. A solder ball is coupled to the conductive layer and a passivation layer is on the conductive layer. Active and passive components are electrically coupled to the integrated circuit.

摘要翻译： 本发明的方面涉及一种集成电路封装及其形成方法，更具体地涉及用于集成电路的重新分配的芯片封装。 集成电路封装包括在集成电路的至少一部分上具有保护材料的集成电路。 引线框架耦合到集成电路，并且导电层也耦合到互连。 焊球与导电层耦合，钝化层位于导电层上。 有源和无源部件电耦合到集成电路。

公开(公告)号：US06706546B2

公开(公告)日：2004-03-16

申请号：US09757052

申请日：2001-01-08

申请人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Kiyoshi Kuwabara ,  Solomon I. Beilin ,  Michael Peters ,  Wen-Chou Vincent Wang ,  Masaaki Inao

发明人： Tetsuzo Yoshimura ,  Yashuhito Takahashi ,  Kiyoshi Kuwabara ,  Solomon I. Beilin ,  Michael Peters ,  Wen-Chou Vincent Wang ,  Masaaki Inao

IPC分类号： H01L2100

CPC分类号： G02B6/10 ,  G02B6/06 ,  G02B6/12002 ,  G02B6/124 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  G02B6/26 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12107 ,  G02B2006/12173 ,  H01L21/6835 ,  H01L23/48 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/167 ,  H01L2221/68345 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0274 ,  H05K1/14 ,  H01L2924/00 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05664

摘要： A method of constructing an electronic circuit assembly comprising forming at least one electrode on a substrate; forming a layer of undercladding material upon the substrate and over the electrode; and forming a wave guide core layer on the layer of cladding material. The wave guide layer is patterned to produce at least one optical wave guide and exposed undercladding material. The method of constructing further includes forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide; forming at least one via aperture through the overcladding material and the undercladding material; and disposing a conductive material in the via aperture to produce an electronic circuit assembly.

摘要翻译： 一种构造电子电路组件的方法，包括在衬底上形成至少一个电极; 在衬底上并在电极上形成下层材料层; 以及在包层材料层上形成波导芯层。 波导层被图案化以产生至少一个光波导和暴露的底层材料。 构造方法还包括在暴露的下包层材料上并在光波导上形成一层外包材料; 通过所述外包层材料和所述下包层材料形成至少一个通孔; 并将导电材料设置在通孔中以产生电子电路组件。

公开(公告)号：US5667401A

公开(公告)日：1997-09-16

申请号：US455532

申请日：1995-05-31

申请人： Kiyoshi Kuwabara ,  Tetsuro Yamada ,  Takeshi Nishiyama ,  Masahiko Sakuraoka

发明人： Kiyoshi Kuwabara ,  Tetsuro Yamada ,  Takeshi Nishiyama ,  Masahiko Sakuraoka

IPC分类号： H01R9/09

CPC分类号： H01R12/716 ,  H01R12/724 ,  H01R12/732 ,  H01R12/75 ,  H01R12/79

摘要： A cable connector includes cables, and jacks attached to ends of the cables. The jacks have contacts connected to the cables. The contacts extend in a first direction substantially perpendicular to a second direction in which the cables extend from the jacks.

摘要翻译： 电缆连接器包括电缆和连接到电缆端部的插座。 插座具有连接到电缆的触点。 触头沿基本上垂直于电缆从插孔延伸的第二方向的第一方向延伸。

公开(公告)号：US5437558A

公开(公告)日：1995-08-01

申请号：US109264

申请日：1993-08-20

申请人： Masahiko Sakuraoka ,  Kouichi Hara ,  Kiyoshi Kuwabara ,  Misao Umematsu

发明人： Masahiko Sakuraoka ,  Kouichi Hara ,  Kiyoshi Kuwabara ,  Misao Umematsu

IPC分类号： H01R13/447 ,  H01R13/631 ,  H01R13/44

CPC分类号： H01R12/7005 ,  H01R13/631

摘要： A connector comprising a plug member having pin-like male contacts and a jack member having female contacts, the jack member being coupled with the plug member by a plug-in connection. A skirt having a plurality of holes is arranged to hold the pin-like male contacts in position. The skirt is supported in the plug member by the locating groove-pin engagement. The locating groove-pin engagement is released by the jack member when the jack member is inserted into the plug member and reestablished by the jack member when the jack member is withdrawn from the plug member. The skirt also has an alignment pin which is received in a locating hole of the jack member when the jack member is inserted into the plug member. Therefore, it is possible to insert the jack member in the plug member without the pin-like male contacts being bent, as well as to easily withdraw the jack member from the plug member.

摘要翻译： 一种连接器，包括具有销状阳触头的插头构件和具有阴触头的插座构件，插座构件通过插入式连接与插头构件联接。 具有多个孔的裙部被布置成将销状阳接触件保持在适当位置。 裙部通过定位槽销接合支撑在插头构件中。 当插座构件从插头构件拔出时，插座构件插入到插头构件中并由插座构件重新设置时，定位槽 - 销接合被插座构件释放。 裙部还具有定位销，当定位销插入到插头部件中时，该定位销被容纳在插座部件的定位孔中。 因此，可以将插座构件插入插头构件中，而不会使针状阳接触件弯曲，并且能够容易地从插头构件中拔出插座构件。