公开(公告)号：US07151850B2

公开(公告)日：2006-12-19

申请号：US10281969

申请日：2002-10-29

申请人： Noriyuki Suzuki ,  Hiroaki Fujiwara ,  Masashi Yokomori

发明人： Noriyuki Suzuki ,  Hiroaki Fujiwara ,  Masashi Yokomori

IPC分类号： G06K9/62 ,  G06K9/00

CPC分类号： G09B5/00 ,  G09B9/00

摘要： Teaching data setting apparatus and a method for image processing are provided to enable setting optimum teaching data to achieve reduction in errors and error detection in the image processing. A subject teaching data generating section 1 uses databases of subject attributes and recognition operation conditions for a plurality of pieces of teaching data representing all possible combinations of the subject attributes and the recognition operation conditions. A teaching data candidate selecting section 2 selects, from the generated plurality of pieces of teaching data, teaching data candidates related to a subject to be mounted and a mounting machine for use. A subject image input section 3 is supplied with a simple subject image representing only the subject. An evaluation image generating section 4 generates predetermined evaluation images by using the simple subject image. A teaching data determining section 5 is supplied with the teaching data candidates and the evaluation images to compare and study both of them, and then determines a piece of teaching data as the optimum teaching data for the subject for output.

摘要翻译： 提供教学数据设定装置和图像处理方法，以便能够设置最佳教学数据，以实现图像处理中的误差和错误检测的减少。 主题教学数据生成部1使用表示对象属性和识别操作条件的所有可能组合的多个教学数据的对象属性和识别操作条件的数据库。 教学数据候补选择部分2从所生成的多条教学数据中选择与要安装的对象相关的教学数据候选和使用的安装机。 被摄体图像输入部3被提供有仅代表对象的简单被摄体图像。 评价图像生成部4通过使用简单被摄体图像来生成规定的评价图像。 向教学数据确定部分5提供教学数据候选和评估图像以比较和研究它们，然后确定一条教学数据作为用于输出的对象的最佳教学数据。

公开(公告)号：US06665854B2

公开(公告)日：2003-12-16

申请号：US09995635

申请日：2001-11-29

申请人： Hiroaki Fujiwara ,  Masaki Okamoto ,  Keiji Hanada ,  Masashi Yokomori

发明人： Hiroaki Fujiwara ,  Masaki Okamoto ,  Keiji Hanada ,  Masashi Yokomori

IPC分类号： G06F1750

CPC分类号： H05K13/08

摘要： A component/board retriever 2 retrieves component/board data from CAD data supplied to a CAD data input unit 1. A circuit board information storage 3 stores various board information and outputs board information based on board design data. A component information storage 4 stores various component information and outputs component information based on component design data. A mount scheme (process) requirement storage 6 stores requirements for mounting processes. A mounting device requirements storage 7 stores requirements for mounting devices. A design analyzer 8 analyzes whether the designed circuit board is achievable or not under requirements supplied by an applied mount requirement input unit 5 and outputs the analysis results through a check result output unit 9 to a designer. Thus, changes in the mounting process requirement and/or the mounting device requirement can be easily reflected on a design check. Therefore, the number of quality checks onto the actual prototype can be reduced, and the circuit board that satisfies the target quality can be designed in the early stage of designing.

摘要翻译： 组件/板检索器2从提供给CAD数据输入单元1的CAD数据中检索组件/板数据。电路板信息存储器3存储各种板信息，并基于板设计数据输出板信息。 组件信息存储器4存储各种组件信息，并且基于组件设计数据输出组件信息。 安装方案（过程）要求存储6存储安装过程的要求。 安装设备要求存储7存储安装设备的要求。 设计分析器8分析所设计的电路板是否可以由应用的安装要求输入单元5提供的要求实现，并且通过检查结果输出单元9将分析结果输出给设计者。 因此，可以在设计检查中容易地反映安装过程要求和/或安装装置要求的变化。 因此，可以减少对实际原型的质量检查数量，可以在设计初期设计满足目标质量的电路板。

公开(公告)号：US08929092B2

公开(公告)日：2015-01-06

申请号：US13504281

申请日：2010-10-28

申请人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

发明人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda

IPC分类号： H05K7/00 ,  H05K3/10 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H05K3/38 ,  H05K3/18

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/82385 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/107 ,  H05K3/184 ,  H05K3/38 ,  H05K2201/0373 ,  H05K2201/0391 ,  H05K2201/09736 ,  H05K2201/2072 ,  H05K2203/0307 ,  H05K2203/0565 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

摘要： A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.

摘要翻译： 电路板包括在绝缘基底的表面上具有布线部分和焊盘部分的电路。 电路被配置为使得导体嵌入形成在基底绝缘体的表面中的电路凹槽中，并且导体的表面粗糙度在电路的布线部分和焊盘部分中是不同的。 在这种情况下，优选的是，焊盘部中的导体的表面粗糙度大于布线部中的导体的表面粗糙度。

公开(公告)号：US08516145B2

公开(公告)日：2013-08-20

申请号：US12838210

申请日：2010-07-16

申请人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

发明人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

IPC分类号： G06F15/16

CPC分类号： G03F7/70525 ,  G03F7/70508 ,  G03F7/70991

摘要： An apparatus which transmits data generated by a device manufacturing apparatus to at least one terminal, comprises a communication unit, a transmission request processor configured to accept or reject a transmission request which the communication unit has received from the terminal, and a transmission controller configured to control the communication unit to transmit, in response to a transmission request accepted by the transmission request processor, data corresponding to the transmission request to a terminal, of the at least one terminal, which has transmitted the transmission request, wherein the transmission request processor accepts a new transmission request if a sum of transmission rates of the respective data concurrently transmitted from the communication unit in response to transmission requests which the transmission request processor has already accepted and a transmission rate at which data is transmitted in response to the new transmission request does not exceed a preset allowable transmission rate.

摘要翻译： 将由装置制造装置生成的数据发送到至少一个终端的装置包括通信单元，被配置为接收或拒绝通信单元从终端接收到的发送请求的发送请求处理器，以及配置为 控制所述通信单元响应于所述传输请求处理器接受的传输请求，将已经发送了所述传输请求的所述至少一个终端的发送请求的数据发送到终端，其中，所述传输请求处理器接受 如果根据传输请求处理器已经接受的传输请求以及响应于新的传输请求发送数据的传输速率而从通信单元同时发送的各个数据的传输速率的总和，则发送新的传输请求 不超过 复位允许传输速率。

公开(公告)号：US20110029685A1

公开(公告)日：2011-02-03

申请号：US12838210

申请日：2010-07-16

申请人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

发明人： Daisuke Itai ,  Hiroaki Fujiwara ,  Mitsuhiro Masuda ,  Kunitaka Ozawa

IPC分类号： G06F15/16

CPC分类号： G03F7/70525 ,  G03F7/70508 ,  G03F7/70991

摘要： An apparatus which transmits data generated by a device manufacturing apparatus to at least one terminal, comprises a communication unit, a transmission request processor configured to accept or reject a transmission request which the communication unit has received from the terminal, and a transmission controller configured to control the communication unit to transmit, in response to a transmission request accepted by the transmission request processor, data corresponding to the transmission request to a terminal, of the at least one terminal, which has transmitted the transmission request, wherein the transmission request processor accepts a new transmission request if a sum of transmission rates of the respective data concurrently transmitted from the communication unit in response to transmission requests which the transmission request processor has already accepted and a transmission rate at which data is transmitted in response to the new transmission request does not exceed a preset allowable transmission rate.

摘要翻译： 将由装置制造装置生成的数据发送到至少一个终端的装置包括通信单元，被配置为接收或拒绝通信单元从终端接收到的发送请求的发送请求处理器，以及配置为 控制所述通信单元响应于所述传输请求处理器接受的传输请求，将已经发送了所述传输请求的所述至少一个终端的发送请求的数据发送到终端，其中，所述传输请求处理器接受 如果根据传输请求处理器已经接受的传输请求以及响应于新的传输请求发送数据的传输速率而从通信单元同时发送的各个数据的传输速率的总和，则新的传输请求 不超过 复位允许传输速率。

公开(公告)号：US20100218982A1

公开(公告)日：2010-09-02

申请号：US12675856

申请日：2008-06-30

申请人： Hiroaki Fujiwara ,  Masao Imai ,  Yuki Kitai

发明人： Hiroaki Fujiwara ,  Masao Imai ,  Yuki Kitai

IPC分类号： H05K1/09 ,  C08L63/00 ,  C08K5/02 ,  C08K5/3417 ,  C08K5/06 ,  C08K5/13 ,  C08K3/36 ,  C08K3/22 ,  B32B27/04 ,  B32B15/092

CPC分类号： H05K1/0373 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08K5/0025 ,  C08K5/0066 ,  C08K5/03 ,  C08K5/06 ,  C08K5/315 ,  C08K5/3417 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04 ,  C09D163/00 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31529 ,  C08L2666/14 ,  C08L2666/22

摘要： It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as essential components, the epoxy resin composition having excellent dielectric characteristics and exhibiting high heat resistance while maintaining flame retardancy. To achieve this object, the epoxy resin composition of the present invention is a thermosetting resin composition composed of a resin varnish containing (A) an epoxy compound having a number-average molecular weight of 1000 or less and containing at least two epoxy groups in the molecule without containing any halogen atoms, (B) a polyphenylene ether having a number-average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) a curing catalyst and (E) a halogen flame retardant, wherein all of the components (A) to (C) are dissolved in the resin varnish, while the component (E) is dispersed without being dissolved in the resin varnish.

摘要翻译： 本发明的目的是提供一种含有环氧化合物，低分子量苯酚改性聚苯醚和氰酸酯化合物作为必要组分的环氧树脂组合物，该环氧树脂组合物具有优异的介电特性并表现出高热 阻力同时保持阻燃性。 为了达到这个目的，本发明的环氧树脂组合物是一种热固性树脂组合物，其由含有（A）数均分子量为1000以下并且含有至少两个环氧基的环氧化合物的树脂清漆组成 分子，不含有任何卤素原子，（B）数均分子量为5000以下的聚苯醚，（C）氰酸酯化合物，（D）固化催化剂和（E）卤素阻燃剂，其中全部 的组分（A）至（C）溶解在树脂清漆中，而组分（E）分散而不溶解在树脂清漆中。

公开(公告)号：US20080168413A1

公开(公告)日：2008-07-10

申请号：US11885831

申请日：2006-01-20

申请人： Manabu Kakino ,  Toru Okazaki ,  Teppei Iwase ,  Kazunori Takada ,  Hiroaki Fujiwara ,  Tomoaki Kuroishi

发明人： Manabu Kakino ,  Toru Okazaki ,  Teppei Iwase ,  Kazunori Takada ,  Hiroaki Fujiwara ,  Tomoaki Kuroishi

IPC分类号： G06F17/50 ,  H05K3/32

CPC分类号： G06F17/5018 ,  G06F2217/40 ,  G06F2217/80 ,  H05K1/181 ,  H05K3/0005

摘要： A method for analyzing a component mounting board comprising a step (A) for forming a multilayer substrate shell model of a multilayer wiring board, a step (B) for forming a multilayer component shell model divided by element division lines based on the bonding position of a component to the surface of the multilayer wiring board, step (C) for redividing the mounting position of the component in the multilayer substrate shell model, and step (D) for forming an analysis model by bonding the neutral plane of the substrate and the neutral plane of the component through one of a beam element and a solid element, i.e. a bonding element equivalent to mounting conditions of the component, wherein precision of analysis is enhanced while reducing computation cost by performing calculation while imparting boundary conditions to the analysis model.

摘要翻译： 一种用于分析组件安装板的方法，包括用于形成多层布线板的多层基板外壳模型的步骤（A），用于形成由元件划分线划分的多层部件壳模型的步骤（B） 多层布线基板的表面的成分，对多层基板外壳模型中的部件的安装位置进行再分割的工序（C），以及通过将基板的中性面粘合而形成分析模型的工序（D） 通过束元件和固体元件中的一个，即与元件的安装条件相当的结合元件，其中分析的精度被增强，同时通过在分析模型赋予边界条件的同时进行计算来降低计算成本。

公开(公告)号：US09206308B2

公开(公告)日：2015-12-08

申请号：US13637629

申请日：2011-03-22

申请人： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

发明人： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

IPC分类号： H05K1/03 ,  B32B27/04 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08K3/10 ,  C08K3/22 ,  C08L63/00 ,  C08G59/22 ,  C08G59/30 ,  C08G59/38 ,  C08G59/62 ,  C08G59/40 ,  C08J5/24 ,  C08K9/02 ,  C08K5/5313 ,  C08K5/5397

CPC分类号： C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

摘要： The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

摘要翻译： 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

公开(公告)号：US09082635B2

公开(公告)日：2015-07-14

申请号：US13698975

申请日：2011-05-11

申请人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Yuko Konno

发明人： Shingo Yoshioka ,  Hiroaki Fujiwara ,  Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Yuko Konno

IPC分类号： H05K1/11 ,  H01L25/065 ,  H01L21/48 ,  H01L21/683 ,  H01L23/495 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H05K3/18 ,  H01L25/00 ,  H05K1/18 ,  C23C18/16 ,  C23C18/18 ,  H01L23/31 ,  H05K3/28 ,  H05K3/46

CPC分类号： H05K3/184 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1893 ,  C25D7/0607 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32145 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06568 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K1/185 ,  H05K3/10 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0264 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/0769 ,  H05K2203/1407 ,  H05K2203/1469 ,  Y02P70/611 ,  H05K3/4661 ,  H01L2924/00

摘要： A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.

摘要翻译： 提供一种布线方法，其中绝缘层形成在半导体器件1的暴露多个连接端子的表面上，树脂膜形成在绝缘层的表面上，深度等于 或超过树脂膜的厚度由树脂膜的表面侧形成，使得沟槽在要连接的连接端子附近通过，此外，连通孔将从该部分到达要连接的连接端子 形成沟槽附近的沟槽。

公开(公告)号：US20120225876A1

公开(公告)日：2012-09-06

申请号：US13508905

申请日：2010-11-11

申请人： Yoshihiro Horiuchi ,  Kiyoto Sawamura ,  Hiroaki Fujiwara

发明人： Yoshihiro Horiuchi ,  Kiyoto Sawamura ,  Hiroaki Fujiwara

IPC分类号： A61K31/439 ,  C07D413/12 ,  A61K31/5377 ,  C07D401/12 ,  A61K31/497 ,  A61K31/506 ,  A61K31/501 ,  A61P3/10 ,  A61P3/08 ,  A61P5/48 ,  A61P3/06 ,  A61P9/12 ,  A61P9/10 ,  A61P3/04 ,  A61P27/06 ,  A61P19/10 ,  A61P3/00 ,  A61P9/00 ,  A61P25/28 ,  A61P25/24 ,  A61P25/22 ,  C07D221/22

CPC分类号： C07D451/06

摘要： Disclosed is a compound represented by formula (1) or a pharmacologically acceptable salt thereof (In the formula, A represents a group that is represented by formula (A-1); R1a and R1b may be the same or different and each independently represents a C1-6 alkyl group which may be substituted by one to three halogen atoms; m and n each independently represents an integer of 0-5; X1 represents a hydroxyl group or an aminocarbonyl group; Z1 represents a single bond or the like; and R2 represents an optionally substituted C1-6 alkyl group, an optionally substituted C6-10 aryl group or the like.)

摘要翻译： 公开了由式（1）表示的化合物或其药理学上可接受的盐（式中，A表示由式（A-1）表示的基团; R 1a和R 1b可以相同或不同，各自独立地表示 可被一至三个卤素原子取代的C 1-6烷基; m和n各自独立地表示0-5的整数; X1表示羟基或氨基羰基; Z1表示单键等; R2表示 表示任选取代的C 1-6烷基，任选取代的C 6-10芳基等）