公开(公告)号：US09159651B2

公开(公告)日：2015-10-13

申请号：US14041169

申请日：2013-09-30

申请人： Samsung Electronics Co., Ltd.

发明人： Teak-Hoon Lee ,  Ji-Hwang Kim ,  Sang-Wook Park ,  Young-Kun Jee

IPC分类号： H01L23/40 ,  H01L23/52 ,  H01L29/40 ,  H01L23/48

CPC分类号： H01L23/481 ,  H01L25/0657 ,  H01L2224/13 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311

摘要： A semiconductor package includes a first semiconductor chip on a substrate and having a plurality of through-silicon vias (TSVs). A second semiconductor chip having an active layer is on the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the active layer. Connection terminals extend through the adhesive layer and are connected to the TSVs and the active layer. Side surfaces of the adhesive layer are aligned with side surfaces of the second semiconductor chip.

摘要翻译： 半导体封装包括在衬底上的第一半导体芯片，并且具有多个通硅通孔（TSV）。 具有有源层的第二半导体芯片在第一半导体芯片上。 粘合剂层位于第一半导体芯片和有源层之间。 连接端子延伸穿过粘合剂层并连接到TSV和有源层。 粘合剂层的侧表面与第二半导体芯片的侧表面对齐。

公开(公告)号：US08987904B2

公开(公告)日：2015-03-24

申请号：US13900612

申请日：2013-05-23

申请人： Samsung Electronics Co., Ltd

发明人： Gi-Jun Park ,  Won-Keun Kim ,  Teak-Hoon Lee ,  Chang-Seong Jeon ,  Young-Kun Jee

IPC分类号： H01L23/498 ,  H01L23/48 ,  H01L23/31 ,  H01L21/56 ,  H01L25/10 ,  H01L23/00

CPC分类号： H01L24/81 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L21/673 ,  H01L21/67346 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00

摘要： A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.

公开(公告)号：US09324683B2

公开(公告)日：2016-04-26

申请号：US14318643

申请日：2014-06-28

申请人： Samsung Electronics Co., Ltd.

发明人： Tae-Hong Min ,  Young-Kun Jee ,  Tae-Je Cho

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/433 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L24/83 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/433 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/2732 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83005 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/9211 ,  H01L2224/9221 ,  H01L2224/92225 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/07802

摘要： In one embodiment, a semiconductor package includes a circuit substrate, a plurality of semiconductor chips stacked on the circuit substrate, insulating adhesive patterns interposed between the semiconductor chips, a heat slug provided on an uppermost semiconductor chip and adhered to the uppermost semiconductor chip by a heat dissipative adhesive pattern, and a mold structure provided on the circuit substrate to cover sidewalls of the semiconductor chips, the insulating adhesive patterns, the heat dissipative adhesive pattern and the heat slug. A failure of the semiconductor package during a manufacturing process of the mold structure may be reduced. The semiconductor package may therefore have good operating characteristics and reliability.

摘要翻译： 在一个实施例中，半导体封装包括电路基板，堆叠在电路基板上的多个半导体芯片，插入在半导体芯片之间的绝缘粘合剂图案，设置在最上半导体芯片上的散热片，并通过 散热粘合剂图案，以及设置在电路基板上以覆盖半导体芯片的侧壁，绝缘粘合剂图案，散热粘合剂图案和热块的模具结构。 在模具结构的制造过程中半导体封装的故障可能会降低。 因此，半导体封装可具有良好的工作特性和可靠性。

公开(公告)号：US09082871B2

公开(公告)日：2015-07-14

申请号：US14619155

申请日：2015-02-11

申请人： Samsung Electronics Co., Ltd.

发明人： Gi-Jun Park ,  Won-Keun Kim ,  Teak-Hoon Lee ,  Chang-Seong Jeon ,  Young-Kun Jee

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L21/673 ,  H01L23/48 ,  H01L21/50

CPC分类号： H01L24/81 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L21/673 ,  H01L21/67346 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00

摘要： A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.

摘要翻译： 半导体封装的基板包括具有第一表面和彼此面对的第二表面的第一布线基板，其上安装有半导体芯片的第一表面，第一支撑载体和将第二表面和第一支撑件连接的粘合膜 载体

公开(公告)号：US20140291854A1

公开(公告)日：2014-10-02

申请号：US14041169

申请日：2013-09-30

申请人： Samsung Electronics Co., Ltd.

发明人： Teak-Hoon Lee ,  Ji-Hwang Kim ,  Sang-Wook Park ,  Young-Kun Jee

IPC分类号： H01L23/48

CPC分类号： H01L23/481 ,  H01L25/0657 ,  H01L2224/13 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311

摘要： A semiconductor package includes a first semiconductor chip on a substrate and having a plurality of through-silicon vias (TSVs). A second semiconductor chip having an active layer is on the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the active layer. Connection terminals extend through the adhesive layer and are connected to the TSVs and the active layer. Side surfaces of the adhesive layer are aligned with side surfaces of the second semiconductor chip.

摘要翻译： 半导体封装包括在衬底上的第一半导体芯片，并且具有多个穿硅通孔（TSV）。 具有有源层的第二半导体芯片在第一半导体芯片上。 粘合剂层位于第一半导体芯片和有源层之间。 连接端子延伸穿过粘合剂层并连接到TSV和有源层。 粘合剂层的侧表面与第二半导体芯片的侧表面对齐。

公开(公告)号：US09721926B2

公开(公告)日：2017-08-01

申请号：US14825403

申请日：2015-08-13

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Yeong-Hwan Choe ,  Tae-Joo Hwang ,  Tae-Hong Min ,  Young-Kun Jee ,  Sang-Uk Han

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/48 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L24/05 ,  H01L24/06 ,  H01L24/10 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/71 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/06156 ,  H01L2224/10125 ,  H01L2224/131 ,  H01L2224/14156 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75305 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/014

摘要： A semiconductor device includes at least first and second semiconductor chips stacked on each other along a first direction, at least one silicon-through-via (TSV) through at least the first semiconductor chip of the first and second semiconductor chips, a contact pad on the at least one TSV of the first semiconductor chip, the contact pad electrically connecting the TSV of the first semiconductor chip to the second semiconductor chip, and a plurality of dummy pads on the first semiconductor chip, the plurality of dummy pads being spaced apart from each other and from the contact pad along a second direction, and the dummy pads having same heights as the contact pads as measured between respective top and bottom surfaces along the first direction.