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12 条记录 (耗时 0.026 秒)

    Wafer processing sheet
    3.
    发明授权
    Wafer processing sheet 有权
    晶圆加工板

    公开(公告)号：US09165815B2

    公开(公告)日：2015-10-20

    申请号：US13326103

    申请日：2011-12-14

    申请人： Se Ra Kim ,  Hyo Sook Joo ,  Suk Ky Chang ,  Jung Sup Shim

    发明人： Se Ra Kim ,  Hyo Sook Joo ,  Suk Ky Chang ,  Jung Sup Shim

    IPC分类号： H01L21/762 ,  B32B27/40 ,  H01L21/683

    CPC分类号： H01L21/6836 ,  C09J7/29 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2433/006 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/265 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31935

    摘要： Provided is a sheet for processing a wafer. The sheet can exhibit excellent heat resistance and dimensional stability, prevent breakage of a wafer in response to residual stress due to excellent stress relaxation properties, inhibit damage to or dispersion of the wafer due to application of a non-uniform pressure, and also exhibit excellent cuttability. The sheet can effectively prevent a blocking phenomenon from occurring during wafer processing. For these reasons, the sheet can be useful for processing a wafer in various wafer preparation processes such as dicing, back-grinding and picking-up.

    摘要翻译： 提供了一种用于处理晶片的片材。 该片材可以表现出优异的耐热性和尺寸稳定性，防止由于优异的应力松弛性而响应于残余应力而导致的晶片破裂，抑制由于施加不均匀的压力而导致的晶片的损坏或分散，并且还表现出优异的 可切割性。 片材可以有效地防止在晶片加工过程中发生阻塞现象。 由于这些原因，该片材可用于在各种晶片制备工艺（例如切割，后研磨和拾取）中处理晶片。

    DICING DIE BONDING FILM AND DICING METHOD
    9.
    发明申请
    DICING DIE BONDING FILM AND DICING METHOD 有权
    定位电路和定位方法

    公开(公告)号：US20100291739A1

    公开(公告)日：2010-11-18

    申请号：US12681572

    申请日：2008-10-15

    申请人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

    发明人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

    IPC分类号： H01L21/60 ,  H01L21/78 ,  H01L21/56 ,  B32B5/04

    CPC分类号： C09J163/00 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2924/1434 ,  H01L2924/37001 ,  Y10T428/24

    摘要： The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.

    摘要翻译： 本发明涉及一种切割模片接合薄膜，其能够在任何半导体封装工艺中保持良好的可加工性和可靠性，例如粘合性能，间隙填充性能和拾取性能，同时控制切割工艺中的毛刺发生率 模具污染和切割方法。 具体地说，本发明的特征在于优化切割芯片接合薄膜的拉伸特性，或者在切割工艺中对芯片接合薄膜的部分进行切割，并通过扩展工艺进行分离。 因此，本发明可以调节膜的物理性能，从而具有最大化的粘合性，吸收性和间隙填充性，而不受任何限制，同时控制切割过程中的毛刺发生率和模具的污染。 因此，可以极好地保持包装过程中的可操作性和可靠性。

    Dicing die bonding film and dicing method
    10.
    发明授权
    Dicing die bonding film and dicing method 有权
    切片贴膜和切割方法

    公开(公告)号：US08541289B2

    公开(公告)日：2013-09-24

    申请号：US12681572

    申请日：2008-10-15

    申请人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

    发明人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

    IPC分类号： H01L21/00

    CPC分类号： C09J163/00 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2924/1434 ,  H01L2924/37001 ,  Y10T428/24

    摘要： The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.

    摘要翻译： 本发明涉及一种切割模片接合薄膜，其能够在任何半导体封装工艺中保持良好的可加工性和可靠性，例如粘合性能，间隙填充性能和拾取性能，同时控制切割工艺中的毛刺发生率，因此 模具污染和切割方法。 具体地说，本发明的特征在于优化切割芯片接合薄膜的拉伸特性，或者在切割工艺中对芯片接合薄膜的部分进行切割，并通过扩展工艺进行分离。 因此，本发明可以调节膜的物理性能，从而具有最大化的粘合性，吸收性和间隙填充性，而不受任何限制，同时控制切割过程中的毛刺发生率和模具的污染。 因此，可以极好地保持包装过程中的可操作性和可靠性。