公开(公告)号：US4313026A

公开(公告)日：1982-01-26

申请号：US88467

申请日：1979-10-26

申请人： Seiichi Yamada ,  Nobuo Kamehara ,  Kaoru Hashimoto ,  Hiromitsu Yokoyama ,  Koichi Niwa ,  Kyohei Murakawa

发明人： Seiichi Yamada ,  Nobuo Kamehara ,  Kaoru Hashimoto ,  Hiromitsu Yokoyama ,  Koichi Niwa ,  Kyohei Murakawa

IPC分类号： B32B15/04 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K3/4664 ,  H01L23/15 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011

摘要： A multilayer circuit board (10) for putting semiconductor devices thereon consists of conductor layers (6, 60, 61, 62, 63) made of a metal selected from the group consisting of Au, Ag, Cu and an alloy thereof, insulating material (2, 7) made of glass-ceramic and an alumina sintered plate (1). The glass-ceramic is comprised of borosilicate glass and alumina and has a low dielectric constant and a thermal expansion coefficient approaching that of the semiconductor devices. The alumina sintered plate (1) is placed between the ground and supply voltage conductor layers (62, 63) and the signal conductor layers (60).

摘要翻译： 用于将半导体器件放置在其上的多层电路板（10）由选自Au，Ag，Cu及其合金的金属制成的导体层（6,60,61,62,63），绝缘材料（ 2，7）由玻璃陶瓷和氧化铝烧结板（1）制成。 玻璃陶瓷由硼硅酸盐玻璃和氧化铝组成，并且具有接近半导体器件的低介电常数和热膨胀系数。 氧化铝烧结板（1）放置在接地电源电压导体层（62,63）和信号导体层（60）之间。

公开(公告)号：US4217337A

公开(公告)日：1980-08-12

申请号：US955761

申请日：1978-10-30

申请人： Seiichi Yamada ,  Nobuo Kamehara ,  Kyohei Murakawa

发明人： Seiichi Yamada ,  Nobuo Kamehara ,  Kyohei Murakawa

IPC分类号： C04B33/24 ,  C01F7/46 ,  C04B33/26 ,  C04B35/111 ,  C04B41/53 ,  C04B41/91 ,  H01B3/12 ,  H05K1/03 ,  C01F7/02 ,  C04B35/44

CPC分类号： C04B41/009 ,  C01F7/46 ,  C04B35/111 ,  C04B41/5353 ,  C04B41/91

摘要： Disclosed is an alumina substrate having a high density, a high degree of surface smoothness and excellent dielectric properties and a process for its manufacture. The process comprises prefiring a green sheet prepared from alumina powder at an elevated temperature, for example between 1200.degree. and 1350.degree. C., to remove combustible substances from the sheet, treating the resultant prefired substrate with an acid aqueous solution to eliminate acid-soluble and decomposable substances from the substrate, and firing the acid-treated substrate at an elevated temperature, for example between 1500.degree. and 1650.degree. C.

摘要翻译： 公开了具有高密度，高表面平滑度和优异的介电性能的氧化铝基底及其制造方法。 该方法包括在升高的温度例如1200至1350℃之间预先制备由氧化铝粉末制备的生片，以从片中除去可燃物质，用酸性水溶液处理所得预烧底物以消除酸溶性 和可分解物质，并且在升高的温度例如在1500至1650℃之间焙烧酸处理的基材。

公开(公告)号：US4346516A

公开(公告)日：1982-08-31

申请号：US252214

申请日：1981-04-08

申请人： Kishio Yokouchi ,  Hiromi Ogawa ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa ,  Kyohei Murakawa

发明人： Kishio Yokouchi ,  Hiromi Ogawa ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa ,  Kyohei Murakawa

IPC分类号： H05K3/46 ,  H01L21/48 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/00 ,  H05K3/36

CPC分类号： H05K3/4046 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/15 ,  H01L23/5384 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/11334 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2203/0195 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49153 ,  Y10T29/49694

摘要： A method of forming a ceramic circuit substrate allowing mounting of high integration density semiconductor elements. The method provides a multilayered ceramic circuit substrate having via holes formed with high accuracy and high integration density wiring patterns by forming metallic conductive balls to connect the conductive wiring patterns of upper and lower layers; a ball arranging plate having many holes placing on a green sheet uniformly in close contact; filling the holes of the plate with the embedding the conductive balls by pressure into the green sheet; and thereafter baking the green sheet individually or in a stacked layered arrangement.

摘要翻译： 一种形成陶瓷电路基板的方法，允许安装高集成度密度的半导体元件。 该方法通过形成金属导电球以连接上层和下层的导电布线图案，提供具有形成有高精度和高集成度的布线图案的通孔的多层陶瓷电路基板; 具有多个孔的球排列板，其均匀地放置在生片上; 通过压力将导电球嵌入生片中来填充板的孔; 然后单独地或以堆叠的层叠布置烘烤生片。

公开(公告)号：US5629269A

公开(公告)日：1997-05-13

申请号：US332479

申请日：1994-10-31

申请人： Kazunori Yamanaka ,  Takuya Uzumaki ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Kazunori Yamanaka ,  Takuya Uzumaki ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H01L39/24 ,  B05D5/12 ,  B05D1/32

CPC分类号： H01L39/2461 ,  Y10S505/741

摘要： Disclosed is a process for forming a super-conducting film, which a multi-layer metal film (buffer film) is formed at a specific temperature on a ceramic substrate and a superconducting film is formed at a specific temperature on the multi-layer metal film. According to this process, a superconducting film having a high critical temperature can be formed over the ceramic substrate while controlling or suppressing the occurrence of a chemical reaction between the substrate and the superconducting film, and required superconducting performances can be manifested or exhibited.

摘要翻译： 公开了一种用于形成超导膜的方法，其中在特定温度下在陶瓷基板上形成多层金属膜（缓冲膜），并且在特定温度下在多层金属膜上形成超导膜 。 根据该方法，可以在陶瓷基板上形成具有高临界温度的超导膜，同时控制或抑制基板与超导膜之间的化学反应的发生，并且可以显示或显示所需的超导性能。

公开(公告)号：US5081070A

公开(公告)日：1992-01-14

申请号：US268195

申请日：1989-01-30

申请人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

发明人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

IPC分类号： H01L39/02 ,  B32B18/00 ,  C01G1/00 ,  C01G3/00 ,  C04B35/00 ,  C04B35/45 ,  H01B12/00 ,  H01B13/00 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L39/06 ,  H01L39/24 ,  H05K1/09

CPC分类号： H01L21/4846 ,  B32B18/00 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  C04B37/005 ,  C04B37/006 ,  H01L21/76891 ,  H01L23/49888 ,  H01L39/2429 ,  C04B2235/483 ,  C04B2235/6567 ,  C04B2237/06 ,  C04B2237/066 ,  C04B2237/09 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/59 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

摘要翻译： 提供了一种超导电路板，其包括含有超过99重量％的氧化铝的烧结氧化铝板和形成在氧化铝板上的超导陶瓷的互连图案。 通过在用于形成互连图案的糊料中添加Ti或Si偶联剂来改善互连图案与氧化铝板的粘合性。 使用铜粉代替氧化铜粉末作为糊料中形成超导陶瓷的成分有利于印刷和获得均匀的超导陶瓷图案。

公开(公告)号：US5049541A

公开(公告)日：1991-09-17

申请号：US382180

申请日：1989-07-19

申请人： Takuya Uzumaki ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Takuya Uzumaki ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： C04B35/45 ,  H01L39/24

CPC分类号： C04B35/4517 ,  C04B35/4525 ,  H01L39/2477 ,  Y10S505/782

摘要： Superconductors of the Bi-Pb-Sr-Ca-Cu-O system and Tl-Pb-Ba-Ca-Cu-O system having a high Tc phase (about 110K and about 125K, respectively, or more) at a high proportion are obtained by adding a calcium compound which forms CaO and a liquid phase at a temperature for firing the superconductors, e.g., Ca.sub.2 PbO.sub.x (x=3 or 4); or by starting form a composition represented by the formula: Bi.sub.2 Pb.sub.(n-1)/2 Sr.sub.2 Ca.sub.n Cu.sub.n+1 O.sub.b, or Tl.sub.2 Pb.sub.(n-1)/2 Ba.sub.2 Ca.sub.n Cu.sub.n+1 Ob where 2.ltoreq.n.ltoreq.10, 5.ltoreq.b.ltoreq.40.5, i.e., at a ratio of Ca:Pb=2:1.

公开(公告)号：US4761325A

公开(公告)日：1988-08-02

申请号：US762310

申请日：1985-08-02

申请人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

发明人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

IPC分类号： C03C10/00 ,  C04B35/14 ,  C04B35/16 ,  C04B35/18 ,  C04B35/632 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4667 ,  C03C10/0009 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H05K1/0306 ,  H05K3/46 ,  H05K3/4629 ,  C03C2214/04 ,  C03C2214/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/092 ,  H05K2203/086 ,  H05K2203/088 ,  H05K2203/1126 ,  H05K3/1291 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252

摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

公开(公告)号：US06528346B2

公开(公告)日：2003-03-04

申请号：US09749521

申请日：2000-12-28

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC分类号： H01L2148

CPC分类号： B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05599

摘要： First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate 10. The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.

摘要翻译： 制备第一和第二球形成板。 第一板的空腔和第二板20的空腔分别用焊膏填充。 第一板和第二板相互放置成面对的关系，并加热形成金属球，每个金属球对应于第一板的一个空腔中的焊膏的总金属成分和第二板中的一个空腔。 金属球形成在下板10的空腔中。金属球从第一板的空腔传送到要在其上形成凸块的装置。

公开(公告)号：US5458709A

公开(公告)日：1995-10-17

申请号：US867513

申请日：1992-04-13

申请人： Hiroshi Kamezaki ,  Masato Wakamura ,  Kishio Yokouchi ,  Nobuo Kamehara

发明人： Hiroshi Kamezaki ,  Masato Wakamura ,  Kishio Yokouchi ,  Nobuo Kamehara

IPC分类号： H05K1/03 ,  H01L21/48 ,  H01L23/15 ,  H05K3/46 ,  B32B18/00

CPC分类号： H01L23/15 ,  H01L21/4807 ,  H01L2924/0002 ,  H01L2924/09701

摘要： A process for manufacturing a multi-layer glass ceramic substrate which includes the steps of forming green sheets containing ceramic powders and glass powders as main ingredients, laminating the green sheets, and firing the laminated green sheets to form a multi-layer glass ceramic substrate, wherein at least one green sheet containing porous glass powders as a part of the glass powders, is provided to control the shrinkage of the green sheets and prevent cracks or delamination. The preferred process includes the steps of forming a single layer by i) forming first green sheets containing ceramic powders, glass powders, hollow glass spheres and porous glass powders as main ingredients, ii) forming an interconnection layer on each of the first green sheets, and iii) laminating the first green sheets with the interconnection layer; sandwiching the signal layer between upper and lower green sheets containing ceramic powders and glass powders as main ingredients; and firing the sandwiched signal layer to form the multi-layer glass ceramic substrate.

摘要翻译： 一种多层玻璃陶瓷基板的制造方法，其特征在于，包括以下工序：形成含有陶瓷粉末和玻璃粉末的生片，作为主要成分，层叠生片，烧成层叠的生片以形成多层玻璃陶瓷基板， 其中提供至少一个含有多孔玻璃粉末作为玻璃粉末的一部分的生片，以控制生片的收缩并防止裂纹或分层。 优选的方法包括以下步骤：i）形成包含陶瓷粉末，玻璃粉末，中空玻璃球和多孔玻璃粉末的第一生坯作为主要成分，ii）在每个第一生坯上形成互连层， 以及iii）将所述第一生片与所述互连层层叠; 将信号层夹在含有陶瓷粉末和玻璃粉末的上下生片之间作为主要成分; 并且对夹层信号层进行烧成以形成多层玻璃陶瓷基板。

公开(公告)号：US5306702A

公开(公告)日：1994-04-26

申请号：US860505

申请日：1992-06-17

申请人： Atsushi Tanaka ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Atsushi Tanaka ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： C04B35/00 ,  C01G1/00 ,  C01G29/00 ,  C04B35/45 ,  C23C14/08 ,  C23C14/35 ,  C23C14/58 ,  H01L39/24 ,  B05D5/12 ,  C23C14/00

CPC分类号： C23C14/5806 ,  C23C14/087 ,  C23C14/58 ,  C23C14/5853 ,  H01L39/2451 ,  Y10S505/728 ,  Y10S505/73 ,  Y10S505/731 ,  Y10S505/742

摘要： A process for producing a Bi-based perovskite superconducting film, comprising the steps of forming on a substrate a Pb-film, containing Bi-base material film comprising Bi, Pb, Sr, Ca and Cu in a Bi:Pb:Sr:Ca:Cu molar ratio of (1.9 to 2.1):(1.2 to 2.2, preferably 1.5 to 1.8):2:(1.9 to 2.2):(3 to 3.5) and sintering the Pb-containing Bi-base material film in an oxygen-containing atmosphere. The sintering step includes a main sintering period of 20 to 120 minutes, in which the temperature is raised from a first temperature to a second temperature, with the second temperature being in a range of 850.degree. to 860.degree. C., and the temperature rise in the main sintering period of 20 to 120 minutes being from 3.degree. to 10.degree. C.

摘要翻译： PCT No.PCT / JP91 / 01423 Sec。 371日期：1992年6月17日 102（e）日期1992年6月17日PCT 1991年10月17日PCT公布。 出版物WO92 / 06923 日本1992年04月30日。一种Bi系钙钛矿超导膜的制造方法，其特征在于，在基板上形成含有Bi，Pb，Sr，Ca，Cu的Bi基材料膜的Pb膜， Bi：Pb：Sr：Ca：Cu的摩尔比为（1.9〜2.1）：1.2〜2.2，优选为1.5〜1.8）：2：（1.9〜2.2）:( 3〜3.5） 在含氧气氛中的基材膜。 烧结步骤包括20〜120分钟的主烧结期间，其中温度从第一温度升至第二温度，第二温度在850℃至860℃的范围内，温度升高 在20〜120分钟的主烧结时间为3〜10℃。