公开(公告)号：US20120049876A1

公开(公告)日：2012-03-01

申请号：US13212585

申请日：2011-08-18

申请人： Shigeru MATSUMURA ,  Kohei KATO ,  Katsushi SUGAI ,  Koichi SHIROYAMA ,  Mitsutoshi HIGASHI ,  Akinori SHIRAISHI ,  Hideaki SAKAGUCHI

发明人： Shigeru MATSUMURA ,  Kohei KATO ,  Katsushi SUGAI ,  Koichi SHIROYAMA ,  Mitsutoshi HIGASHI ,  Akinori SHIRAISHI ,  Hideaki SAKAGUCHI

IPC分类号： G01R31/00 ,  G01R31/26 ,  G01R1/067 ,  G01R31/20

CPC分类号： G01R1/07307

摘要： [Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability.[Means for solving the Problems] A test-use individual substrate 30 which is used for testing a semiconductor wafer, comprises a main body portion 31, thin portions 321, 322 extending from the main body portion 31 and being relatively thinner than the main body portion, and bumps 33 provided on the thin portions 321, 322. [Selected Drawing] FIG. 4

摘要翻译： [待解决的问题]提供能够提高测试精度和连接可靠性的测试用单体基板。 解决问题的手段用于测试半导体晶片的测试用单独基板30包括主体部分31，从主体部分31延伸的薄部分321,322并且比主体部分相对薄 部分和设置在薄部321,322上的凸块33。 4

公开(公告)号：US20120325529A1

公开(公告)日：2012-12-27

申请号：US13606747

申请日：2012-09-07

申请人： Hideaki SAKAGUCHI ,  Akinori SHIRAISHI ,  Mitsutoshi HIGASHI

发明人： Hideaki SAKAGUCHI ,  Akinori SHIRAISHI ,  Mitsutoshi HIGASHI

IPC分类号： H05K1/03

CPC分类号： H05K3/4647 ,  G01R1/07307 ,  G01R3/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/423 ,  H05K3/4608 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49155 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00 ,  H01L2224/0401

摘要： A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

摘要翻译： 布线基板包括在垂直方向上包括第一馈通导体部分的第一基板部分，设置在第一基板部分上的第二基板部分，并且在第二基板部分的相应部分的垂直方向上包括第二馈通导体部分 第一馈通导体部分和包括第一馈通导体部分和第二馈通导体部分的馈通电极。

公开(公告)号：US20120229157A1

公开(公告)日：2012-09-13

申请号：US13403227

申请日：2012-02-23

申请人： Akinori SHIRAISHI ,  Hideaki SAKAGUCHI ,  Mitsutoshi HIGASHI

发明人： Akinori SHIRAISHI ,  Hideaki SAKAGUCHI ,  Mitsutoshi HIGASHI

IPC分类号： G01R1/067 ,  H01R43/00

CPC分类号： G01R3/00 ,  G01R1/07378 ,  G01R31/2889 ,  Y10T29/49117

摘要： In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card.

摘要翻译： 在一个实施例中，提供探针卡。 探针卡包括：具有第一表面和与第一表面相对的第二表面的基底; 穿过所述基板形成并在所述第一表面和所述第二表面之间延伸的通孔; 形成在所述通孔中以延伸到所述第一表面的弹性构件; 形成在通孔中以延伸到第二表面的通孔; 所述弹性构件的表面上的与所述贯通电极电连接的第一迹线; 以及经由所述第一迹线在所述弹性构件上的接触凸块以电连接到所述第一迹线，其中当对所述DUT进行电测试时，所述接触凸块电连接到形成在DUT（待测器件）上的电极焊盘） 使用探针卡。

公开(公告)号：US20120128021A1

公开(公告)日：2012-05-24

申请号：US13286392

申请日：2011-11-01

申请人： Akinori SHIRAISHI ,  Mitsutoshi HIGASHI

发明人： Akinori SHIRAISHI ,  Mitsutoshi HIGASHI

IPC分类号： H01S5/022 ,  H01S5/026

CPC分类号： H01S5/4018 ,  H01S5/005 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02492 ,  H01S5/4031

摘要： A light emitting device includes a light emitting element mounting component, including a cubic package component formed of a silicon member covered with a insulating layer, and the package component including a bottom portion, a sidewall portion provided to stand upright on both ends of the bottom portion respectively, and a backwall portion provided to stand upright on an innermost part of the bottom portion, and the package component in which a cavity is provided in an inner side, and a light emitting element mounted on an inner side surface of the backwall portion of the package component, and including a light emitting surface on an upper end part, wherein a plurality of said light emitting element mounting components are stacked in a depth direction of the cavity to direct toward an identical direction.

摘要翻译： 发光装置包括发光元件安装部件，其包括由覆盖有绝缘层的硅部件形成的立方体封装部件，并且所述封装部件包括底部，侧壁部分设置成直立在底部的两端 以及设置成直立在底部的最内部的后壁部分和其中在内侧设置空腔的封装部件和安装在后壁部分的内侧表面上的发光元件 并且包括在上端部分上的发光表面，其中多个所述发光元件安装部件沿着所述空腔的深度方向堆叠以指向相同的方向。

公开(公告)号：US20090206861A1

公开(公告)日：2009-08-20

申请号：US12370072

申请日：2009-02-12

申请人： Akinori SHIRAISHI ,  Mitsutoshi HIGASHI ,  Kei MURAYAMA ,  Katsunori YAMAGISHI ,  Mitsuhiro AIZAWA

发明人： Akinori SHIRAISHI ,  Mitsutoshi HIGASHI ,  Kei MURAYAMA ,  Katsunori YAMAGISHI ,  Mitsuhiro AIZAWA

IPC分类号： G01R31/02

CPC分类号： G01R1/07342 ,  G01R1/06727

摘要： In a semiconductor inspecting device having a contact to be electrically connected to an electrode pad formed in a semiconductor device which is an object to be measured, and a substrate provided with the contact, the contact is provided obliquely to a main surface of the substrate.

摘要翻译： 在具有电连接到形成在作为被测量对象的半导体器件的电极焊盘的接触件的半导体检查装置中，以及设置有接触件的基板，该接触件倾斜地设置在基板的主表面上。

公开(公告)号：US20090020887A1

公开(公告)日：2009-01-22

申请号：US12174192

申请日：2008-07-16

申请人： Shigeru MIZUNO ,  Takashi KURIHARA ,  Akinori SHIRAISHI ,  Kei MURAYAMA ,  Mitsutoshi HIGASHI

发明人： Shigeru MIZUNO ,  Takashi KURIHARA ,  Akinori SHIRAISHI ,  Kei MURAYAMA ,  Mitsutoshi HIGASHI

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L25/0657 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/82 ,  H01L24/85 ,  H01L2224/24145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/76152 ,  H01L2224/78 ,  H01L2224/85001 ,  H01L2225/06551 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/4554

摘要： In a semiconductor apparatus in which plural semiconductor elements are stacked, metal wires whose one ends are connected to electrode terminals of the semiconductor elements are extended to the side surfaces of the semiconductor elements in an abutment state and the metal wires extended to the side surfaces of the semiconductor elements are bonded to a side surface wiring formed on side surfaces of the semiconductor elements by a conductive paste containing conductive particles.

摘要翻译： 在层叠多个半导体元件的半导体装置中，一端与半导体元件的电极端子连接的金属线以邻接状态延伸到半导体元件的侧面，金属线延伸到 半导体元件通过含有导电性粒子的导电性糊料与半导体元件的侧面形成的侧面配线接合。

公开(公告)号：US20090023247A1

公开(公告)日：2009-01-22

申请号：US12175650

申请日：2008-07-18

申请人： Shigeru MIZUNO ,  Takashi KURIHARA ,  Akinori SHIRAISHI ,  Kei MURAYAMA ,  Mitsutoshi HIGASHI

发明人： Shigeru MIZUNO ,  Takashi KURIHARA ,  Akinori SHIRAISHI ,  Kei MURAYAMA ,  Mitsutoshi HIGASHI

IPC分类号： H01L21/60

CPC分类号： H01L24/85 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/76152 ,  H01L2224/78 ,  H01L2224/85001 ,  H01L2225/06551 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/4554

摘要： After plural semiconductor elements are stacked to form a stacked body P, side wirings are formed on the side surface of the stacked body P, thereby manufacturing a semiconductor apparatus in which the respective semiconductor elements are electrically connected to one another. In this case, as the semiconductor element, a semiconductor element 10 is employed in which a gold wire 16 with its one end connected to an electrode terminal of the semiconductor element is extended out to the side surface. A conductive paste 36 containing conductive particles applied over a predetermined length of a transferring wire 30 is transferred to the side surface of the stacked body P so that the gold wires 16 extended out to the side surfaces of the semiconductor elements 10, 10, 10 are connected, thereby forming the side wirings.

摘要翻译： 在堆叠多个半导体元件以形成堆叠体P之后，在层叠体P的侧表面上形成侧布线，从而制造其中各个半导体元件彼此电连接的半导体器件。 在这种情况下，作为半导体元件，采用半导体元件10，其一端与半导体元件的电极端子连接的金线16延伸到侧面。 包含施加在传输线30的预定长度上的导电颗粒的导电膏36被转移到层叠体P的侧表面，使得延伸到半导体元件10,10,10的侧表面的金线16 连接，从而形成侧面布线。

公开(公告)号：US20080251287A1

公开(公告)日：2008-10-16

申请号：US12061203

申请日：2008-04-02

申请人： Akinori SHIRAISHI ,  Kei Murayama ,  Masahiro Sunohara ,  Naoyuki Koizumi ,  Mitsutoshi Higashi

发明人： Akinori SHIRAISHI ,  Kei Murayama ,  Masahiro Sunohara ,  Naoyuki Koizumi ,  Mitsutoshi Higashi

IPC分类号： H05K3/42 ,  H05K1/11

CPC分类号： H05K1/116 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1147 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

摘要： A substrate includes a storage portion which is defined by a base for mounting a light emitting element and a wall portion standing up on and from the base. A package is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion is connected to a cover to thereby seal a light emitting element. A seal structure is composed of an uneven portion formed on the lower surface side surface of the base, a close contact layer formed on the surface of the uneven portion, a power supply layer formed on the close contact layer, and an electrode layer formed on the surface of the power supply layer. The uneven portion includes a first recessed portion formed at a position spaced in the radial direction from the outer periphery of a through electrode or from the inner wall of a through hole, and a second recessed portion formed at a position spaced further outwardly from the first recessed portion.

摘要翻译： 基板包括由用于安装发光元件的基座和竖立在基座上的壁部分限定的存储部分。 包装被构造成使得形成为围绕存储部分的周边的壁部分的上端连接到盖子上，从而密封发光元件。 密封结构由形成在基底的下表面侧的不平坦部分，形成在不平坦部分的表面上的紧密接触层，形成在紧密接触层上的电源层和形成在电极层上的电极层 电源层的表面。 不平坦部分包括形成在与通孔的外周沿径向间隔开的位置或从通孔的内壁隔开的位置处的第一凹部，以及形成在与第一凹部进一步向外间隔开的位置的第二凹部 凹陷部分。

公开(公告)号：US20090020889A1

公开(公告)日：2009-01-22

申请号：US12175689

申请日：2008-07-18

申请人： Kei MURAYAMA ,  Shigeru MIZUNO ,  Takashi KURIHARA ,  Akinori SHIRAISHI ,  Misutoshi HIGASHI

发明人： Kei MURAYAMA ,  Shigeru MIZUNO ,  Takashi KURIHARA ,  Akinori SHIRAISHI ,  Misutoshi HIGASHI

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L29/0657 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/82 ,  H01L24/85 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/76152 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85181 ,  H01L2225/06551 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A plurality of quadrilateral-shaped semiconductor elements are stacked on the one surface of a circuit substrate. A side surface wiring for making electrical connection between each of the electrode terminals of the semiconductor elements and a pad formed on the circuit substrate is formed by applying a conductive paste containing conductive particles. A metal wire whose one end is connected to the electrode terminal is extended along a tapered surface formed by cutting off an edge of the electrode terminal surface on which the electrode terminal is formed among edges formed along each of the sides of the semiconductor element. At least a part of the metal wire extended from each of the electrode terminals of the semiconductor elements to the tapered surface is electrically connected to the side surface wiring.

摘要翻译： 多个四边形半导体元件堆叠在电路基板的一个表面上。 通过涂布含有导电性粒子的导电性糊料，形成用于在半导体元件的各电极端子与电路基板上形成的焊盘之间进行电连接的侧面配线。 其一端连接到电极端子的金属线沿着沿着半导体元件的每一侧形成的边缘之间切割形成有电极端子的电极端子表面的边缘的锥形表面延伸。 从半导体元件的每个电极端子延伸到锥形表面的金属线的至少一部分电连接到侧面布线。

公开(公告)号：US20110150405A1

公开(公告)日：2011-06-23

申请号：US12969832

申请日：2010-12-16

申请人： Akinori SHIRAISHI ,  Yuichi Taguchi

发明人： Akinori SHIRAISHI ,  Yuichi Taguchi

IPC分类号： G02B6/02 ,  B29D11/00

CPC分类号： B29D11/00663 ,  G02B6/43

摘要： A method for manufacturing an optical waveguide which includes a core configured to transmit an optical signal, and a mirror portion configured to reflect the optical signal, the method includes: forming a mask layer patterned in a predetermined shape, on a first crystal plane of a substrate made of a crystalline material; etching the first crystal plane by a wet-etching using the mask layer to form a groove having a plurality of crystal planes; providing a metallic reflection film on at least one of the plurality of crystal planes to form the mirror portion; and providing the groove with a core material to form the core.

摘要翻译： 一种制造光波导的方法，该光波导包括被配置为透射光信号的芯体和被配置为反射光信号的反射镜部分，所述方法包括：形成图案化为预定形状的掩模层， 由结晶材料制成的基材; 通过使用掩模层的湿蚀刻蚀刻第一晶体面以形成具有多个晶面的凹槽; 在所述多个晶面中的至少一个上提供金属反射膜以形成所述镜部分; 以及为所述槽提供芯材以形成所述芯。