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公开(公告)号：US20120325529A1
公开(公告)日：2012-12-27
申请号：US13606747
申请日：2012-09-07
IPC分类号： H05K1/03
CPC分类号： H05K3/4647 , G01R1/07307 , G01R3/00 , H01L21/486 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K3/423 , H05K3/4608 , H05K2201/10674 , H05K2203/063 , H05K2203/0733 , Y10T29/49155 , Y10T428/24917 , Y10T428/24926 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.
摘要翻译： 布线基板包括在垂直方向上包括第一馈通导体部分的第一基板部分，设置在第一基板部分上的第二基板部分，并且在第二基板部分的相应部分的垂直方向上包括第二馈通导体部分 第一馈通导体部分和包括第一馈通导体部分和第二馈通导体部分的馈通电极。
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公开(公告)号：US20120229157A1
公开(公告)日：2012-09-13
申请号：US13403227
申请日：2012-02-23
CPC分类号： G01R3/00 , G01R1/07378 , G01R31/2889 , Y10T29/49117
摘要： In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card.
摘要翻译： 在一个实施例中，提供探针卡。 探针卡包括：具有第一表面和与第一表面相对的第二表面的基底; 穿过所述基板形成并在所述第一表面和所述第二表面之间延伸的通孔; 形成在所述通孔中以延伸到所述第一表面的弹性构件; 形成在通孔中以延伸到第二表面的通孔; 所述弹性构件的表面上的与所述贯通电极电连接的第一迹线; 以及经由所述第一迹线在所述弹性构件上的接触凸块以电连接到所述第一迹线，其中当对所述DUT进行电测试时，所述接触凸块电连接到形成在DUT（待测器件）上的电极焊盘） 使用探针卡。
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3.发明申请TEST-USE INDIVIDUAL SUBSTRATE, PROBE, AND SEMICONDUCTOR WAFER TESTING APPARATUS 有权测试使用个体基板，探头和半导体测试仪器公开(公告)号：US20120049876A1
公开(公告)日：2012-03-01
申请号：US13212585
申请日：2011-08-18
申请人： Shigeru MATSUMURA , Kohei KATO , Katsushi SUGAI , Koichi SHIROYAMA , Mitsutoshi HIGASHI , Akinori SHIRAISHI , Hideaki SAKAGUCHI
发明人： Shigeru MATSUMURA , Kohei KATO , Katsushi SUGAI , Koichi SHIROYAMA , Mitsutoshi HIGASHI , Akinori SHIRAISHI , Hideaki SAKAGUCHI
CPC分类号： G01R1/07307
摘要： [Problems to be solved] To provide a test-use individual substrate capable of improving testing accuracy and connecting reliability.[Means for solving the Problems] A test-use individual substrate 30 which is used for testing a semiconductor wafer, comprises a main body portion 31, thin portions 321, 322 extending from the main body portion 31 and being relatively thinner than the main body portion, and bumps 33 provided on the thin portions 321, 322. [Selected Drawing] FIG. 4
摘要翻译： [待解决的问题]提供能够提高测试精度和连接可靠性的测试用单体基板。 解决问题的手段用于测试半导体晶片的测试用单独基板30包括主体部分31，从主体部分31延伸的薄部分321,322并且比主体部分相对薄 部分和设置在薄部321,322上的凸块33。 4
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公开(公告)号：US20120128021A1
公开(公告)日：2012-05-24
申请号：US13286392
申请日：2011-11-01
CPC分类号： H01S5/4018 , H01S5/005 , H01S5/02252 , H01S5/02272 , H01S5/02276 , H01S5/02492 , H01S5/4031
摘要： A light emitting device includes a light emitting element mounting component, including a cubic package component formed of a silicon member covered with a insulating layer, and the package component including a bottom portion, a sidewall portion provided to stand upright on both ends of the bottom portion respectively, and a backwall portion provided to stand upright on an innermost part of the bottom portion, and the package component in which a cavity is provided in an inner side, and a light emitting element mounted on an inner side surface of the backwall portion of the package component, and including a light emitting surface on an upper end part, wherein a plurality of said light emitting element mounting components are stacked in a depth direction of the cavity to direct toward an identical direction.
摘要翻译： 发光装置包括发光元件安装部件，其包括由覆盖有绝缘层的硅部件形成的立方体封装部件，并且所述封装部件包括底部，侧壁部分设置成直立在底部的两端 以及设置成直立在底部的最内部的后壁部分和其中在内侧设置空腔的封装部件和安装在后壁部分的内侧表面上的发光元件 并且包括在上端部分上的发光表面，其中多个所述发光元件安装部件沿着所述空腔的深度方向堆叠以指向相同的方向。
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公开(公告)号：US20090023247A1
公开(公告)日：2009-01-22
申请号：US12175650
申请日：2008-07-18
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , H01L21/6835 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/82 , H01L25/0657 , H01L2224/24145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/48471 , H01L2224/76152 , H01L2224/78 , H01L2224/85001 , H01L2225/06551 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/30105 , H01L2924/00 , H01L2224/4554
摘要： After plural semiconductor elements are stacked to form a stacked body P, side wirings are formed on the side surface of the stacked body P, thereby manufacturing a semiconductor apparatus in which the respective semiconductor elements are electrically connected to one another. In this case, as the semiconductor element, a semiconductor element 10 is employed in which a gold wire 16 with its one end connected to an electrode terminal of the semiconductor element is extended out to the side surface. A conductive paste 36 containing conductive particles applied over a predetermined length of a transferring wire 30 is transferred to the side surface of the stacked body P so that the gold wires 16 extended out to the side surfaces of the semiconductor elements 10, 10, 10 are connected, thereby forming the side wirings.
摘要翻译： 在堆叠多个半导体元件以形成堆叠体P之后，在层叠体P的侧表面上形成侧布线，从而制造其中各个半导体元件彼此电连接的半导体器件。 在这种情况下，作为半导体元件，采用半导体元件10，其一端与半导体元件的电极端子连接的金线16延伸到侧面。 包含施加在传输线30的预定长度上的导电颗粒的导电膏36被转移到层叠体P的侧表面，使得延伸到半导体元件10,10,10的侧表面的金线16 连接，从而形成侧面布线。
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公开(公告)号：US20100321936A1
公开(公告)日：2010-12-23
申请号：US12851722
申请日：2010-08-06
CPC分类号： F21V11/16 , F21K9/00 , F21Y2115/10 , H01L33/58 , H01L33/60 , H01L2224/16225 , H01L2924/16195
摘要： It is a lighting apparatus 10 that has a light emitting element 16, a light emitting element housing 15 having a concave portion 28 that accommodates the light emitting element 16, and an optically transparent member 18 that airproofs a space B formed by the concave portion 28 and transmits light emitted from the light emitting element 16. The concave portion 28 is shaped to become wider toward the optically transparent member 18 from the bottom surface 28A of the concave portion 28. The lighting apparatus 10 is provided with a light shielding member 12 for shielding a part of light emitted from the light emitting element 16 is provided on the optically transparent member 18.
摘要翻译： 它是具有发光元件16，具有容纳发光元件16的凹部28的发光元件壳体15的照明装置10以及对由凹部28形成的空间B进行空气隔绝的光学透明构件18 并且透射从发光元件16发射的光。凹部28从凹部28的底面28A朝向光学透明构件18变宽。照明装置10设置有遮光构件12， 屏蔽从发光元件16发射的光的一部分设置在光学透明构件18上。
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公开(公告)号：US20090206861A1
公开(公告)日：2009-08-20
申请号：US12370072
申请日：2009-02-12
IPC分类号： G01R31/02
CPC分类号： G01R1/07342 , G01R1/06727
摘要： In a semiconductor inspecting device having a contact to be electrically connected to an electrode pad formed in a semiconductor device which is an object to be measured, and a substrate provided with the contact, the contact is provided obliquely to a main surface of the substrate.
摘要翻译： 在具有电连接到形成在作为被测量对象的半导体器件的电极焊盘的接触件的半导体检查装置中，以及设置有接触件的基板，该接触件倾斜地设置在基板的主表面上。
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公开(公告)号：US20090020887A1
公开(公告)日：2009-01-22
申请号：US12174192
申请日：2008-07-16
CPC分类号： H01L25/0657 , H01L21/6835 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/82 , H01L24/85 , H01L2224/24145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/48471 , H01L2224/76152 , H01L2224/78 , H01L2224/85001 , H01L2225/06551 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/30105 , H01L2924/00 , H01L2224/4554
摘要： In a semiconductor apparatus in which plural semiconductor elements are stacked, metal wires whose one ends are connected to electrode terminals of the semiconductor elements are extended to the side surfaces of the semiconductor elements in an abutment state and the metal wires extended to the side surfaces of the semiconductor elements are bonded to a side surface wiring formed on side surfaces of the semiconductor elements by a conductive paste containing conductive particles.
摘要翻译： 在层叠多个半导体元件的半导体装置中，一端与半导体元件的电极端子连接的金属线以邻接状态延伸到半导体元件的侧面，金属线延伸到 半导体元件通过含有导电性粒子的导电性糊料与半导体元件的侧面形成的侧面配线接合。
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公开(公告)号：US20090130838A1
公开(公告)日：2009-05-21
申请号：US12271228
申请日：2008-11-14
IPC分类号： H01L21/44
CPC分类号： H05K3/3478 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/03828 , H01L2224/05001 , H01L2224/05009 , H01L2224/05567 , H01L2224/0557 , H01L2224/11002 , H01L2224/11003 , H01L2224/111 , H01L2224/11334 , H01L2224/11822 , H01L2224/11901 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/81011 , H01L2224/81193 , H01L2224/81801 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H05K2201/10234 , H05K2203/041 , H05K2203/043 , H05K2203/1476 , H01L2224/05599 , H01L2224/05099
摘要： A method of forming a conductive bump of the present invention, includes the steps of, preparing a substrate including a connection pad and a protection insulating layer, in which an opening portion is provided on the connection pad, on a surface layer side, arranging a first conductive ball, at least an outer surface portion of which is made of solder, on the connection pad in the opening portion of the protection insulating layer, filling a solder layer in the opening portion by applying a reflow heating to the first conductive ball, arranging a second conductive ball on the solder layer, and obtaining a conductive bump which protrudes from an upper surface of the protection insulating layer, by joining the solder layer and the second conductive ball by a reflow heating.
摘要翻译： 一种形成本发明的导电凸块的方法包括以下步骤：在表面层一侧制备包括连接焊盘和保护绝缘层的基板，其中开口部分设置在连接焊盘上， 在保护绝缘层的开口部分的连接焊盘上的至少其外表面部分由焊料制成的第一导电球，通过向第一导电球施加回流加热来填充开口部分中的焊料层， 在焊料层上布置第二导电球，并且通过回流加热来接合焊料层和第二导电球，获得从保护绝缘层的上表面突出的导电凸块。
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10.发明申请METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权制造接线基板的方法及制造半导体器件的方法公开(公告)号：US20090236024A1
公开(公告)日：2009-09-24
申请号：US12403456
申请日：2009-03-13
CPC分类号： H05K3/242 , H01L21/4846 , H01L21/4857 , H01L21/6835 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H05K3/007 , H05K3/108 , H05K3/243 , H05K3/4682 , H05K2201/09036 , H05K2201/09563 , H05K2201/10674 , H05K2201/2009 , H05K2203/016 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49993 , Y10T156/10
摘要： A method of manufacturing a wiring substrate is disclosed. The method includes: (a) preparing a supporting substrate including a main body and a through electrode penetrating the main body, wherein the supporting substrate includes a first surface and a second surface opposite to the first surface, and a trace is formed on the second surface of the supporting substrate; (b) forming a build-up wiring structure by alternately forming a wiring layer and an insulating layer on the first surface of the supporting substrate; and (c) obtaining a wiring substrate by separating the build-up wiring structure from the supporting substrate. Step (b) includes: forming the wiring layer using the through electrode as a power feeding wiring, and step (c) includes: peeling the build-up wiring structure from the supporting substrate to obtain the wiring substrate.
摘要翻译： 公开了一种制造布线基板的方法。 该方法包括：（a）制备包括主体和穿透主体的穿透电极的支撑基板，其中支撑基板包括第一表面和与第一表面相对的第二表面，并且在第二表面上形成迹线 支撑基板的表面; （b）通过在支撑基板的第一表面上交替地形成布线层和绝缘层来形成堆积布线结构; 和（c）通过将积层布线结构与支撑衬底分离来获得布线衬底。 步骤（b）包括：使用贯通电极形成布线层作为馈电布线，步骤（c）包括：从支撑基板剥离积聚布线结构以获得布线基板。
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